Michael T Gulla from Webster, NY, age 35

Resumes

Administrator - Radiology

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Location:

Boston, MA

Industry:

Hospital & Health Care

Work:

Brigham and Women's Hospital
Administrator - Radiology
Boston Medical Center (Bmc) 2012 - 2014
Practice Manager
Holliston Fire Department 2012 - 2014
Firefighter
U.s. Coast Guard 2012 - 2014
Operations Officer
Us Navy 1999 - 2005
Sarc and Fmf Corpsman, Marsoc

Education:

National Defense University 2019
The United States Naval Postgraduate School 2015
Framingham State University
Masters, Education Jacksonville University
Bachelors, History Suffolk University
Master of Business Administration, Masters, Management, Health Care Administration

Skills:

Military Operations
Operations Management
Public Speaking
Leadership
Healthcare
Emergency Management
Lean Management
Business Strategy
Financial Analysis
Budget Management
Strategic Planning
Firearms
Weapons and Tactics Instruction
Small Boat Operations
Military

Account Manager: Nh And Me

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Location:

91 Drinkwater Rd, Hampton Falls, NH 03844

Industry:

Hospital & Health Care

Work:

Option Care
Account Manager: Nh and Me
Patient Care America
Account Manager
Qmedrx Feb 2004 - Jul 2015
Regional Vice President
Bny Mellon Jun 2000 - Jan 2004
Account Executive

Education:

Union College 1996 - 2000
Bachelors, Bachelor of Arts, Political Science

Skills:

Sales Operations
Management
Sales
Cold Calling
New Business Development
Contract Negotiation
Sales Management
Business Development
Marketing Strategy
Strategic Planning
Process Improvement
Leadership
Account Management

Languages:

English

Captain Sailing Vessel 'Island Girl

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Work:

Jun 1978 - May 2010
Tooling and Ceramic Core Process Owner and Senior Development Engineer
Jun 1978 - May 2010
Captain Sailing Vessel 'Island Girl

Skills:

5S
Aerospace
Microsoft Office
Six Sigma
Kaizen
Spc
Lean Manufacturing
Machining
Manufacturing
Continuous Improvement
Fmea
Manufacturing Engineering
Materials
Engineering
Investment Casting
Value Stream Mapping
Manufacturing Operations Management
Root Cause Analysis

Michael Gulla

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Michael Gulla

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Location:

Boston, MA

Skills:

Coast Guard
Sales

Michael Gulla

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Michael Gulla

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Operations Officer At U.s. Coast Guard

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Location:

Greater Boston Area

Industry:

Military

Name / Title

Company / Classification

Phones & Addresses

Michael Gulla
Treasurer

NEOTECH INC

62 Cotting Ave, Marlborough, MA 01752
18 Walnut Hl Rd, Millis, MA 02054

Michael Gulla
Principal

Mike Gulla Tree Svc & Company
Shrub/Tree Services

85 Vernon St, Norwood, MA 02062

Us Patents

Conductive Oxide Coating Process
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US Patent:

6632344, Oct 14, 2003
Filed:

Mar 24, 2000
Appl. No.:

09/535302
Inventors:

Robert L. Goldberg - Sharon MA 02067
Michael Gulla - Sarasota FL 34238
International Classification:

C25D 554
US Classification:

205159, 205220, 205164, 205125
Abstract:

The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a conductive oxide coating over a substrate, preferably by immersion of said substrate in an aqueous oxidative desmear solution for a time sufficient to form a coating containing conductive dielectric oxidation residue and then, in the absence of a step of forming an additional conductive coating over the residue coating or removing the coating, electroplating metal onto said surface by immersion of the substrate having the coating in an electroplating solution.

Radiation Attenuation Shielding
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US Patent:

48699705, Sep 26, 1989
Filed:

Nov 9, 1987
Appl. No.:

7/118439
Inventors:

Michael Gulla - Newton MA
Terrell A. Benjamin - Acton MA
Mark Farsi - Worcester MA
Assignee:

Shipley Company Inc. - Newton MA
International Classification:

B32B 1504
US Classification:

428621
Abstract:

An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

Metal Plating Solution
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US Patent:

39778843, Aug 31, 1976
Filed:

Jan 2, 1975
Appl. No.:

5/538125
Inventors:

Michael Gulla - Sherborn MA
Charles A. Gaputis - Hyde Park MA
Assignee:

Shipley Company, Inc. - Newton MA
International Classification:

C23C 302
US Classification:

106 1
Abstract:

An electroless metal plating solution is characterized by an elemental sulfur stabilizer, either in colloidal or soluble, non-ionic form. Elemental sulfur as a stabilizer is an improvement over prior art stabilizers as it can be used in substantially larger concentration than prior art divalent sulfur stabilizers which are catalytic poisons.

Photoresist Composition Of Cocondensed Naphthol And Phenol With Formaldehyde In Admixture With Positive O-Quinone Diazide Or Negative Azide
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US Patent:

45514097, Nov 5, 1985
Filed:

Nov 7, 1983
Appl. No.:

6/549286
Inventors:

Michael Gulla - Sherborn MA
Paul Taylor - North Andover MA
Michael J. Oddi - Burlington MA
Assignee:

Shipley Company Inc. - Newton MA
International Classification:

G03C 160
G03C 171
G03F 726
US Classification:

430192
Abstract:

A photoresist composition comprising a sensitizer in a binder that is a naphthol polymer alone or mixed with another compatible resin such as a novolak resin or a polyvinyl phenol. The use of the naphthol resin as a portion of the binder increases the heat distortion temperature of the photoresist composition.

Additive Plating Process
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US Patent:

53914210, Feb 21, 1995
Filed:

Nov 15, 1993
Appl. No.:

8/153072
Inventors:

Michael Gulla - Millis MA
Assignee:

Shipley Company Inc. - Marlborough MA
International Classification:

B32B 900
US Classification:

428209
Abstract:

A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.

Electroplating Process
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US Patent:

48103330, Mar 7, 1989
Filed:

Dec 14, 1987
Appl. No.:

7/132175
Inventors:

Michael Gulla - Millis MA
Donald F. Foust - Scotia NY
George K. Philipose - Waltham MA
Assignee:

Shipley Company Inc. - Newton MA
International Classification:

C25D 502
C25D 556
US Classification:

204 15
Abstract:

A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

Catalytic Metal Of Reduced Particle Size
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US Patent:

47253142, Feb 16, 1988
Filed:

Sep 17, 1986
Appl. No.:

6/908277
Inventors:

Michael Gulla - Sherborn MA
Oleh B. Dutkewych - Harvard MA
John J. Bladon - Wayland MA
Assignee:

Shipley Company Inc. - Newton MA
International Classification:

B22F 700
C09D 500
C23C 1600
B05B 118
US Classification:

106 111
Abstract:

A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.

Selective Metallization Process
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US Patent:

51588609, Oct 27, 1992
Filed:

Nov 1, 1990
Appl. No.:

7/607711
Inventors:

Michael Gulla - Millis MA
Prasit Sricharoenchaikit - Millis MA
Assignee:

Shipley Company Inc. - Newton MA
International Classification:

G03C 558
US Classification:

430315
Abstract:

A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.