Michael T Deley

US Patent:

7931186, Apr 26, 2011

Filed:

Mar 13, 2007

Appl. No.:

12/093403

Inventors:

Michael T. Deley - Warrington PA, US
Peter M. Lister - Warrington PA, US
Deepak Sood - New Britain PA, US
Zhijie Wang - Chalfont PA, US

Assignee:

Kulicke and Soffa Industries, Inc. - Fort Washington PA

International Classification:

B23K 31/00
B23K 11/00

US Classification:

2281805, 228 45, 228904, 219 56, 219 561, 219 8518

Abstract:

A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

US Patent:

8100317, Jan 24, 2012

Filed:

Mar 28, 2011

Appl. No.:

13/072930

Inventors:

Michael T. Deley - Warrington PA, US
Peter M. Lister - Warrington PA, US
Deepak Sood - New Britain PA, US
Zhijie Wang - Chalfont PA, US

Assignee:

Kulicke and Soffa Industries, Inc. - Fort Washington PA

International Classification:

B23K 31/00
B23K 11/00

US Classification:

2281805, 228 45, 228904, 219 561, 219 8518

Abstract:

A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.

US Patent:

20120024089, Feb 2, 2012

Filed:

Feb 29, 2008

Appl. No.:

12/920105

Inventors:

Jeremiah Couey - Elkins Park PA, US
Michael T. Deley - Warrington PA, US
Shawn Sarbacker - North Wales PA, US
Matthew Odhner - Bryn Athyn PA, US

Assignee:

KULICKE AND SOFFA INDUSTRIES, INC. - Fort Washington PA

International Classification:

G01N 33/00
B23K 37/00
B23K 20/00

US Classification:

738658, 228102, 228 45

Abstract:

A method of teaching bonding locations of a semiconductor device on a wire bonding machine is provided. The method includes (1) providing the wire bonding machine with position data for (a) bonding locations of a first component of the semiconductor device, and (b) bonding locations of a second component of the semiconductor device; and (2) teaching the bonding locations of the first component of the semiconductor device and the second component of the semiconductor device using a pattern recognition system of the wire bonding machine to obtain more accurate position data for at least a portion of the bonding locations of the first component and the second component. The teaching step is conducted by teaching the bonding locations in the order in which they are configured to be wire bonded on the wire bonding machine.

US Patent:

55597270, Sep 24, 1996

Filed:

Feb 24, 1994

Appl. No.:

8/201369

Inventors:

Michael T. Deley - Warrington PA
Edwin R. Phillips - Rosemont PA

Assignee:

Quad Systems Corporation - Horsham PA

International Classification:

G01B 1100

US Classification:

364559

Abstract:

Apparatus and a method for determining the position of a component held on the end of a pick up tool includes a pick up tool and positioning sensing system mounted on a movable frame with each other. The position sensing system includes an adjustable light source for producing an intense fan of light onto a collimating lens. The collimating lens produces an object field comprising a thin wide sheet of collimated light to be projected on a component held by the pick up tool. The thin wide sheet of light is projected on a component whose position is to be determined and the unblocked rays of light are projected onto an objective focusing lens which focuses the unblocked light through a very small aperture onto a relay lens which receives the refocused unblocked rays of light and produces refocused collimated light rays which are directed as an image onto a linear array sensor having a plurality of high density pixel sensors whose position is known relative to the pick up tool. The component whose position is to be determined is rotated in the imaging field. A computer/controller is coupled to the linear array sensor and an encoder for producing sets of X, Y and O-- data indicative of the refocused collimated light rays projected onto said pixel sensor and the computer/controller is programmable for analyzing said digital data and for determining the X, Y and O-- position of the component on the pick up tool.