Michael V. Carano - Plymouth MN Frank Polakovic - Plymouth MN
Assignee:
Electrochemicals Inc. - Maple Plain MN
International Classification:
C09D 500
US Classification:
10628735, 1061721, 1061901, 10628724
Abstract:
A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises a cationic conditioning agent and one of a binder or an anionic dispersant that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. (âThrough holesâ as used herein refers both to through holes and to vias. ).
Aqueous Carbon Composition And Method For Coating A Non Conductive Substrate
Michael V. Carano - Plymouth MN Frank Polakovic - Plymouth MN
Assignee:
Electrochemicals Inc. - Maple Plain MN
International Classification:
H01B 106
US Classification:
252506, 252503
Abstract:
A composition and method for applying an electrically conductive coating to an initially electrically nonconductive surface, such as a printed wiring board having through holes is disclosed. The method is carried out by applying a composition of electrically conductive carbon particles, a second conductive material, a water dispersible binding agent, and an aqueous dispersing medium to a nonconductive substrate to form a substantially continuous, electrically conductive coating. Enough of the carbon particles are present to provide an electrically conductive coating when the composition is applied to the substrate. Enough of the second conductive material is present to provide an improved electrically conductive coating when the composition is applied to the substrate. The resulting coating carbon coating has an improved conductivity over prior through hole coating compositions and processes and is capable of being exposed to molten solder without resulting in the formation of blowholes.
Permanganate Desmear Process For Printed Wiring Boards
Frank Polakovic - Plymouth MN William Yang - Chungli, TW Charles Edwin Thorn - Newport KY Michael Val Carano - Plymouth MN Beth Ann LaFayette - Minneapolis MN
Assignee:
Electrochemicals Inc. - Maple Plain MN
International Classification:
C03C 2300
US Classification:
134 2, 134 28, 134 39, 134 41, 510175
Abstract:
A desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins or bis-maleimide triazine epoxy resins. The process involves contacting the resin smear with a mixture of gamma-butyrolactone and water to soften the resin smear, followed by treatment with an alkaline permanganate solution to remove the softened resin, and treatment with an aqueous acidic neutralizer to neutralize and remove the permanganate residues. The gamma-butyrolactone is effective as a single solvent for softening and swelling resin smears from substrates made from epoxy, polyimide, cyanate ester resins, bis-maleimide triazine epoxy resins, and polyimide resins.
Methods Of Avoiding Blowhole Formation By Conditioning Through Holes And Glass
Michael V. Carano - Plymouth MN Frank Polakovic - Plymouth MN
Assignee:
Electrochemicals, Inc. - Maple Plains MN
International Classification:
B23K 3102
US Classification:
228256, 228206, 228209, 228214
Abstract:
A composition and method for cleaning and conditioning a non-conductive surface defined by a through hole in a printed circuit board (PCB) is disclosed. The through hole surface is contacted with the composition of the invention to provide a cleaned and conditioned surface. The clean and conditioned surface is coated with conductive carbon particles (usually graphite) to provide a carbon-coated surface. The carbon-coated surface is electro plated and then soldered using hot solder. Those surfaces that have been soldered and also treated with the composition of the invention exhibit fewer blow hole problems. The composition of the invention comprises carbonates, binders, and resins, and combinations thereof, that improve the adhesion and coverage of a coating containing graphite to a surface defined by a through hole bore or other substrate. (âThrough holesâ as used herein refers both to through holes and to vias. ).
Ultrasonic Mixing Of Through Hole Treating Compositions
Gregory Dean Garlough - Bloomington MN Benjamin Todd Carroll - Brooklyn Park MN Michael Val Carano - Plymouth MN Frank Polakovic - Ringwood NJ
Assignee:
Electrochemicals Inc. - Maple Plain MN
International Classification:
B05D 512 B05B 100
US Classification:
427600
Abstract:
A method for treating a non-conductive through hole surface of a printed wiring board is disclosed. A printed wiring board including through holes is cleaned, conditioned, and a conductive coating is applied to the initially-nonconductive through hole by contacting it with a series of baths. The conductive coating, for example a graphite dispersion coating, facilitates later electroplating of the conductive surface. While at least partially immersing the through hole in one or more of these baths, ultrasonic energy is introduced in the bath in the vicinity of the through hole. The ultrasonic energy can be introduced during the entire immersing step, before the immersing step, or both. The ultrasonic energy reduces the formation of blowholes during later processing (and especially soldering) of the printed wiring board. The ultrasonic treatment can also improve the dispersion of the conductive particles in a conductive carbon dispersion, reduce or eliminate the formation of pinhole defects, and provide other advantages.
Michael V. Carano - Youngstown OH Therese M. Harryhill - McDonald OH
Assignee:
Electrochemicals, Inc. - Maple Plain MN
International Classification:
B44C 122 C23F 100
US Classification:
216101
Abstract:
The present invention is directed to an improved method for treating an oxidized surface of a copper film for bonding to a resinous layer such as in the formation of a single-sided, double-sided, or multi-layered circuit board and to a layered product produced by the method. In particular, the method of the present invention comprises the steps of: contacting the oxidized surface of a copper film, having cupric oxide whiskers protruding therefrom, with an acidic reducing solution having a pH of 1 to 6. 5 and having an effective amount of a water soluble thiosulfate reducing agent dissolved therein to provide a reduced copper surface; and rinsing the reduced copper surface with an acidic solution to produce a rinsed and reduced copper surface having reduced whiskers protruding therefrom, said reduced whiskers each being a mix of cuprous oxide and metallic copper. Preferably, the reduced surface is treated with a passivating agent to minimize any reoxidation prior to laminate formation.
