Michael C Leach

US Patent:

62676555, Jul 31, 2001

Filed:

Jul 15, 1998

Appl. No.:

9/116311

Inventors:

David E. Weldon - Santa Clara CA
Michael Leach - Stockton CA
Charles J. Regan - Moraga CA
Linh X. Can - San Jose CA

Assignee:

Mosel Vitelic, Inc. - Hsinchu

International Classification:

B24B 722

US Classification:

451307

Abstract:

An improved wafer polishing machine is disclosed. In one embodiment, the wafer polishing machine has a movable polishing surface and a holder that holds an object, such as a semiconductor wafer, against the movable polishing surface. The holder includes a support structure that supports the object in contact with the polishing surface and an annular retaining ring that retains the object in alignment with the support structure. The retaining ring has a plurality of projections projecting inwardly from its inner circumference. The projections are evenly spaced around the inner circumference of the retaining ring. In one embodiment, the projections on the retaining ring define a circle with a diameter no less than the diameter of the object being polished. In an alternative embodiment, the retaining ring has a smooth, circular inner circumference formed from a flexible material which distends to from a continuous arc of contact with the wafer during polishing. Each retaining ring disclosed herein forms multiple points of contact or a continuous arc of contact between the retaining ring and the wafer, thereby reducing wafer buckling during polishing and improving surface uniformity.

US Patent:

57331758, Mar 31, 1998

Filed:

Apr 25, 1994

Appl. No.:

8/232375

Inventors:

Michael A. Leach - Palo Alto CA

International Classification:

B24B 100

US Classification:

451 41

Abstract:

A polishing machine for polishing a single side (e. g. a circuit side) of a workpiece (e. g. a semiconductor wafer) includes two platens. A first platen can be a workpiece-holding platen having slots or other structure for holding wafers or other workpieces. The second platen is a polishing platen and is covered with a polishing pad or other material used for polishing, e. g. glass or metal polishing. The two platens have laterally spaced axes of rotation such that, from a top view, the right side of one platen overlaps the left side of the other platen or vice versa. The two platens are both rotated at the same angular velocity i. e. at the same revolutions per minute (RPM) and both clockwise or both counterclockwise, and the two platens overlap such that the differences in velocity (i. e. , relative velocity) between overlapping points on the two platens across a workpiece held on the first platen is constant. A second embodiment of the polishing machine uses one or more polishing rollers, instead of the polishing platen described above.

US Patent:

58368078, Nov 17, 1998

Filed:

Apr 25, 1996

Appl. No.:

8/638056

Inventors:

Michael A. Leach - Palo Alto CA

International Classification:

B24B 100

US Classification:

451 41

Abstract:

A number of blocks are reciprocably supported in a polishing apparatus in accordance with this invention, entirely independent of each other so that lifting motion of one block is not transferred to an adjacent block, thus providing flexibility to follow the global curvature of the wafer. The polishing apparatus uses a block of a very hard design to ensure minimal deflection of the block into the microstructure of the wafer. Each block removes a portion of the wafer using relative motion between the block and the wafer. Each block is supported by at least three regions of the wafer during the relative motion, wherein each of the regions has the slowest rate of material removal in a die enclosing that region. In one embodiment, the smallest dimension of a block is approximately three times the size of the side of a die. The three point support and hard design of the blocks ensure local polishing removal uniformity while the independent support of the blocks ensures global uniformity, thus achieving an advantage over the conventional polishing process and apparatus.

US Patent:

56073410, Mar 4, 1997

Filed:

Aug 8, 1994

Appl. No.:

8/287639

Inventors:

Michael A. Leach - Palo Alto CA

International Classification:

B24B 100

US Classification:

451 41

Abstract:

A number of blocks are reciprocably supported in a polishing apparatus in accordance with this invention, entirely independent of each other so that lifting motion of one block is not transferred to an adjacent block, thus providing flexibility to follow the global curvature of the wafer. The polishing apparatus uses a block of a very hard design to ensure minimal deflection of the block into the microstructure of the wafer. Each block removes a portion of the wafer using relative motion between the block and the wafer. Each block is supported by at least three regions of the wafer during the relative motion, wherein each of the regions has the slowest rate of material removal in a die enclosing that region. In one embodiment, the smallest dimension of a block is approximately three times the size of the side of a die. The three point support and hard design of the blocks ensure local polishing removal uniformity while the independent support of the blocks ensures global uniformity, thus achieving an advantage over the conventional polishing process and apparatus.

US Patent:

57022909, Dec 30, 1997

Filed:

Apr 8, 1996

Appl. No.:

8/631289

Inventors:

Michael A. Leach - Palo Alto CA

International Classification:

B24B 100
B24B 719
B24B 730

US Classification:

451 41

Abstract:

A number of blocks are reciprocably supported in a polishing apparatus in accordance with this invention, entirely independent of each other so that lifting motion of one block is not transferred to an adjacent block, thus providing flexibility to follow the global curvature of the wafer. The polishing apparatus uses a block of a very hard design to ensure minimal deflection of the block into the microstructure of the wafer. Each block removes a portion of the wafer using relative motion between the block and the wafer. Each block is supported by at least three regions of the wafer during the relative motion, wherein each of the regions has the slowest rate of material removal in a die enclosing that region. In one embodiment, the smallest dimension of a block is approximately three times the size of the side of a die. The three point support and hard design of the blocks ensure local polishing removal uniformity while the independent support of the blocks ensures global uniformity, thus achieving an advantage over the conventional polishing process and apparatus.

US Patent:

20180207349, Jul 26, 2018

Filed:

Jul 22, 2016

Appl. No.:

15/745157

Inventors:

- Warsaw IN, US
Richard Wood Storrs - Berkeley CA, US
Michael D. Leach - Warsaw IN, US
Ned M. Hamman - Leesburg IN, US
Joel Carne - Holly MI, US

International Classification:

A61M 1/36
A61M 1/02
B01L 3/00

Abstract:

Disclosed is a device for separating a cellular component from a multicomponent fluid. The device can comprise a body, a first acoustic wave generator, and a second acoustic wave propagating component. The body can define a channel having a first surface and a second surface opposite the first surface. The channel can extend along a longitudinal axis from a first end to a second end. The first acoustic wave generator can be coupled to the first surface. The first acoustic wave generator can be configured to generate an acoustic wave having a wavelength. The second acoustic wave propagating component can be coupled to the second surface. The second surface can be spaced an integer fractional multiple of the wavelength from the first surface and each integer factional multiple equals a number of pressure nodes within the channel.

US Patent:

20170165117, Jun 15, 2017

Filed:

Feb 13, 2017

Appl. No.:

15/431589

Inventors:

- New Orleans LA, US
Richard W. STORRS - Berkeley CA, US
Michael D. LEACH - Warsaw IN, US
Alexander B. IZVORSKI - San Francisco CA, US

Assignee:

Hanuman Pelican, Inc. - New Orleans LA

International Classification:

A61F 13/00
A61F 13/02
A61M 35/00

Abstract:

Oxygen diffusive wound dressings and methods of manufacturing and use are described herein. The wound dressing may generally provide a ready supply of oxygen to a wound being treated via one or more oxygen conduits which are designed to pass oxygen from ambient air or other oxygen reservoirs into proximity to the wound, and may also provide for exudate removal through transecting channels in fluid communication with both the wound surface and a hydrophilic absorbent material.

US Patent:

20140154234, Jun 5, 2014

Filed:

Oct 25, 2013

Appl. No.:

14/063648

Inventors:

- Warsaw IN, US
Richard W. Storrs - Berkeley CA, US
Michael D. Leach - Warsaw IN, US

Assignee:

Biomet Biologics, LLC - Warsaw IN

International Classification:

C12N 9/74
A61K 38/48

US Classification:

424 9464, 435214

Abstract:

Methods of generating thrombin and methods of applying a clotting tissue sealant to a site on a subject are provided. A blood component comprising platelets can be obtained from the subject. A hypotonic composition is contacted with a solid matrix to form a thrombin-containing liquid, where the hypotonic composition includes water, calcium, a blood component comprising platelets, and optionally a chelator. Calcium is present in the hypotonic composition in an amount greater than the amount of calcium that can be complexed by the chelator. Thrombin-containing liquid is then separated from the hypotonic composition and can be applied to the site on the subject to form a clot, for example, by combination with fibrinogen.