Michael A Howey

US Patent:

6585538, Jul 1, 2003

Filed:

Apr 20, 2000

Appl. No.:

09/553296

Inventors:

Harvinder Singh - Shelby Township MI
Vijay Patel - Westland MI
Michael Howey - Canton MI
Bharat Patel - Canton MI
Jin Zhou - Troy MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H01R 907

US Classification:

439495, 439564, 361785

Abstract:

A connector system for printed circuit boards uses extensions of the traces of the printed circuit board as connector pins by supporting the malleable traces with isolated support pillars. This eliminates the need for electrical junctions between the connector and the printed circuit board. The support pillars provide the necessary mechanical properties for the connector pins. The conductive trace may be adhered to one side of the support or may be draped over the top to cover both sides and may be plated with the material of the support to provide a uniform electrical conductivity over the surface of the formed pin.

US Patent:

6613239, Sep 2, 2003

Filed:

Apr 17, 2001

Appl. No.:

09/836644

Inventors:

Andrew Z. Glovatsky - Plymouth MI
Robert E. Belke - West Bloomfield MI
Delin Li - San Jose CA
Lakhi N. Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Marc A. Straub - Dearborn Heights MI
Richard K. McMillan - Dearborn MI
Ram S. Raghava - Ann Arbor MI
Thomas B. Krautheim - Belleville MI
Michael A. Howey - Canton MI
Vivek A. Jairazbhoy - Farmington Hills MI

Assignee:

Visteon Global Tech., Inc. - Dearborn MI

International Classification:

B44C 122

US Classification:

216 13, 216 17, 216 41, 174250, 29846

Abstract:

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically grounded or isolated from an electrical ground plane.

US Patent:

6673723, Jan 6, 2004

Filed:

Mar 22, 2001

Appl. No.:

09/815226

Inventors:

Bharat Z. Patel - Canton MI 48187
Jay D. Baker - Dearborn MI 48121
Lakhi N. Goenka - Ann Arbor MI 48103
Michael Allen Howey - Canton MI 48187
Mohan R. Paruchuri - Canton MI 48187
Richard Keith McMillan - Dearborn MI 48124

International Classification:

H01L 21302

US Classification:

438745, 438750, 438753, 216 13

Abstract:

A method for making a multi-layer circuit board having at least one electrically conductive interconnection portion or âviaâ which extends within the board and at least one air-bridge The method includes the steps of forming protuberances upon a core member attaching pre-circuit assemblies to the core member thereby forming the circuit board while concomitantly and selectively extending at least one of the protuberances within the formed circuit board.