Permanganate Desmear Process For Printed Wiring Boards
Michael V. Carano - Plymouth MN Frank Polakovic - Plymouth MN Beth Ann LaFayette - Minneapolis MN
Assignee:
Electrochemicals Inc. - Maple Plain MN
International Classification:
C03C 2300 C23G 102 C11D 904
US Classification:
134 2
Abstract:
An improved desmear process for removing resin smeared on an interior wall of a through hole drilled in a resinous substrate, especially resinous substrates made from epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins. The process involves contacting the resin smear with a solvent solution to soften the resin smear, followed by treatment with an alkaline permanganate solution to remove the softened resin, and treatment with a neutralizer to neutralize and remove the permanganate residues. The solvent solution comprises a mixture of at least two solvent components, with at least one solvent component being selected from the group consisting of gamma-butyrolactone, ethyl-3-ethoxypropionate, N-ethyl-2-pyrrolidone, N-cyclohexyl-2-pyrrolidone, N-(2-hydroxyethyl)-2-pyrrolidone, and N-octyl-2-pyrrolidone. The solvent solution is selective for the softening and removal of epoxy, polyimide, cyanate ester resins and bis-maleimide triazine epoxy resins.
Aug 2009 to 2000 Personal Care AttendantBooth Law Group LLC Minnetonka, MN May 2014 to Sep 2014 Law ClerkEqual Employment Opportunity Center Minneapolis, MN Jan 2014 to May 2014 Mediation ExternSchool Law Center LLC Saint Paul, MN May 2013 to Aug 2013 Law Clerk
Education:
John Carroll University University Heights, OH May 2012 Bachelor of Arts in MagnaHamline University School of Law Saint Paul, MN Juris Doctor in Law Review
Carano Consulting LLC since Apr 2008
Principal
ABN AMRO / LaSalle Bank - Chicago, IL Mar 2004 - Mar 2008
Chief Privacy Officer, Chief Continuity Officer
Federal Reserve Bank Jan 1987 - Mar 2004
Assistant Vice President
Education:
The University of Chicago - Booth School of Business 2001 - 2003
MBA, Strategy, Finance
Loyola University of Chicago
BBA, Information Systems Management
Southern Illinois University, Carbondale
AAS, Computer Science
Skills:
PMP CIPP Business Continuity Privacy PMO Crisis Management Disaster Recovery Enterprise Risk Management Program Management Privacy Law AML Leadership Business Continuity Planning Security Risk Assessment Risk Management Fraud
Honor & Awards:
Five Presidential Awards for Excellence while at the Federal Reserve Bank.
Kent State University: BS in Education and a MA in English
About:
Providing I pass the three month training period which takes place in and around Bo,Sierra Leone, I will be in Africa from June 6, 2012 to September 2014. Looking forward to the challenges and the op...
Tagline:
Presently Teaching English, Always Learning, and Getting It Right Occasionally
Bragging Rights:
Survived 25 years at UPS as a package car driver. Time for a change.
Youtube
Happy-Mike Carano
This song is called Happy by Mike Carano. He is a Photographer, Musici...
Category:
Music
Uploaded:
20 Dec, 2010
Duration:
3m 52s
After Disaster with Mike Carano and Anderson ...
This is a clip from After Disaster episode number 8 where Mike and And...
Category:
Music
Uploaded:
28 Dec, 2010
Duration:
9m 21s
Five Minutes with Mike Death Valley Junction
Episode 16 of Five Minutes with Mike video series. Mike Carano explore...
Category:
Entertainment
Uploaded:
04 Mar, 2011
Duration:
6m 37s
Five Minutes with Mike Episode 17 Amboy, CA
Mike Carano discovers the hidden truth about Amboy, CA
Category:
Entertainment
Uploaded:
14 Mar, 2009
Duration:
2m 36s
Five Minutes with Mike Episode 22 The Disne...
mikecarano.com D23 Expo
Category:
Entertainment
Uploaded:
13 Sep, 2009
Duration:
7m 23s
5 Minutes With Mike - Episode 8 - Star Trek
Mike Carano staged a live version of Star Trek's "Spock's Brain" episo...
Category:
Comedy
Uploaded:
05 Feb, 2009
Duration:
6m 10s
STAR TREK "SPOCK'S BRAIN" Live at The Improv
mikecarano.com Entire opening scene of "Spock's Brain" performed live ...
Category:
Comedy
Uploaded:
31 Dec, 2006
Duration:
8m 38s
Five Minutes with Mike Episode 14 Star Trek...
Mike Carano ponders the Star Trek Experience closing and gets manhandl...
Michael Carano's Public Profile on Plaxo. Plaxo helps members like Michael Carano keep in touch with the people who really matter, helping them to connect, keep each other's ...