Michael C French

US Patent:

7236369, Jun 26, 2007

Filed:

Mar 14, 2005

Appl. No.:

11/079851

Inventors:

Richard M. Barina - Wellington FL, US
Michael D. French - Raleigh NC, US
Dean F. Herring - Youngsville NC, US
John P. Scavuzzo - Rougemont NC, US
Paul A. Wormsbecher - Apex NC, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 7/20

US Classification:

361719, 361704, 257719, 24458, 24513

Abstract:

A heat sink retention assembly for retaining a heat sink in thermal contact with a CPU while transmitting load away from the CPU. The heat sink retention assembly includes a frame sized to receive the heat sink, the frame including opposing pin capture channels and a wire module. The wire module includes an upper handle section and a lower pivoting section. The wire module is pivotably coupled to the frame at the lower pivoting section. The wire module further includes opposing end pins, wherein each pin is moveably retained within and extends through a corresponding pin capture channel such that when the wire module is rotated with respect to the frame, the pins travel within their respective channels in order to engage the heat sink.