Michael P Gaynor

US Patent:

6686649, Feb 3, 2004

Filed:

May 14, 2001

Appl. No.:

09/855244

Inventors:

Douglas Jay Mathews - Gilbert AZ
Robert Joseph Hill - Salinas CA
Michael Paul Gaynor - Chandler AZ
Ronald James Schoonejongen - Chandler AZ
John Armando Miranda - Chandler AZ
Christopher Marc Scanlan - Phoenix AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ
Tyco Electronics Logistics AG

International Classification:

H01L 23552

US Classification:

257659, 257687, 257690

Abstract:

A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.

US Patent:

6816032, Nov 9, 2004

Filed:

Sep 3, 2002

Appl. No.:

10/235135

Inventors:

Michael P. Gaynor - Chandler AZ
Gary H. Shapiro - Gilbert AZ

Assignee:

Amkor Technology, Inc. - Chandler AZ

International Classification:

H01P 512

US Classification:

333175, 333126

Abstract:

A laminated low-profile dual filter module for telecommunications devices and method provides both Groupe SpÃcial Mobile (GSM) and Digital Cellular System (DCS) transmit filters in a small package. The filter module comprises multiple layers of ceramic substrate with metal circuit patterns sandwiched between. Two separate filters are implemented within the layers, with a first filter comprising a first set of layers and the second filter adjoining within a second set of layers. Resonators for each filter are positioned at the opposite sides of the module, in order to avoid coupling between the resonators and ground layers are interspersed for isolation. Capacitors are implemented by a first plate defined by an area on one metal layer with the adjacent layers providing ground planes that form the second plate.

US Patent:

7049682, May 23, 2006

Filed:

Jul 16, 2003

Appl. No.:

10/621780

Inventors:

Douglas Jay Mathews - Gilbert AZ, US
Robert Joseph Hill - Salinas CA, US
Michael Paul Gaynor - Chandler AZ, US
Ronald James Schoonejongen - Chandler AZ, US
John Armando Miranda - Chandler AZ, US
Christopher Marc Scanlan - Phoenix AZ, US

Assignee:

Amkor Technology, Inc. - Chandler AZ
Tyco Electronics Logistics AG

International Classification:

H01L 23/552

US Classification:

257660, 257659, 257690

Abstract:

A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.

US Patent:

7246106, Jul 17, 2007

Filed:

Jul 2, 2003

Appl. No.:

10/612653

Inventors:

Michael G. Gaynor - Chicago IL, US
Scott Waterbury - Wilmette IL, US

Assignee:

Red Paper LLC - Chicago IL

International Classification:

G06F 7/00
G06Q 30/00
G06Q 20/00

US Classification:

707 1, 707 3, 707 9, 707 10, 705 1, 705 17, 705 26

Abstract:

A system and method for distributing a plurality of electronic articles is provided. Articles are received from a plurality of users and stored retrievably in memory. A request is received for the purchase of an article from one of a plurality of users. An electronic funding account associated with the one of a plurality of users is debited, and the article is transmitted to the one of the plurality of users.

US Patent:

20070176287, Aug 2, 2007

Filed:

Mar 29, 2004

Appl. No.:

10/812274

Inventors:

Sean Crowley - Phoenix AZ, US
Ludovico Bancod - Chandler AZ, US
Terry Davis - Gilbert AZ, US
Robert Darveaux - Higley AZ, US
Michael Gaynor - Chandler AZ, US

International Classification:

H01L 23/34

US Classification:

257728000

Abstract:

A semiconductor package comprising a non-conductive film which defines opposed top and bottom film surfaces and includes a plurality of vias disposed therein. Disposed on the top film surface is a plurality of upper leads which circumvent respective ones of the vias. Similarly, disposed on the bottom film surface is a plurality of lower leads which circumvent respective ones of the vias and are electrically connected to respective ones of the upper leads. At least one transmission line element is also disposed on the top film surface and electrically connected to at least one of the upper leads. Attached to the top film surface and electrically connected to at least one of the upper leads and the transmission line element is at least one semiconductor die. A package body at least partially covers the semiconductor die, the upper leads, the transmission line element, and the top film surface.

US Patent:

20110291233, Dec 1, 2011

Filed:

Dec 8, 2009

Appl. No.:

13/140531

Inventors:

Michael Gaynor - Crystal Lake IL, US
Brian Collins - Cambridge, GB

International Classification:

H01L 29/02
H01L 21/56

US Classification:

257531, 438127, 257532, 257E21502, 257E29002

Abstract:

There is disclosed a package comprising at least an integrated circuit embedded in an electrically non-conductive moulded material. The moulded material includes at least one moulded pattern on at least one surface thereof, and at least one electrically conductive track in the pattern. There is further provided at least one capacitive, inductive or galvanic component electrically connecting between at least two parts of the at least one electrically conductive track. The conductive track can be configured as an antenna, and the capacitive, inductive or galvanic component is used to adjust tuning and other characteristics of the antenna.

US Patent:

59399392, Aug 17, 1999

Filed:

Feb 27, 1998

Appl. No.:

9/032585

Inventors:

Michael P. Gaynor - Elgin IL
John E. Lawrence - Roselle IL
Ross J. Lahlum - Mount Prospect IL

Assignee:

Motorola, Inc. - Achaumburg IL

International Classification:

H03F 368
H01P 512

US Classification:

330124R

Abstract:

A power amplifier (517) for amplifying an operating signal includes an amplifier (538), an amplifier (540), and a power combiner (518) with harmonic selectivity. The power combiner (518) includes a transmission line section (541), a transmission line section (545), and a resistor (554). The transmission line section (541) is coupled to an amplifier output of the amplifier (538), and the transmission line section (545) is coupled to an amplifier output of the amplifier (540) and to the transmission line section (541). A capacitor (546) is coupled in parallel to a transmission line section (542) of the transmission line section (541), and a capacitor (548) is coupled in parallel to a transmission line section (544) of the transmission line section (545).

US Patent:

57376859, Apr 7, 1998

Filed:

Dec 20, 1995

Appl. No.:

8/575269

Inventors:

Robert J. Locascio - Crystal Lake IL
Michael W. Frenzer - Palatine IL
Michael P. Gaynor - Elgin IL
Christopher N. Kurby - Elmhurst IL
Joan E. Zocher - Schaumburg IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H04B 7212

US Classification:

455 121

Abstract:

A satellite communication system (SCS)(100) and method (300) are provided that provide a geographically co-located user assignment system. For unit-to-unit communication, each group of subscriber units is instructed to operate in a half-duplex unit to unit mode. The geographically co-located user assignment system comprises an assignment unit (201), a storage unit (203), and an instruction unit (205) such that a first subscriber unit (204) initiates unit to unit communication with at least a second subscriber unit (206,. . . ) in the first subscriber unit's user group utilizing a multiple access channel assigned to that group by transmitting on an assigned satellite downlink frequency of the multiple-access channel on a push-to-talk basis.