Meral B Woodberry

US Patent:

6885203, Apr 26, 2005

Filed:

Mar 16, 2000

Appl. No.:

09/526955

Inventors:

Meral Bradley Woodberry - Ridgefield WA, US

Assignee:

Sharp Laboratories of America, Inc. - Camas WA

International Classification:

G01R031/02

US Classification:

324754, 324752

Abstract:

An apparatus comprises multiple light sources that are applied to specific locations on the surface of a wafer for the purpose of causing a component on a die to respond as if a digital signal had been applied to the component. The multiple light sources may comprise several thousand point light sources such as the individual fibers of a fiber optic bundle. The light is controlled in such a manner to stimulate operation of the electronic circuit for the purpose of burning in the circuit.

US Patent:

55525636, Sep 3, 1996

Filed:

Mar 17, 1995

Appl. No.:

8/407385

Inventors:

Jeff E. Conder - Vancouver WA
Meral B. Woodberry - Ridgefield WA

Assignee:

Sharp Microelectronics Technology, Inc. - Camas WA
Sharp Kabushiki - Osaka

International Classification:

H05K 900

US Classification:

174 35R

Abstract:

A modified lead frame is provided for use with electrical component test handlers. A conventional multiple-parallel-conductor lead frame is modified to include two broad, electrically conductive shields positioned on opposite sides of the lead frame. Each shield covers a major portion of one side of the lead frame. Such lead frames are designed for mounting in a predetermined orientation on a lead frame holder, with one side facing toward, and the other side facing away from, the major mass of the holder. The conductive shield positioned on the side facing away from the holder on the modified lead frame of the present invention is electrically coupled to one or more selected conductors on the lead frame. The one or more selected conductors include the power or ground conductor which supplies power to a test component during tests. The shield which faces toward the holder is electrically isolated from all the conductors on the lead frame by an intermediate insulating layer.