Mary Drummond Roby

US Patent:

6362638, Mar 26, 2002

Filed:

Sep 1, 1999

Appl. No.:

09/388203

Inventors:

Robert Alan Ashton - Orlando FL
Steven Alan Lytle - Orlando FL
Mary Drummond Roby - Orlando FL
Daniel Joseph Vitkavage - Orlando FL

Assignee:

Agere Systems Guardian Corp. - Orlando FL

International Classification:

G01R 3126

US Classification:

324755, 3241581

Abstract:

A method and apparatus for measuring Kelvin contact resistance within an integrated circuit interconnect is provided, having upper and lower Kelvin contact resistance contacts covering a via and interconnect being measured, along with a third conductor placed substantially between the upper and lower Kelvin contacts, and in contact with the via.

US Patent:

6555910, Apr 29, 2003

Filed:

Aug 29, 2000

Appl. No.:

09/651661

Inventors:

Robert A. Ashton - Orlando FL
Steven A. Lytle - Orlando FL
Mary D. Roby - Orlando FL
Morgan J. Thoma - Orlando FL
Daniel J. Vitkavage - Winter Garden FL

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

H01L 2348

US Classification:

257752, 257758, 257773

Abstract:

The present invention provides a semiconductor device and method of manufacture thereof that provides improved dielectric thickness control. The semiconductor device includes a metal feature located on a semiconductor substrate, wherein the metal feature has openings formed therein, or depending on the device, therethrough. The semiconductor device further includes a fluorinated dielectric layer located over the metal feature and within the openings. Thus, the inclusion of openings within the metal feature allows for a substantially planar surface of the fluorinated dielectric layer.

US Patent:

6973637, Dec 6, 2005

Filed:

May 12, 2003

Appl. No.:

10/435870

Inventors:

John M. Sharpe - Allentown PA, US
Jerome Chu - Allentown PA, US
Matthew Moucheron - Allentown PA, US
Mary Roby - Plano TX, US

Assignee:

Agere Systems Inc. - Allentown PA

International Classification:

G06F017/50

US Classification:

716 21, 716 19

Abstract:

The present invention provides a non-global process for designing an integrated circuit layout. The process comprises locating an isolated layout feature of an integrated circuit layout and non-globally changing at least one lateral dimension of the isolated layout feature to obtain an optimized increment. The change in lateral dimension by the optimized increment does not violate a minimum separation distance between the isolated layout feature and the other adjacent layout features. The process may be incorporated into a system for non-globally modifying an integrated circuit layout, described in a data file or an integrated circuit design system.

US Patent:

7401875, Jul 22, 2008

Filed:

Jul 9, 2004

Appl. No.:

10/888407

Inventors:

Stuart M. Jacobsen - Frisco TX, US
Mary Roby - Plano TX, US
Erika Shoemaker - Richardson TX, US
Maria Wang - Plano TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

B41J 29/38

US Classification:

347 14, 347 56, 347 58

Abstract:

A thermal inkjet printhead of the present invention includes a heating element , an ink chamber, control circuitry , an ink reservoir, and a memory array. The control circuitry causes the heating element to generate thermal energy thereby causing ink within the ink chamber to generate bubbles of ink, which are then expelled through a nozzle. The ink reservoir replenishes used ink in the ink chamber. The memory array stores and provides the identification parameters for the thermal inkjet printhead. The identification parameters are typically provided during initialization of the printer and include color(s) of ink (e. g. , black, green, red, blue), a number of nozzles on the thermal inkjet printhead, an addressing frequency, nozzle spacing, heating architecture, and the like. The identification parameters can include other information such as a unique serial identification number for the thermal inkjet printhead, manufacturer serial number, lot number, date of manufacture, compatible printers, ink capacity, ink remaining, re-ordering information for replacement ink cartridges, and the like.

US Patent:

7795070, Sep 14, 2010

Filed:

Mar 30, 2007

Appl. No.:

11/693833

Inventors:

Maria Wang - Plano TX, US
Erika Leigh Shoemaker - Richardson TX, US
Mary Roby - Plano TX, US
Stuart Jacobsen - Frisco TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

H01L 27/07
H01L 21/04

US Classification:

438105, 438237, 438238, 257528, 257E27033, 257E21041, 257E21051, 257E21053

Abstract:

Provided is a method for manufacturing a semiconductor device. The method for manufacturing the semiconductor device, without limitation, includes forming a first semiconductor layer over a substrate, and forming a second semiconductor layer over the first semiconductor layer, wherein an amorphous nitrided silicon adhesion layer is located between and adheres the first and second semiconductor layers.

US Patent:

8409458, Apr 2, 2013

Filed:

Mar 2, 2007

Appl. No.:

11/681483

Inventors:

Erika Leigh Shoemaker - Richardson TX, US
Maria Wang - Plano TX, US
Mary Roby - Plano TX, US
Stuart Jacobsen - Frisco TX, US

Assignee:

Texas Instruments Incorporated - Dallas TX

International Classification:

C03C 15/00

US Classification:

216 66, 216 74, 216 81

Abstract:

Provided is a process for manufacturing a diamond like carbon layer. The process for manufacturing the diamond like carbon layer includes, without limitation, forming a layer of diamond like carbon over a substrate, and reactive ion etching the layer of diamond like carbon.

US Patent:

20030218259, Nov 27, 2003

Filed:

May 21, 2002

Appl. No.:

10/153163

Inventors:

Daniel Chesire - Orlando FL, US
Gerard Zaneski - Orlando FL, US
Mary Roby - Orlando FL, US
Daniel Vitkavage - Winter Garden FL, US
Scott Jessen - Orlando FL, US

International Classification:

H01L023/053
H01L023/12
H01L023/48
H01L023/52
H01L029/40

US Classification:

257/786000, 257/758000, 257/700000, 257/701000

Abstract:

A bond pad support structure for a semiconductor device comprises at least two metal layers subjacent an uppermost passivation layer on the device. An opening through the passivation layer exposes a top surface of a top metal layer. A metal feature is formed in an insulating layer, disposed between the two metal layers, and divides the insulating layer into a plurality of discrete sections. The metal feature includes a plurality of intersecting metal-filled recesses that interconnect the two metal layers. At least a portion of the metal feature is disposed within a cross-sectional area defined as a perimeter of a periphery of the opening.

US Patent:

20060274124, Dec 7, 2006

Filed:

Jul 27, 2006

Appl. No.:

11/460267

Inventors:

Stuart Jacobsen - Frisco TX, US
Mary Roby - Plano TX, US
Erika Shoemaker - Richardson TX, US
Maria Wang - Plano TX, US

Assignee:

TEXAS INSTRUMENTS INCORPORATED - Dallas TX

International Classification:

B41J 2/05

US Classification:

347061000

Abstract:

A thermal inkjet printhead of the present invention includes a heating element , an ink chamber, control circuitry , an ink reservoir, and a memory array . The control circuitry causes the heating element to generate thermal energy thereby causing ink within the ink chamber to generate bubbles of ink, which are then expelled through a nozzle. The ink reservoir replenishes used ink in the ink chamber. The memory array stores and provides the identification parameters for the thermal inkjet printhead . The identification parameters are typically provided during initialization of the printer and include color(s) of ink (e.g., black, green, red, blue), a number of nozzles on the thermal inkjet printhead, an addressing frequency, nozzle spacing, heating architecture, and the like. The identification parameters can include other information such as a unique serial identification number for the thermal inkjet printhead, manufacturer serial number, lot number, date of manufacture, compatible printers, ink capacity, ink remaining, re-ordering information for replacement ink cartridges, and the like.