Michael Dinh

US Patent:

D484628, Dec 30, 2003

Filed:

Nov 27, 2002

Appl. No.:

29/171718

Inventors:

Bijan Bayat - Dallas TX 75238-1355
Michael Quan Dinh - Plano TX 75025

International Classification:

2602

US Classification:

D26 50

US Patent:

D486599, Feb 10, 2004

Filed:

Nov 27, 2002

Appl. No.:

29/171760

Inventors:

Bijan Bayat - Dallas TX 75238-1355
Michael Quan Dinh - Plano TX 75025

International Classification:

2605

US Classification:

D26 63

US Patent:

D490554, May 25, 2004

Filed:

Nov 27, 2002

Appl. No.:

29/171707

Inventors:

Bijan Bayat - Dallas TX 75238-1355
Michael Quan Dinh - Plano TX 75025

International Classification:

2605

US Classification:

D26 65

US Patent:

D490555, May 25, 2004

Filed:

Nov 27, 2002

Appl. No.:

29/171780

Inventors:

Bijan Bayat - Dallas TX 75238-1355
Michael Quan Dinh - Plano TX 75025

International Classification:

2605

US Classification:

D26 65

US Patent:

20010028554, Oct 11, 2001

Filed:

Feb 6, 2001

Appl. No.:

09/777739

Inventors:

Joe Guillot - Plano TX, US
Michael Dinh - Plano TX, US
Bill Roberts - Greenville TX, US
Linda McLemore - Dallas TX, US

Assignee:

Dallas Semiconductor Corporation

International Classification:

H01L023/10
H05K007/00

US Classification:

361/728000, 174/052200

Abstract:

An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.

US Patent:

61919551, Feb 20, 2001

Filed:

Jan 21, 1998

Appl. No.:

9/010015

Inventors:

Joe Guillot - Plano TX
Michael Quan Dinh - Plano TX
Bill Roberts - Greenville TX
Linda M. McLemore - Dallas TX

Assignee:

Dallas Semiconductor Corporation - Dallas TX

International Classification:

H01L 23053
H01L 2328

US Classification:

361820

Abstract:

An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.

US Patent:

57491437, May 12, 1998

Filed:

Aug 12, 1996

Appl. No.:

8/695443

Inventors:

Joe Guillot - Plano TX
Michael Quan Dinh - Plano TX
Bill Roberts - Greenville TX
Linda M. McLemore - Dallas TX

Assignee:

Dallas Semiconductor Corporation - Dallas TX

International Classification:

H05K 330

US Classification:

29841

Abstract:

An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.