Michael L Duffy

US Patent:

7827651, Nov 9, 2010

Filed:

May 7, 2007

Appl. No.:

11/800747

Inventors:

Nicholas Simon Graham - Potomac MD, US
Michael Patrick Duffy - Bloomington MN, US
Edward Reynolds - Redding CT, US

Assignee:

Zibra, LLC - Mooresville NC

International Classification:

B05C 17/02

US Classification:

1523011, 492 13, 492 19

Abstract:

A quick-release paint roller having a roller cover that can be removed from a handle assembly without requiring the user to apply a force directly to the roller cover. The paint roller includes a tube-shaped roller cover having an outer surface of paint absorbing material and a rotatably mounted roller core. When the actuator is in the release position, the roller mounting device is free of the latching mechanism, thus permitting the roller core and roller cover to be removed from the handle assembly.

US Patent:

39522318, Apr 20, 1976

Filed:

Sep 6, 1974

Appl. No.:

5/503883

Inventors:

Lewis A. Davidson - Reston VA
Michael C. Duffy - Vienna VA
Alvard J. Erickson - Reston VA
Gerard R. Gunther-Mohr - Chappaqua NY
Richard A. Williams - Candor NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 720

US Classification:

317100

Abstract:

The package comprises a plurality of metal/polymer laminates whereby electronic components or functional units may be directly attached or plugged into laminated elements to form a unitary package. An element or thermal transposer is included in the package to minimize thermal expansion mismatch between the components and the laminates and conduct thermal energy away from the attached electronic components. The polymer laminates are selected to have a configuration and thermal coefficient of expansion (TCE) that will permit the insertion and locking of materials within the laminates to form the unitary package. A wide variety of components and functional units having different electrical, thermal characteristics may be included in the package. The package is amenable to mass production processes that may be controlled by a designer to obtain packages at a low cost, more flexibility and suitable for complex electronics system.