Michael Keefe

US Patent:

20100259448, Oct 14, 2010

Filed:

Apr 9, 2010

Appl. No.:

12/757924

Inventors:

MURAD QAHWASH - ORLANDO FL, US
JOHN McCARTHY - PALM BAY FL, US
DANNY CAUDILL - MELBOURNE FL, US
MICHAEL KEEFE - WEST MELBOURNE FL, US

Assignee:

LOCUS LOCATION SYSTEMS LLC - WEST MELBOURNE FL

International Classification:

G01S 1/24

US Classification:

342387

Abstract:

A method for testing each one of a plurality of receiving sites operative in a time difference of arrival geo-location system. The method comprises determining a theoretical time of arrival of a test message at each receiving site assuming the test message was transmitted from a test message transmitting antenna at a known location; determining a measured time of arrival of the test message at each receiving site, the test message transmitted from the test message transmitting antenna; determining a true time of arrival of the test message at each receiving site, the true time of arrival comprising the measured time of arrival less a start time of the test message; determining a difference between the theoretical and the true times of arrival for each receiving site, wherein the difference for each receiving site is indicative of a health of the receiving site.

US Patent:

20140103465, Apr 17, 2014

Filed:

Oct 14, 2013

Appl. No.:

14/053580

Inventors:

- Melbourne FL, US
Madjid A. Belkerdid - Casselberry FL, US
Michael Keefe - West Melbourne FL, US

Assignee:

Mnemonics, Inc. - Melbourne FL

International Classification:

H03H 9/02

US Classification:

257416, 438 51

Abstract:

A surface acoustic wave (SAW) device package and method for packaging a SAW device provide a surface excited device having a small footprint, low cost and fabricated according to a unique manufacturing process. A substrate including a SAW active area on a first side is bonded to another similar sized substrate with a space sufficient to allow the propagation of the SAW on a top surface of the substrate. The two substrates have similar thermal expansion coefficients such that stress from the sealing process is minimized. The two substrates are sealed using either a low melting point glass or an organic compound such that conductive pathways exist through the seal allowing the internal device to access an external electrical connection.