Michael C Hopkins

Address:

589 County Rd 75, New Albany, MS 38652

VIN:

1GCEC19CX7Z578550

Make:

CHEVROLET

Model:

SILVERADO 1500

Year:

2007

US Patent:

20130233640, Sep 12, 2013

Filed:

Apr 20, 2013

Appl. No.:

13/867068

Inventors:

Michael Hopkins - Portland OR, US
Nathan Thomas - Tualatin OR, US

International Classification:

H04R 9/04

US Classification:

181148

Abstract:

An improved mid to high-frequency loudspeaker of the type having a central dome diaphragm having an outer periphery, and in one embodiment an outer ring-radiator diaphragm portion defining an inner periphery and an outer periphery, the ring-radiator diaphragm being attached at its inner periphery to an armature voice coil assembly and at its outer periphery to a diaphragm chassis in a first plane. The central diaphragm portion is attached at its outer periphery to either the inner periphery of the outer ring-radiator diaphragm or the voice coil armature, and the improvement comprises axially-located stabilizing means attached to the central diaphragm portion, or alternatively a central stabilizing framework, in a second plane parallel to the first plane and that is of sufficient distance from the first plane to provide leverage sufficient to stabilize the diaphragm to minimize rocking, allow improved alignment of the voice coil allowing tighter tolerances between the voice coil and magnet assembly, thus improving performance and minimizing distortion.

US Patent:

20220377885, Nov 24, 2022

Filed:

May 17, 2022

Appl. No.:

17/663764

Inventors:

- Portland OR, US
Trevor Antonio Rivera - Portland OR, US
Charles J. Kinzel - Portland OR, US
Michael Adventure Hopkins - Portland OR, US

International Classification:

H05K 1/03
H05K 1/18
H05K 3/30
H05K 3/42

Abstract:

A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

US Patent:

20220270961, Aug 25, 2022

Filed:

Feb 18, 2022

Appl. No.:

17/651651

Inventors:

Mark William Ronay - Portland OR, US
Trevor Antonio Rivera - Portland OR, US
Michael Adventure Hopkins - Portland OR, US
Edward Martin Godshalk - Newberg OR, US
Charles J. Kinzel - Portland OR, US

International Classification:

H01L 23/498
H05K 3/32
H05K 3/12
H05K 3/30
H05K 3/10
H01L 23/31

Abstract:

A method includes stacking a first layer of insulating material having one or more passages on a substrate. A deformable conductive material is deposited in at least one of the passages in the first insulating layer. A second layer of insulating material is stacked on the first layer of insulating material. The second layer of insulating material at least partially encloses the deformable conductive material in the at least one passage in the first layer of insulating material, and unitizing the first and second layers in a unitizing operation

US Patent:

20210272891, Sep 2, 2021

Filed:

May 18, 2021

Appl. No.:

17/303030

Inventors:

- Portland OR, US
Jorge E. Carbo - Portland OR, US
Trevor Spiegel Antonio Rivera - Portland OR, US
Charles Kinzel - Portland OR, US
Michael Adventure Hopkins - Portland OR, US

International Classification:

H01L 23/498
H01L 21/48
H01L 21/56
H01L 23/31

Abstract:

A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

US Patent:

20200381349, Dec 3, 2020

Filed:

May 28, 2020

Appl. No.:

16/885854

Inventors:

- Beaverton OR, US
Jorge E. Carbo - Portland OR, US
Trevor Spiegel Antonio Rivera - Portland OR, US
Charles Kinzel - Portland OR, US
Michael Adventure Hopkins - Portland OR, US

Assignee:

Liquid Wire Inc. - Beaverton OR

International Classification:

H01L 23/498
H01L 23/31
H01L 21/56
H01L 21/48

Abstract:

A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.

US Patent:

20200066628, Feb 27, 2020

Filed:

Aug 22, 2019

Appl. No.:

16/548379

Inventors:

- Beaverton OR, US
Trevor Spiegel Antonio Rivera - Portland OR, US
Michael Adventure Hopkins - Portland OR, US
Edward Godshalk - Newberg OR, US
Charles Kinzel - Portland OR, US

Assignee:

Liquid Wire Inc. - Beaverton OR

International Classification:

H01L 23/498
H01L 23/31

Abstract:

A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.