Michael A Matthews

Address:

18812 Caminito Cantilena UNIT 127, San Diego, CA 92128

Phone:

7605337841

VIN:

5TFDY5F12CX242971

Make:

TOYOTA

Model:

TUNDRA

Year:

2012

US Patent:

7440290, Oct 21, 2008

Filed:

May 17, 2004

Appl. No.:

10/848024

Inventors:

Michael G. Matthews - Carlsbad CA, US
Kevin Cousineau - Ramona CA, US
Scott C. Asbill - Carlsbad CA, US

Assignee:

QUALCOMM Incorporated - San Diego CA

International Classification:

H05K 1/18

US Classification:

361761, 361764, 338 69

Abstract:

The present invention provides systems, devices and methods for controlling a desired output of an output device. These systems, devices and methods include connecting an electrical resistance element having a selected one of a plurality of resistance values with an electrical circuit portion having a plurality of electrical components, determining an electrical characteristic associated with the connected electrical circuit portion and the variable resistance element, and generating a control signal based on the electrical characteristic to control the desired output of the output device.

US Patent:

8028191, Sep 27, 2011

Filed:

May 7, 2010

Appl. No.:

12/775743

Inventors:

William P. Brown - Bellevue WA, US
Michael B. Matthews - Kirkland WA, US
Ron Unrau - Edmonton, CA
Dale Hagglund - Edmonton, CA

Assignee:

EMC Corporation - Hopkinton MA

International Classification:

G06F 11/00

US Classification:

714 6

Abstract:

Multiple Array Management Functions (AMFs) are connected to multiple redundancy groups over a storage area network (SAN), such as a fiber-channel based SAN. The multiple AMFs share management responsibility of the redundancy groups, each of which typically includes multiple resources spread over multiple disks. The AMFs provide concurrent access to the redundancy groups for associated host systems. When a host requests an AMF to perform an operation on a resource, the AMF synchronizes with the other AMFs sharing control of the redundancy group that includes the resource to be operated on, so as to obtain access to the resource. While performing the operation, the AMF send replication data and state information associated with the resource such that if the AMF fails, any of the other AMFs are able to complete the operation and maintain data reliability and coherency.

US Patent:

8221518, Jul 17, 2012

Filed:

Mar 31, 2010

Appl. No.:

12/751030

Inventors:

Catherine Shearer - San Marcos CA, US
Kenneth C. Holcomb - San Diego CA, US
G. Delbert Friesen - Huntington Beach CA, US
Michael C. Matthews - Encinitas CA, US

Assignee:

Ormet Circuits, Inc. - San Diego CA

International Classification:

B22F 1/00
B23K 31/00

US Classification:

75252, 252513, 252514, 2282481, 228249

Abstract:

The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal. Combination of the three particle types provides several advantages including reduction of the undesirable characteristics of the carrier metal while preserving and, in some embodiments, enhancing, the advantageous facilitation of the metallic reaction.

US Patent:

8289724, Oct 16, 2012

Filed:

Aug 4, 2008

Appl. No.:

12/185711

Inventors:

Michael G. Matthews - Carlsbad CA, US
Kevin Cousineau - Ramona CA, US
Scott C. Asbill - Carlsbad CA, US

Assignee:

QUALCOMM Incorporated - San Diego CA

International Classification:

H05K 1/18

US Classification:

361761, 361782, 361784, 338 69

Abstract:

The present invention provides devices for controlling a desired output of an output device. These devices include a first conductor, a second conductor having a varying, predetermined spacing from the first conductor, and a third conductor positioned on the actuator mechanism and having a plurality of interconnecting positions between the first conductor and the second conductor. A predetermined one of a plurality of output signals may be produced when the third conductor connects the first conductor and the second conductor to control the desired output of the output device.

US Patent:

20110171372, Jul 14, 2011

Filed:

Nov 5, 2010

Appl. No.:

12/940203

Inventors:

Catherine Shearer - San Marcos CA, US
Kenneth C. Holcomb - San Diego CA, US
G. Delbert Friesen - Huntington Beach CA, US
Michael C. Matthews - Encinitas CA, US

Assignee:

ORMET CIRCUITS, INC. - San Diego CA

International Classification:

B05D 5/12
B05D 5/00
B05D 3/02
B22F 1/00
B22F 1/02
C08K 3/08

US Classification:

427123, 75255, 75228, 524439, 524440

Abstract:

The present invention provides conductive metal compositions for electronic applications, and methods of preparation and uses thereof. More specifically, the present invention provides metallic particle transient liquid phase sintering compositions containing blended formulations of metal and metal alloy components that form interconnected conductive metallurgical networks with increased stability, resistance to thermal stress and ability to mitigate CTE mismatch between materials.

US Patent:

20140042212, Feb 13, 2014

Filed:

Dec 31, 2012

Appl. No.:

13/732308

Inventors:

Peter A. Matturri - Del Mar CA, US
Kenneth C. Holcomb - San Diego CA, US
Michael C. Matthews - Encinitas CA, US

Assignee:

Ormet Circuits, Inc. - San Diego CA

International Classification:

B23K 35/02
B23K 1/20

US Classification:

2282481, 75255, 75252, 75338

Abstract:

Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties.

US Patent:

62676296, Jul 31, 2001

Filed:

May 26, 1999

Appl. No.:

9/318716

Inventors:

Cam T. Nguyen - San Diego CA
Darrin J. Marthens - Poway CA
Michael G. Matthews - Poway CA
David J. Saltzman - San Diego CA

Assignee:

Qualcomm Incorporated - San Diego CA

International Classification:

H01R 1122
H01R 1311

US Classification:

439857

Abstract:

A method of clipping and a clip configured to retain a cover onto a circuit board. The clip comprises a base plate having right and left sides. The base plate is configured to be fixed to the circuit board. The clip further comprises at least two right walls connected to and extending upwardly away from the base plate. Each of the right walls has a right upper portion. The clip further comprises at least two left walls connected to and extending upwardly away from the base. Each of the left walls has a left upper The right and left walls are spring biased inwardly so that at least a portion of the right and left upper portions overlap. In another embodiment, the right wall includes at least one opening and the left wall includes a middle segment extending towards the opening of the right wall.

US Patent:

20200180233, Jun 11, 2020

Filed:

Feb 14, 2020

Appl. No.:

16/791134

Inventors:

- San Diego CA, US
Peter A. MATTURRI - Del Mar CA, US
Michael C. MATTHEWS - Encinitas CA, US

International Classification:

B29C 65/48
B32B 37/12
B29C 65/50

Abstract:

An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.