Michael J Prichard

US Patent:

7019967, Mar 28, 2006

Filed:

Dec 1, 2004

Appl. No.:

11/002484

Inventors:

John DiFonzo - Emerald Hill CA, US
Stephen Zadesky - Redwood City CA, US
Michael Prichard - Oakland CA, US

Assignee:

Apple Computer, Inc. - Cupertino CA

International Classification:

H05K 7/20

US Classification:

361687, 361699, 174 35 R, 3122232, 165 802

Abstract:

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

US Patent:

7054965, May 30, 2006

Filed:

Mar 18, 2003

Appl. No.:

10/391277

Inventors:

Jory Bell - San Francisco CA, US
Michael Prichard - Oakland CA, US
Nicholas G. L. Merz - San Carlos CA, US
Jonathan Betts-LaCroix - Chatsworth CA, US

Assignee:

OQO Incorporated - San Francisco CA

International Classification:

G06F 13/00

US Classification:

710 72, 710 2, 710 17, 710100, 710300, 345 11, 345 22, 345156, 345169

Abstract:

A core component is disclosed which includes a processing module and a touch screen. The core component may operate by itself in a first mode to perform functions similar to that of a conventional personal digital assistant (PDA). In particular, the touch screen may both provide visual output and receive input from a user's finger when the core component operates in the first mode. When the core component is connected to another component including a display screen, the core component may operate in a second mode in which input received through the touch screen is provided to the other component. For example, the movement of a user's finger may control the position of a cursor displayed on a screen of the other component so that the core component exhibits the behavior of a trackpad when operating in the second mode.

US Patent:

D524809, Jul 11, 2006

Filed:

Dec 7, 2004

Appl. No.:

29/218873

Inventors:

Vince Alcouloumre - San Carlos CA, US
Jory Bell - San Francisco CA, US
Jonathan Betts-LaCroix - San Mateo CA, US
Vance Chin - San Francisco CA, US
Robert Ford - Kensington CA, US
Mike Furlotti - San Francisco CA, US
Robert Kelley - Portland OR, US
Nick Merz - San Carlos CA, US
Michael Prichard - Carlisle MA, US
Mindy Ward - San Francisco CA, US

Assignee:

OQO, Inc. - San Francisco CA

International Classification:

1402

US Classification:

D14341

US Patent:

7301761, Nov 27, 2007

Filed:

Jan 19, 2006

Appl. No.:

11/336102

Inventors:

Nick Merz - San Carlos CA, US
John DiFonzo - Emerald Hill CA, US
Michael Prichard - Oakland CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

G06F 1/16

US Classification:

361681, 248694

Abstract:

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

US Patent:

7457111, Nov 25, 2008

Filed:

Jan 17, 2007

Appl. No.:

11/624141

Inventors:

Nick Merz - San Carlos CA, US
John DiFonzo - Emerald Hill CA, US
Stephen Zadesky - Redwood City CA, US
Michael Prichard - Oakland CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

G06F 1/16

US Classification:

361685, 369 7721

Abstract:

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

US Patent:

7835147, Nov 16, 2010

Filed:

Oct 16, 2008

Appl. No.:

12/253126

Inventors:

Nick Merz - San Carlos CA, US
John DiFonzo - Emerald Hill CA, US
Stephen Zadesky - Redwood City CA, US
Michael Prichard - Oakland CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

G06F 1/16

US Classification:

36167934

Abstract:

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

US Patent:

8050028, Nov 1, 2011

Filed:

Oct 26, 2010

Appl. No.:

12/912671

Inventors:

Nick Merz - San Francisco CA, US
John DiFonzo - Emerald Hills CA, US
Stephen Zadesky - Portola Valley CA, US
Michael Prichard - Oakland CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

H05K 7/20

US Classification:

36167947, 36167952, 36167954, 36167955, 361690, 361700, 361714, 165 803, 165 804, 165 805, 16510421, 16510426, 16510433, 16510434

Abstract:

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

US Patent:

8605426, Dec 10, 2013

Filed:

Sep 23, 2011

Appl. No.:

13/244108

Inventors:

Nick Merz - San Francisco CA, US
John DiFonzo - Emerald Hills CA, US
Stephen Zadesky - Portola Valley CA, US
Michael Prichard - Oakland CA, US

Assignee:

Apple Inc. - Cupertino CA

International Classification:

H05K 7/20

US Classification:

36167948, 36167947, 36167952, 36167954, 36167955, 361714, 165 802, 16510421, 16510426, 16510433, 165121, 165185

Abstract:

A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.