Michael J Roush

US Patent:

53827597, Jan 17, 1995

Filed:

Sep 28, 1993

Appl. No.:

8/127912

Inventors:

James C. Kei Lau - Torrance CA
Richard P. Malmgren - Castaic CA
Michael Roush - Farmington Hills MI

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H05K 102

US Classification:

174264

Abstract:

An electrical interconnect and a method of fabricating an electrical interconnect are provided. A first transparent dielectric layer is disposed on top of a support structure. A conductive circuit layer is plated above the first dielectric layer. Separate conductive layers are plated on top of the conductive circuit layer to produce conductive vias. A second transparent dielectric layer is disposed around the conductive layers. Contact tips are electrically connected to the top surface of the separate conductive layers. The interconnect may be visually aligned so that the contact tips brought into contact with target connections. In addition, the support structure may be partially removed to allow a flexible interconnect.

US Patent:

58937277, Apr 13, 1999

Filed:

Aug 13, 1996

Appl. No.:

8/689629

Inventors:

James Chung Kei Lau - Torrance CA
Richard P. Malmgren - Castaic CA
Michael Roush - Farmington Hills MI

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H01L 2148

US Classification:

438125

Abstract:

A method of fabricating an electrical interconnect are provided. A first transparent dielectric layer is disposed on top of a support structure. A conductive circuit layer is plated above the first dielectric layer. Separate conductive layers are plated on top of the conductive circuit layer to produce conductive vias. A second transparent dielectric layer is disposed around the conductive layers. Contact tips are electrically connected to the top surface of the separate conductive layers. The interconnect may be visually aligned so that the contact tips brought into contact with target connections. In addition, the support structure may be partially removed to allow a flexible interconnect.