Michael R Mcallister

US Patent:

6342788, Jan 29, 2002

Filed:

Jun 2, 1999

Appl. No.:

09/324497

Inventors:

Michael Ford McAllister - Clintondale NY
Gerhard Ruehle - Sommerhofenstrasse, DE

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 3102

US Classification:

324754, 324758, 324757, 324761, 324765

Abstract:

A probe test assembly for testing electronic devices maintained at lowered temperatures includes heaters and flows of dried air to prevent condensation from forming on the devices. The devices have pins received in an electrically non-conductive system board, and the probe test assembly includes a heat conductive and electrically conductive apertured probe plate to transfer heat from the heaters to the system board. Grounding pins extend from the probe plate to grounding pads on the system board, and a non-conductive apertured pattern plate spaced above the probe plate protects exposed ends of the grounding pins. In an alternate embodiment, the pattern plate is omitted in favor of a conductive intermediate plate and a superposed non-conductive contact plate. Signal pins extend from the system board to the contact plate in order to transfer contact points for electronic device from the system board to the contact plate. A multipin connector can be connected to the contact plate to enable the transmission of signals from the devices under test to a computer.

US Patent:

6429644, Aug 6, 2002

Filed:

Mar 16, 2000

Appl. No.:

09/527577

Inventors:

Michael F. McAllister - Clintondale NY
Klaus K. Kempter - Holzgerlingen, DE
Charles F. Pells - Wappingers Falls NY
Stephan R. Richter - Boeblingen, DE
Gerhard Ruehle - Sindelfingen, DE

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 104

US Classification:

3241581, 324754

Abstract:

A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e. g. , a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPUs) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.

US Patent:

6433562, Aug 13, 2002

Filed:

Aug 28, 1998

Appl. No.:

09/143228

Inventors:

Michael F. McAllister - Clintondale NY
Klaus K. Kempter - Holzgerlingen, DE
Charles F. Pells - Wappingers Falls NY
Stephan R. Richter - Boeblingen, DE
Gerhard Ruehle - Sommerhofenstrasse, DE

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 3128

US Classification:

324754, 3241581

Abstract:

A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e. g. , a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPUs) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.

US Patent:

6444919, Sep 3, 2002

Filed:

Jun 7, 1995

Appl. No.:

08/477054

Inventors:

Laertis Economikos - Wappingers Falls NY
Mukta Shaji Farooq - Hopewell Junction NY
Michael Ford McAllister - Clintondale NY
Eric Daniel Perfecto - Poughkeepsie NY
Chandrika Prasad - Wappingers Falls NY
Keshav Prasad - San Jose CA
Madhavan Swaminathan - Marietta GA
Thomas Anthony Wassick - Wappingers Falls NY
George White - Hoffman Estates IL

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H05K 103

US Classification:

174255, 174262, 174261

Abstract:

A thin film wiring scheme on a substrate. The thin film wiring scheme includes a plurality of chip connection pads at each of a first and second chip site on the substrate, a plurality of directional wiring lines interspersed between the chip connection pads at each of the first and second chip sites, at least one of the directional wiring lines being orthogonal to at least one of the other directional wiring lines at each of the first and second chip sites, and a plurality of chip site interconnection lines connecting directional wiring lines at the first chip site with the directional wiring lines at the second chip site.

US Patent:

6462573, Oct 8, 2002

Filed:

Mar 16, 2000

Appl. No.:

09/527576

Inventors:

Michael F. McAllister - Clintondale NY
Klaus K. Kempter - Holzgerlingen, DE
Charles F. Pells - Wappingers Falls NY
Stephan R. Richter - Boeblingen, DE
Gerhard Ruehle - Sommerhofenstrasse, DE

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 3102

US Classification:

324757, 3241581

Abstract:

A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e. g. , a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPUs) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.

US Patent:

6529023, Mar 4, 2003

Filed:

May 17, 2001

Appl. No.:

09/860189

Inventors:

Wiren D. Becker - Hyde Park NY
Michael F. McAllister - Clintondale NY
Gerhard Ruehle - Sindelfingen, DE

Assignee:

International Business Machines Corporation

International Classification:

G01R 3128

US Classification:

324754, 3241581

Abstract:

A counterbalancing arrangement for use with a compressive land grid array connector system provides a counterbalancing load element at a side of a system circuit board opposite a back side holding an integrated circuit chip substrate via the connector system. In a first aspect, the counterbalancing load element is a probe template and spacer element providing measurement across to the integrated circuiting. In another aspect, the counterbalancing load element is a mirror image integrated circuit land grid array connector system.

US Patent:

6538460, Mar 25, 2003

Filed:

Mar 16, 2000

Appl. No.:

09/526956

Inventors:

Michael F. McAllister - Clintondale NY
Klaus K. Kempter - Holzgerlingen, DE
Charles F. Pells - Wappingers Falls NY
Stephan R. Richter - Boeblingen, DE
Gerhard Ruehle - Sommerhofenstrasse 67, DE

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 3128

US Classification:

324754, 3241581

Abstract:

A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned at the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e. g. , a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as a MCM or Single Chip Module (SCM) having additional Central Processing Units (CPUs) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.

US Patent:

6549024, Apr 15, 2003

Filed:

Jul 19, 2002

Appl. No.:

10/199771

Inventors:

Michael F. McAllister - Clintondale NY
Klaus K. Kempter - Holzgerlingen, DE
Charles F. Pells - Wappingers Falls NY
Stephan R. Richter - Boeblingen, DE
Gerhard Ruehle - Sindelfingen, DE

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G01R 3128

US Classification:

324754, 3241581

Abstract:

A method and apparatus of interconnecting with a system board is presented. A system board having a metal stiffener mounted thereon is provided with an opening in the stiffener to provide access to an area of interest on the system board. A probe test assembly is positioned a the opening and secured to the stiffener when testing is desired to provide access to the pins of the device under test (e. g. , a Multi Chip Module (MCM) on the system board). Alternatively, a system enhancement device, such as an MCM or Single Chip Module (SCM) having additional Central Processing Units (CPUs) or other features, may be installed on the system board at the opening in the stiffener to enhance the function of the system board. Another alternate includes an interface assembly positioned at the opening in the stiffener. A cover is positioned at the opening and secured to the stiffener at all other times.