Michael V Carano

US Patent:

6375731, Apr 23, 2002

Filed:

Jan 6, 2000

Appl. No.:

09/478587

Inventors:

Michael V. Carano - Plymouth MN
Frank Polakovic - Plymouth MN

Assignee:

Electrochemicals Inc. - Maple Plain MN

International Classification:

C09D 500

US Classification:

10628735, 1061721, 1061901, 10628724

Abstract:

A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises a cationic conditioning agent and one of a binder or an anionic dispersant that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. (âThrough holesâ as used herein refers both to through holes and to vias. ).

US Patent:

6440331, Aug 27, 2002

Filed:

Jun 3, 1999

Appl. No.:

09/325072

Inventors:

Michael V. Carano - Plymouth MN
Frank Polakovic - Plymouth MN

Assignee:

Electrochemicals Inc. - Maple Plain MN

International Classification:

H01B 106

US Classification:

252506, 252503

Abstract:

A composition and method for applying an electrically conductive coating to an initially electrically nonconductive surface, such as a printed wiring board having through holes is disclosed. The method is carried out by applying a composition of electrically conductive carbon particles, a second conductive material, a water dispersible binding agent, and an aqueous dispersing medium to a nonconductive substrate to form a substantially continuous, electrically conductive coating. Enough of the carbon particles are present to provide an electrically conductive coating when the composition is applied to the substrate. Enough of the second conductive material is present to provide an improved electrically conductive coating when the composition is applied to the substrate. The resulting coating carbon coating has an improved conductivity over prior through hole coating compositions and processes and is capable of being exposed to molten solder without resulting in the formation of blowholes.

US Patent:

6454868, Sep 24, 2002

Filed:

Apr 17, 2000

Appl. No.:

09/550881

Inventors:

Frank Polakovic - Plymouth MN
William Yang - Chungli, TW
Charles Edwin Thorn - Newport KY
Michael Val Carano - Plymouth MN
Beth Ann LaFayette - Minneapolis MN

Assignee:

Electrochemicals Inc. - Maple Plain MN

International Classification:

C03C 2300

US Classification:

134 2, 134 28, 134 39, 134 41, 510175

Abstract:

A desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins or bis-maleimide triazine epoxy resins. The process involves contacting the resin smear with a mixture of gamma-butyrolactone and water to soften the resin smear, followed by treatment with an alkaline permanganate solution to remove the softened resin, and treatment with an aqueous acidic neutralizer to neutralize and remove the permanganate residues. The gamma-butyrolactone is effective as a single solvent for softening and swelling resin smears from substrates made from epoxy, polyimide, cyanate ester resins, bis-maleimide triazine epoxy resins, and polyimide resins.

US Patent:

6691912, Feb 17, 2004

Filed:

Mar 1, 2002

Appl. No.:

10/087051

Inventors:

Michael V. Carano - Plymouth MN
Frank Polakovic - Plymouth MN

Assignee:

Electrochemicals, Inc. - Maple Plains MN

International Classification:

B23K 3102

US Classification:

228256, 228206, 228209, 228214

Abstract:

A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises carbonates, binders, and resins, and combinations thereof, that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. (âThrough holesâ as used herein refers both to through holes and to vias. ).

US Patent:

60370203, Mar 14, 2000

Filed:

Jan 29, 1997

Appl. No.:

8/790294

Inventors:

Gregory Dean Garlough - Bloomington MN
Benjamin Todd Carroll - Brooklyn Park MN
Michael Val Carano - Plymouth MN
Frank Polakovic - Ringwood NJ

Assignee:

Electrochemicals Inc. - Maple Plain MN

International Classification:

B05D 512
B05B 100

US Classification:

427600

Abstract:

A method for treating a non-conductive through hole surface of a printed wiring board is disclosed. A printed wiring board including through holes is cleaned, conditioned, and a conductive coating is applied to the initially-nonconductive through hole by contacting it with a series of baths. The conductive coating, for example a graphite dispersion coating, facilitates later electroplating of the conductive surface. While at least partially immersing the through hole in one or more of these baths, ultrasonic energy is introduced in the bath in the vicinity of the through hole. The ultrasonic energy can be introduced during the entire immersing step, before the immersing step, or both. The ultrasonic energy reduces the formation of blowholes during later processing (and especially soldering) of the printed wiring board. The ultrasonic treatment can also improve the dispersion of the conductive particles in a conductive carbon dispersion, reduce or eliminate the formation of pinhole defects, and provide other advantages.

US Patent:

54925959, Feb 20, 1996

Filed:

Apr 11, 1994

Appl. No.:

8/226017

Inventors:

Michael V. Carano - Youngstown OH
Therese M. Harryhill - McDonald OH

Assignee:

Electrochemicals, Inc. - Maple Plain MN

International Classification:

B44C 122
C23F 100

US Classification:

216101

Abstract:

The present invention is directed to an improved method for treating an oxidized surface of a copper film for bonding to a resinous layer such as in the formation of a single-sided, double-sided, or multi-layered circuit board and to a layered product produced by the method. In particular, the method of the present invention comprises the steps of: contacting the oxidized surface of a copper film, having cupric oxide whiskers protruding therefrom, with an acidic reducing solution having a pH of 1 to 6. 5 and having an effective amount of a water soluble thiosulfate reducing agent dissolved therein to provide a reduced copper surface; and rinsing the reduced copper surface with an acidic solution to produce a rinsed and reduced copper surface having reduced whiskers protruding therefrom, said reduced whiskers each being a mix of cuprous oxide and metallic copper. Preferably, the reduced surface is treated with a passivating agent to minimize any reoxidation prior to laminate formation.

US Patent:

59850400, Nov 16, 1999

Filed:

Sep 21, 1998

Appl. No.:

9/157909

Inventors:

Michael V. Carano - Plymouth MN
Frank Polakovic - Plymouth MN
Beth Ann LaFayette - Minneapolis MN

Assignee:

Electrochemicals Inc. - Maple Plain MN

International Classification:

C03C 2300
C23G 102
C11D 904

US Classification:

134 2

Abstract:

An improved desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins. The process involves contacting the resin smear with a solvent solution to soften the resin smear, followed by treatment with an alkaline permanganate solution to remove the softened resin, and treatment with a neutralizer to neutralize and remove the permanganate residues. The solvent solution comprises a mixture of at least two solvent components, with at least one solvent component being selected from the group consisting of gamma-butyrolactone, ethyl-3-ethoxypropionate, N-ethyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-(2-hydroxyethyl)-2-pyrrolidone, and N-octyl-2-pyrrolidone. The solvent solution is selective for the softening and removal of epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins.