Michael G Lane

US Patent:

6359233, Mar 19, 2002

Filed:

Oct 26, 1999

Appl. No.:

09/426758

Inventors:

Steven C. Joy - Portland OR
Michael J. Lane - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 111

US Classification:

174255, 174250, 174256, 361737, 361739, 361774, 361779, 361792, 428901

Abstract:

Disclosed is a printed circuit board multipack, having a plurality of printed circuit boards (for example, a plurality of PCI compliant cards) provided using a common web of substrate material for a printed circuit board. Also disclosed is printed circuit board multipack structure, from which the multipack is formed, and individual printed circuit boards formed from the multipack, and methods of manufacture of each. Printed circuit board structures of the multipack have an internal edge, spaced from the periphery of the web, that is bevelled, and have conductive fingers, e. g. , with an electrodeposited gold uppermost layer, extending to the internal edge. The multipack structure includes a common bus bar running adjacent the inner boundary of the printed circuit board structures, and conductive extensions from a conductive base layer of the conductive fingers to the bus bar. Due to the conductive extensions and common bus bar, electrode-position of the gold for the conductive fingers can easily be performed. In forming the multipack from the multipack structure, the structure is bevelled at the inner boundary, using a circular bevelling blade, to both provide the bevelled inner edge and remove the common bus bar and conductive extensions.