Michael A Gulla

US Patent:

6632344, Oct 14, 2003

Filed:

Mar 24, 2000

Appl. No.:

09/535302

Inventors:

Robert L. Goldberg - Sharon MA 02067
Michael Gulla - Sarasota FL 34238

International Classification:

C25D 554

US Classification:

205159, 205220, 205164, 205125

Abstract:

The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a conductive oxide coating over a substrate, preferably by immersion of said substrate in an aqueous oxidative desmear solution for a time sufficient to form a coating containing conductive dielectric oxidation residue and then, in the absence of a step of forming an additional conductive coating over the residue coating or removing the coating, electroplating metal onto said surface by immersion of the substrate having the coating in an electroplating solution.

US Patent:

20030039668, Feb 27, 2003

Filed:

Mar 1, 2002

Appl. No.:

10/086990

Inventors:

Michael Gulla - Sarasota FL, US
Robert Goldberg - Sharon MA, US

Assignee:

Neo Tech Development Company, L.L.C. - Sharon MA

International Classification:

A61K007/00

US Classification:

424/401000

Abstract:

This invention is for a rapid penetrating skin treatment emulsion characterized by an ability to very rapidly penetrate into the epidermis and dermis carrying efficacious additives with it as it penetrates into the skin. The ability to penetrate into the skin is due to the physical structure of the emulsion, which in turn is as a consequence of its ingredients, and the concentration of each ingredient.

US Patent:

41304543, Dec 19, 1978

Filed:

Sep 30, 1977

Appl. No.:

5/822002

Inventors:

Oleh B. Dutkewych - Maplewood NJ
Charles A. Gaputis - Kansas City MO
Michael Gulla - Sherborn MA
Leonard R. Levy - Framingham MA

International Classification:

C23F 102

US Classification:

156659

Abstract:

This invention is directed to an etchant and to a process for its use. The etchant comprises a synergistic combination of hydrogen peroxide and molybdenum as oxidants in acidic solution. The combination of oxidants provides for sustained etching at an exalted rate. The etchant is useful for etching metals, especially copper and its alloys, and is particularly useful in the manufacture of printed circuit boards.

US Patent:

41441192, Mar 13, 1979

Filed:

Sep 30, 1977

Appl. No.:

5/822003

Inventors:

Oleh B. Dutkewych - Maplewood NJ
Charles A. Gaputis - Kansas City MO
Michael Gulla - Sherborn MA
Leonard R. Levy - Framingham MA

International Classification:

C23F 102

US Classification:

156659

Abstract:

This invention is directed to an etchant and to a process for its use. The etchant comprises sulfuric acid activated with hydrogen peroxide or the synergistic combination of hydrogen peroxide and molybdenum. The etchant is characterized by a source of phosphate ions as an inhibitor against attack on tin, especially immersion tin, as well as several other metals such as nickel and alloys of nickel such as gold alloys. The etchant is especially useful for etching copper and its alloys in the presence of a tin etch resist, and therefore, provides a new procedure for the fabrication of printed circuit boards using immersion tin as an etch resist.