Michael Andrew Petras

US Patent:

20170301577, Oct 19, 2017

Filed:

May 30, 2017

Appl. No.:

15/607888

Inventors:

- San Jose CA, US
Robert E. JONES - Colorado Springs CO, US
Michael F. PETRAS - Phoenix AZ, US
Chandrasekaram RAMIAH - Phoenix AZ, US

Assignee:

Invensas Corporation - San Jose CA

International Classification:

H01L 21/683
H01L 21/768
H01L 25/00
H01L 25/16
H01L 25/065
H01L 25/065
H01L 23/00
H01L 23/00
H01L 23/00
H01L 23/00
H01L 23/00
H01L 23/00
H01L 23/58
H01L 23/538
H01L 23/48
H01L 23/367
H01L 27/02
H01L 27/06

Abstract:

Methods of forming 3-D ICs with integrated passive devices (IPDs) include stacking separately prefabricated substrates. An active device (AD) substrate has contacts on its upper portion. A ground plane is located between the AD substrate and an IPD substrate. The ground plane provides superior IPD to AD cross-talk attenuation.

US Patent:

20160111404, Apr 21, 2016

Filed:

Dec 21, 2015

Appl. No.:

14/977214

Inventors:

- San Jose CA, US
Robert E. Jones - Colorado Springs CO, US
Michael F. Petras - Phoenix AZ, US
Chandrasekaram RAMIAH - Phoenix AZ, US

International Classification:

H01L 25/16
H01L 27/02
H01L 23/367
H01L 23/538

Abstract:

Methods of forming 3-D ICs with integrated passive devices (IPDs) include stacking separately prefabricated substrates coupled by through-substrates-vias (TSVs). An active device (AD) substrate has contacts on its upper portion. An isolator substrate is bonded to the AD substrate so the TSVs in the isolator substrate are coupled to the contacts on the AD substrate. An IPD substrate is bonded to the isolator substrate so that TVs therein are coupled to an interconnect zone on the isolator substrate and/or TSVs therein. The IPDs of the IPD substrate are coupled by TSVs in the IPD and isolator substrates to devices in the AD substrate. The isolator substrate provides superior IPD to AD cross-talk attenuation while permitting each substrate to have small high aspect ratio TSVs, thus facilitating high circuit packing density and efficient manufacturing.