Michael G Howey

US Patent:

6613239, Sep 2, 2003

Filed:

Apr 17, 2001

Appl. No.:

09/836644

Inventors:

Andrew Z. Glovatsky - Plymouth MI
Robert E. Belke - West Bloomfield MI
Delin Li - San Jose CA
Lakhi N. Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Marc A. Straub - Dearborn Heights MI
Richard K. McMillan - Dearborn MI
Ram S. Raghava - Ann Arbor MI
Thomas B. Krautheim - Belleville MI
Michael A. Howey - Canton MI
Vivek A. Jairazbhoy - Farmington Hills MI

Assignee:

Visteon Global Tech., Inc. - Dearborn MI

International Classification:

B44C 122

US Classification:

216 13, 216 17, 216 41, 174250, 29846

Abstract:

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically grounded or isolated from an electrical ground plane.

US Patent:

6673723, Jan 6, 2004

Filed:

Mar 22, 2001

Appl. No.:

09/815226

Inventors:

Bharat Z. Patel - Canton MI 48187
Jay D. Baker - Dearborn MI 48121
Lakhi N. Goenka - Ann Arbor MI 48103
Michael Allen Howey - Canton MI 48187
Mohan R. Paruchuri - Canton MI 48187
Richard Keith McMillan - Dearborn MI 48124

International Classification:

H01L 21302

US Classification:

438745, 438750, 438753, 216 13

Abstract:

A method for making a multi-layer circuit board having at least one electrically conductive interconnection portion or âviaâ which extends within the board and at least one air-bridge The method includes the steps of forming protuberances upon a core member attaching pre-circuit assemblies to the core member thereby forming the circuit board while concomitantly and selectively extending at least one of the protuberances within the formed circuit board.