Michael O'Toole

US Patent:

6860649, Mar 1, 2005

Filed:

Dec 27, 2001

Appl. No.:

10/034792

Inventors:

Philip J. Edwards - San Jose CA, US
Bradley S. Levin - Newark CA, US
Michael M. O'Toole - San Jose CA, US
Joseph L. Vandenberg - West Covina CA, US
Lee L. Xu - Cupertino CA, US

International Classification:

G02B006/42

US Classification:

385 92

Abstract:

A testable optical subassembly comprising a unitary structure of an optically-clear moldable material having at least the following features: (a) an optical path for transmitting optical signals between a fiber and an optoelectric device (OED); (b) a ferrule-receiving bore for receiving a ferrule and aligning a fiber held therein to the optical path; and (c) an OED-receiving cavity for receiving a lead frame and aligning an OED mounted thereon to the optical path along one or more axes.

US Patent:

6893170, May 17, 2005

Filed:

Nov 1, 2002

Appl. No.:

10/285949

Inventors:

Phillip J. Edwards - San Jose CA, US
Bradley S. Levin - Palo Alto CA, US
Oliver W. Northrup - Mountain View CA, US
Michael M. O'Toole - San Jose CA, US
Joseph John Vandenberg - West Covina CA, US

International Classification:

G02B006/12

US Classification:

385 93, 385 88, 385 89, 385 90, 385 91, 385 92, 439577, 438422

Abstract:

An electro-optic module with an optical coupling efficiency, the module comprising a receptacle assembly, wherein an end of the receptacle assembly is capable of receiving a light guiding element and wherein an opposite end of the receptacle assembly is capable of receiving an optical lens assembly positioned therein the receptacle assembly. An optoelectric package which includes an optoelectronic device is capable of being affixed to the opposite end of the receptacle assembly wherein an optical axis extends from the end to the opposite end of the receptacle assembly such that the light guiding element and the optoelectric device are in communication through a lens included in the optical lens assembly. The optical lens assembly is held fixedly in place against an inward periphery of the receptacle assembly such that a distance between the lens and the optoelectronic device can be adjusted to adjust the optical coupling efficiency.

US Patent:

6913400, Jul 5, 2005

Filed:

Jul 9, 2001

Appl. No.:

09/901293

Inventors:

Michael M. O'Toole - San Jose CA, US
Bradley S. Levin - Newark CA, US
Philip J. Edwards - San Jose CA, US
Lee L. Xu - Cupertino CA, US
Joseph J. Vandenberg - West Covina CA, US
Joseph Markham - Hillsborough NJ, US

Assignee:

Tyco Electronics Corporation - Middletown PA

International Classification:

G02B006/36

US Classification:

385 89, 385 88

Abstract:

An optoelectric module adapted to cooperate with a multi-fiber array by displacing a plurality of OEDs from the fiber array at least along the z,y-axes or a combination thereof while maintaining their alignment along either the x-axis of the fiber array, the module comprising: (a) a connector interface adapted to interconnect with a multi-fiber assembly having an x,y array of fibers; (b) a plurality of OEDs for converting between optical and electrical signals; and (c) optical paths wherein each optical path has a first end adapted for optically coupling with a corresponding fiber in an x,y array of fibers and a second end for optically coupling with a corresponding OED, wherein the distance between the second ends of at least two optical paths is greater than the distance between their corresponding first ends and wherein the distance across the second ends along the x-axis is no greater than the distance across the first ends along the x-axis.

US Patent:

43704050, Jan 25, 1983

Filed:

Mar 30, 1981

Appl. No.:

6/248927

Inventors:

Michael M. O'Toole - San Jose CA
En-Den D. Liu - Mountain View CA
Mark S. Chang - Sunnyvale CA

Assignee:

Hewlett-Packard Company - Palo Alto CA

International Classification:

G03C 500

US Classification:

430312

Abstract:

An improved photoetch technique is presented of the multilayer resist type wherein a thin top layer of resist and a thick planarizing layer are deposited on a substrate and the thin layer is exposed and developed to produce a patterned resist layer. The improvement involves dissolving a suitable dye in a layer between the thin top layer and the substrate. The dye is preferably selected to absorb light of the wavelengths used to expose the top layer but does not interfere with processing of the other layers.