Michael D Hansen

US Patent:

D455407, Apr 9, 2002

Filed:

Sep 28, 2000

Appl. No.:

29/130200

Inventors:

Steven E Hanzlik - Fort Collins CO
Michael A Hansen - Fort Collins CO
Guy R Wagner - Loveland CO
Arlen L Roesner - Fort Collins CO

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

1303

US Classification:

D13179

US Patent:

6401808, Jun 11, 2002

Filed:

Nov 28, 2000

Appl. No.:

09/723570

Inventors:

Steven E. Hanzlik - Fort Collins CO
Michael A. Hansen - Fort Collins CO
Guy R. Wagner - Loveland CO

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H05K 720

US Classification:

165121, 165 803, 361697

Abstract:

Disclosed herein is a cooling device primarily for cooling integrated circuits or other electronic devices during operation. The cooling device may include a heat sink portion and a fan, or other air movement device. The outer periphery of the heat sink portion may be formed with outwardly extending lobes, leaving recessed areas between the lobes. The lobes may be sized and located so as to correspond to heat concentration areas on an electronic device package. In this manner, heat sink material may be concentrated adjacent heat concentration areas where more heat removal is required. The overall mass and size of the heat sink portion may, thus, be reduced without significantly impairing the ability of the cooling device to remove heat from an electronic device. The heat sink portion may also be provided with an open space located beneath the base of the fan in order to insulate the motor of the fan from the heat sink base and, thus, reduce the amount of heat which transfers from the heat sink base to the fan motor.

US Patent:

D560820, Jan 29, 2008

Filed:

Aug 4, 2005

Appl. No.:

29/235685

Inventors:

Joseph M. Downey - Gilbert AZ, US
Michael K. Hansen - Mesa AZ, US

Assignee:

Hunter Douglas Inc. - Upper Saddle River NJ

International Classification:

2502

US Classification:

D25 47

US Patent:

61762997, Jan 23, 2001

Filed:

Feb 22, 1999

Appl. No.:

9/253877

Inventors:

Steven E. Hanzlik - Fort Collins CO
Michael A. Hansen - Fort Collins CO
Guy R. Wagner - Loveland CO

Assignee:

Agilent Technologies, Inc. - Palo Alto CA

International Classification:

H05K 720

US Classification:

165 803

Abstract:

Disclosed herein is a cooling device primarily for cooling integrated circuits or other electronic devices during operation. The cooling device may include a heat sink portion and a fan, or other air movement device. The outer periphery of the heat sink portion may be formed with outwardly extending lobes, leaving recessed areas between the lobes. The lobes may be sized and located so as to correspond to heat concentration areas on an electronic device package. In this manner, heat sink material may be concentrated adjacent heat concentration areas where more heat removal is required. The overall mass and size of the heat sink portion may, thus, be reduced without significantly impairing the ability of the cooling device to remove heat from an electronic device.

US Patent:

20230109977, Apr 13, 2023

Filed:

Oct 7, 2022

Appl. No.:

17/961986

Inventors:

- Scottsdale AZ, US
Clifford L. Anderson - Tempe AZ, US
Vi Thanh Nguyen - Phoenix AZ, US
Michael T. Hansen - Tempe AZ, US

International Classification:

B01L 3/00
C12Q 1/6851

Abstract:

Provided herein are systems and methods for a point of care apparatus. The point of care apparatus includes a fluid container for receiving a biosample, an intermediate cap, and a cartridge having at least one microfluidic channel.