Michael Don Pierce

US Patent:

20200118949, Apr 16, 2020

Filed:

Oct 10, 2019

Appl. No.:

16/598483

Inventors:

- Dallas TX, US
Michael Paul Pierce - Allen TX, US

International Classification:

H01L 23/66
H01L 23/16
H01L 23/498
H01L 23/00
H01L 21/48
H01Q 1/22

Abstract:

A package includes a substrate, a conductive layer on a first surface of the substrate forming a set of antennas, and a semiconductor die forming communication channels for the antennas, each of the communication channels being electrically coupled to the antennas by way of a redistribution layer that includes the substrate, the semiconductor die being mounted on either the first surface or an opposing second surface of the substrate. The package further includes a set of electrical contacts on the second surface of the substrate, the redistribution layer further coupling the set of electrical contacts to the semiconductor die. The package further includes a stiffening layer over the first surface of the substrate, the stiffening layer forming gaps over the antennas such that the antennas are on an outer surface of the package.

Address:

215 Vz Crk 1218, Canton, TX 75103

Phone:

9038295079

VIN:

KNAGM4A75B5142269

Make:

KIA

Model:

OPTIMA

Year:

2011