Michael K Gulla

US Patent:

6632344, Oct 14, 2003

Filed:

Mar 24, 2000

Appl. No.:

09/535302

Inventors:

Robert L. Goldberg - Sharon MA 02067
Michael Gulla - Sarasota FL 34238

International Classification:

C25D 554

US Classification:

205159, 205220, 205164, 205125

Abstract:

The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a conductive oxide coating over a substrate, preferably by immersion of said substrate in an aqueous oxidative desmear solution for a time sufficient to form a coating containing conductive dielectric oxidation residue and then, in the absence of a step of forming an additional conductive coating over the residue coating or removing the coating, electroplating metal onto said surface by immersion of the substrate having the coating in an electroplating solution.

US Patent:

48699705, Sep 26, 1989

Filed:

Nov 9, 1987

Appl. No.:

7/118439

Inventors:

Michael Gulla - Newton MA
Terrell A. Benjamin - Acton MA
Mark Farsi - Worcester MA

Assignee:

Shipley Company Inc. - Newton MA

International Classification:

B32B 1504

US Classification:

428621

Abstract:

An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

US Patent:

39778843, Aug 31, 1976

Filed:

Jan 2, 1975

Appl. No.:

5/538125

Inventors:

Michael Gulla - Sherborn MA
Charles A. Gaputis - Hyde Park MA

Assignee:

Shipley Company, Inc. - Newton MA

International Classification:

C23C 302

US Classification:

106 1

Abstract:

An electroless metal plating solution is characterized by an elemental sulfur stabilizer, either in colloidal or soluble, non-ionic form. Elemental sulfur as a stabilizer is an improvement over prior art stabilizers as it can be used in substantially larger concentration than prior art divalent sulfur stabilizers which are catalytic poisons.

US Patent:

45514097, Nov 5, 1985

Filed:

Nov 7, 1983

Appl. No.:

6/549286

Inventors:

Michael Gulla - Sherborn MA
Paul Taylor - North Andover MA
Michael J. Oddi - Burlington MA

Assignee:

Shipley Company Inc. - Newton MA

International Classification:

G03C 160
G03C 171
G03F 726

US Classification:

430192

Abstract:

A photoresist composition comprising a sensitizer in a binder that is a naphthol polymer alone or mixed with another compatible resin such as a novolak resin or a polyvinyl phenol. The use of the naphthol resin as a portion of the binder increases the heat distortion temperature of the photoresist composition.

US Patent:

53914210, Feb 21, 1995

Filed:

Nov 15, 1993

Appl. No.:

8/153072

Inventors:

Michael Gulla - Millis MA

Assignee:

Shipley Company Inc. - Marlborough MA

International Classification:

B32B 900

US Classification:

428209

Abstract:

A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.

US Patent:

48103330, Mar 7, 1989

Filed:

Dec 14, 1987

Appl. No.:

7/132175

Inventors:

Michael Gulla - Millis MA
Donald F. Foust - Scotia NY
George K. Philipose - Waltham MA

Assignee:

Shipley Company Inc. - Newton MA

International Classification:

C25D 502
C25D 556

US Classification:

204 15

Abstract:

A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

US Patent:

47253142, Feb 16, 1988

Filed:

Sep 17, 1986

Appl. No.:

6/908277

Inventors:

Michael Gulla - Sherborn MA
Oleh B. Dutkewych - Harvard MA
John J. Bladon - Wayland MA

Assignee:

Shipley Company Inc. - Newton MA

International Classification:

B22F 700
C09D 500
C23C 1600
B05B 118

US Classification:

106 111

Abstract:

A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.

US Patent:

51588609, Oct 27, 1992

Filed:

Nov 1, 1990

Appl. No.:

7/607711

Inventors:

Michael Gulla - Millis MA
Prasit Sricharoenchaikit - Millis MA

Assignee:

Shipley Company Inc. - Newton MA

International Classification:

G03C 558

US Classification:

430315

Abstract:

A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.