Michael E Lambert

US Patent:

6395402, May 28, 2002

Filed:

Jun 9, 2000

Appl. No.:

09/590018

Inventors:

Michael Lambert - Randolph NJ
Satish Chandra - Scranton PA
Tony Sosnowski - Stroudsburg PA

Assignee:

Laird Technologies, Inc. - Delaware Water Gap PA

International Classification:

B22F 310

US Classification:

428550, 427304, 427305, 427306, 427404, 4274431, 106 125, 106 126, 106 128, 428613, 428672, 428675, 428680, 428929, 428936

Abstract:

Provided are methods of preparing an electrically conductive polymeric foam. The methods include the following steps: (a) contacting a polymeric foam with a surfactant solution; (b) contacting the polymeric foam with a sensitizing solution; (c) contacting the polymeric foam with an activation solution; and (d) forming at least one metallic layer on the polymeric foam with an electroless plating process. Also provided are electrically conductive polymeric foams formed by such methods. The present methods and foams have particular applicability to the manufacture of EMI (electromagnetic interference) shielding devices.

US Patent:

6870092, Mar 22, 2005

Filed:

Dec 4, 2002

Appl. No.:

10/310107

Inventors:

Michael Lambert - Randolph NJ, US
Jeff McFadden - Blairstown NJ, US
Philip van Haaster - Corona CA, US

Assignee:

Laird Technologies, Inc. - Delaware Water Gap PA

International Classification:

H05K009/00

US Classification:

174 35GC, 179 35 MS, 361816

Abstract:

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e. g. , plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.

US Patent:

6873031, Mar 29, 2005

Filed:

Mar 4, 2002

Appl. No.:

10/469812

Inventors:

Jeff McFadden - Blairstown NJ, US
Michael Lambert - Randolph NJ, US

Assignee:

Laird Technologies, Inc. - Delaware Water Gap PA

International Classification:

H01L023/552
H05K007/14

US Classification:

257659, 257660, 361800, 361816, 361818

Abstract:

A shielding device is provided in which a layer of deformable electrically conductive material is conformed to fit over the components on the board. In one embodiment of the invention the deformable material is conductive foam, such as metalized foam. One or both sides of the foam layer can be covered with dielectric material. Portions of the dielectric material and foam can be removed, such as from the bottom layer to create insulating slants over the components. Cuts in the deformable material lead to compression only over the component. The board can be placed over the components, which are received in recesses in the shield which are either preformed or result from compression of the deformable material at the location of the components. In one embodiment of the invention, regions of conductive layer are removed and the layer is placed over the components. A top layer is placed thereover.

US Patent:

RE41594, Aug 31, 2010

Filed:

Sep 5, 2006

Appl. No.:

11/516803

Inventors:

Michael Lambert - Randolph NJ, US
Jeff McFadden - Rochester NY, US
Philip van Haaster - Corona CA, US

Assignee:

Laird Technologies, Inc. - Chesterfield MO

International Classification:

H01R 4/48
H05K 9/00

US Classification:

174369, 174383, 454184, 361816

Abstract:

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e. g. , plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.

US Patent:

RE42512, Jul 5, 2011

Filed:

Nov 10, 2008

Appl. No.:

12/268250

Inventors:

Michael R. Lambert - Randolph NJ, US
Jeff McFadden - Blairstown NY, US
Philip van Haaster - Corona CA, US

Assignee:

Laird Technologies, Inc. - Chesterfield MO

International Classification:

H01R 4/48
H05K 9/00

US Classification:

174369, 174383, 454184, 361816

Abstract:

Disclosed are methods and apparatus for improving the resiliency and airflow through a honeycomb air vent filter while providing EMI shielding. In one embodiment, the honeycomb can be manufactured from a dielectric (e. g. , plastic) substrate to provide improved resistance to deformation as compared to conventional aluminum honeycomb. The dielectric honeycomb substrate is metallized to provide EMI shielding capability. The metallized honeycomb substrate is cut slightly oversize to fit an opening in an electronic enclosure, which results in elastic deformation of resilient perimeter spring fingers that are used to hold the metallized dielectric honeycomb in place and provide electrical conductivity between the metallized dielectric substrate and the enclosure, thereby eliminating the use of a frame. In another embodiment, additional conductive layers can be added to the metallized dielectric honeycomb. In yet another embodiment, the metallized dielectric honeycomb substrate can be utilized in a framed configuration to provide improved durability.