Michael C Deluca

US Patent:

46667440, May 19, 1987

Filed:

Dec 10, 1984

Appl. No.:

6/679709

Inventors:

Michael A. DeLuca - Holbrook NY
John F. McCormack - Roslyn Heights NY
Peter J. Oleske - Rocky Point NY

Assignee:

Kollmorgen Technologies Corporation - Dallas TX

International Classification:

B05D 304

US Classification:

427304

Abstract:

A process for avoiding blister formation between a metal layer which is electrolessly deposited on a surface of a ceramic substrate and the substrate. The substrate is adhesion promoted with an alkali metal composition containing between 0. 35 and 0. 9 mole fraction alkali metal compound, and water in an amount which is sufficient to lower the melting temperature of the composition to between 145. degree. and 240. degree. C. and adhesion promote the ceramic surface with the molten composition in a time period between 1 and 200 minutes. Thereafter, the adhesion promoted ceramic surface may be activated to render it receptive to electroless metal deposition. The treated ceramic surface is coated free of blisters using an electroless metal deposition bath with an adherent, metal layer having a thickness greater than 5 micrometers.

US Patent:

46474773, Mar 3, 1987

Filed:

Dec 7, 1984

Appl. No.:

6/679220

Inventors:

Michael A. DeLuca - Holbrook NY

Assignee:

Kollmorgen Technologies Corporation - Dallas TX

International Classification:

C23C 1818

US Classification:

427 98

Abstract:

A process for preparing a ceramic substrate for metallization wherein a surface of the ceramic substrate is contacted with an admixture comprised of an inert solid material and a composition containing one or more alkali metal compounds. The admixture and the substrate are heated at least to a temperature at which the alkali metal composition becomes molten. The molten alkali metal composition is kept in contact with the ceramic surface for a time period sufficient to etch the surface and thus prepare it for adherent deposition of metal. The presence of the inert solid material in the admixture prevents coalescence of the alkali metal composition on the ceramic surface. Uniform surface coverage with catalyst and metal and an adherent bond of metal to the ceramic surface are ensured by treatment with the admixture. Furthermore, an article comprised of metal directly and adherently bonded onto a ceramic substrate is provided.

US Patent:

58982574, Apr 27, 1999

Filed:

Aug 25, 1995

Appl. No.:

8/519683

Inventors:

Richard Isaac Sequerra - Stamford CT
Michael Albert DeLuca - Holbrook NY

International Classification:

H01T 1320
F02M 5706
F02P 1300
H01F 1300

US Classification:

313141

Abstract:

The electron emitting cathode of an initiator (spark plug or ignitor) comprises a small button of high temperature, preferably austenitic, stainless steel powder welded to a support conductor. The stainless steel powder has distributed through it a dopant powder consisting of a minor portion of a highly stable oxide of an element having a low work function. The dopant powder has a much smaller mesh size than the stainless steel powder (1/5or less). Rare earth lanthanides are preferred that have a low work function, preferably under 3. 0 eV and are not radioactive. Cerium, in the form of CeO. sub. 2 is most preferred. The compositions of the low work function stainless steel electrodes and methods of making the same are disclosed.

US Patent:

45740941, Mar 4, 1986

Filed:

May 21, 1984

Appl. No.:

6/611193

Inventors:

Michael A. DeLuca - Holbrook NY
John F. McCormack - Roslyn Heights NY

Assignee:

Kollmorgen Technologies Corporation - Dallas TX

International Classification:

B05D 512

US Classification:

427 96

Abstract:

An article comprised of metal directly and adherently bonded onto a ceramic substrate, and a process for producing same, wherein the ceramic is adhesion promoted with molten inorganic compound, treated with compounds that promote adsorption of catalyst for metal deposition, and plated with metal. Uniform surface coverage with catalyst and metal is ensured by the treatment with the adsorption promoters.

US Patent:

47013524, Oct 20, 1987

Filed:

Dec 10, 1984

Appl. No.:

6/679835

Inventors:

Michael A. DeLuca - Holbrook NY
John F. McCormack - Roslyn Heights NY

Assignee:

Kollmorgen Corporation - Simsbury CT

International Classification:

B05D 512

US Classification:

427 98

Abstract:

A process for preparing a ceramic substrate for metallization wherein a surface of the ceramic substrate is contacted with a composition containing one or more alkali metal compounds, preferably in the form of solid pellets. The pellets are melted on the ceramic surface. As the pellets melt, advancing waves of the molten composition spread across and wet the ceramic surface. The molten alkali metal composition is kept in contact with the ceramic surface for a time period sufficient to etch the surface and thus prepare it for adherent deposition of metal. The moving waves of melting composition supply fresh alkali metal compounds at the ceramic surface. After adhesion promotion, the ceramic surface is treated with compounds that promote adsorption of catalyst for metal deposition before being plated with metal. Uniform surface coverage with catalyst and metal and an improved adherent bond of metal to the ceramic surface are obtained. Furthermore, an article comprised of metal directly and adherently bonded onto a ceramic substrate is provided, the bond strength exceeding about 25 MPa.