Richard W. Pekala - Corvallis OR Mehrgan Khavari - Corvallis OR
Assignee:
Amtek Research International LLC - Lebanon OR
International Classification:
H01M 216
US Classification:
429249, 429247, 429248, 429250
Abstract:
A freestanding battery separator includes a microporous polymer web with passageways that provide overall fluid permeability. The polymer web preferably contains UHMWPE and a gel-forming polymer material. The structure of or the pattern formed by the gel-forming polymer material and wettability of the UHMWPE polymer web result in a reduction of the time required to achieve uniform electrolyte distribution throughout the lithium-ion battery. In a first embodiment, the gel-forming polymer material is a coating on the UHMWPE web surface. In a second embodiment, the gel-forming polymer material is incorporated into the UHMWPE web while retaining overall fluid permeability. Both embodiments produce hybrid gel electrolyte systems in which gel and liquid electrolyte co-exist.
Methods And Systems For Forming Slots In A Substrate
Michael D. Miller - Pnilomath OR, US Michael Hager - Corvalis OR, US Naoto A. Kawamura - Corvallis OR, US Ronald L. Enck - Corvallis OR, US Susanne L. Kumpf - Corvallis OR, US Shen Buswell - Monmouth OR, US Mehrgan Khavari - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
H01L021/00 B41J002/04
US Classification:
216 17, 216 27, 216 58, 216 65, 216 67, 21916169
Abstract:
The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.
Slotted Substrates And Methods And Systems For Forming Same
Rio T. Rivas - Corvallis OR, US Shen Buswell - Monmouth OR, US Mehrgan Khavari - Corvallis OR, US Jeffrey R. Pollard - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B23K026/36
US Classification:
21912169
Abstract:
Methods and systems for forming slots in a substrate that has opposing first and second surfaces. The method makes a laser cut through either the first or second surface of the substrate sufficient to form a first trench. Material is also removed through the other of the first and second surfaces effective to form, in combination with the laser cut, a slot. At least a portion of the slot passes entirely through the substrate, and the slot has an aspect ratio greater than or equal to 1.
Jong-Souk Yeo - Corvallis OR, US Mark Huth - Corvallis OR, US Mehrgan Khavari - Corvallis OR, US Alexey S Kabalnov - Corvallis OR, US Craig M. Gates - Corvallis OR, US Sean P Mcclelland - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
G01D 15/00 G11B 5/127
US Classification:
216 27
Abstract:
The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.
Charles Otis - Corvallis OR, US Mehrgan Khavari - Corvallis OR, US Jeffrey R. Pollard - Corvallis OR, US Mark C. Huth - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B23K 26/14
US Classification:
21912184
Abstract:
The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said forming, the method includes supplying liquid to at least a first region of the feature along a first liquid supply path and supplying liquid to at least a second different region of the feature along at least a second liquid supply path.
Jong-Souk Yeo - Corvallis OR, US Mark Huth - Corvallis OR, US Mehrgan Khavari - Corvallis OR, US Alexey S Kabalnov - Corvallis OR, US Craig M. Gates - Corvallis OR, US Sean P Mcclelland - Corvallis OR, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
B41J 2/05
US Classification:
347 65, 347 20, 347 56
Abstract:
The described embodiments relate to slotted substrates. One exemplary method forms a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said directing, the method supplies a conductive material proximate the substrate.