Michael J Runyan

US Patent:

7032651, Apr 25, 2006

Filed:

Jun 23, 2003

Appl. No.:

10/601385

Inventors:

David T. Winslow - Culver City CA, US
Michael Runyan - Torrance CA, US
Scott T. Johnson - Torrance CA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

F28F 7/02

US Classification:

165 804, 165185

Abstract:

A heat exchanger apparatus including a two-dimensional array of heat exchanging conduits, wherein each conduit includes an inlet and an outlet, and a manifold for providing heat exchanging fluid to the inputs of the heat exchanging conduits and for receiving heat exchanging fluid from the outputs of the heat exchanging conduits.

US Patent:

49806351, Dec 25, 1990

Filed:

Dec 26, 1984

Appl. No.:

6/686335

Inventors:

R. Thomas Walton - Torrance CA
James A. Hathaway - Redondo Beach CA
Michael D. Runyan - Torrance CA
Michael L. Turnage - Sunnymead CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

G01R 100
G01R 102

US Classification:

324158F

Abstract:

A carrier for an integrated circuit package is disclosed which comprises a base (30) suitable for receiving an integrated circuit package with unformed leads (20') or formed leads (20), a cover (60), flexible material (66), such as an elastomer, disposed between the cover (60) and base (30) surfaces, and pressure is maintained across the cover (60) and base (30) by way of finger (44) on a clip (40) on the base (30) engaging latching edges (68) of cover (60). The leads (22) of the integrated circuit package (20, 20') are thereby secured in position by the elastomeric material (66) which forms itself partially around each of the leads in response to pressure applied across the base (30) and cover (60) as hereinabove described. The disclosed invention eliminates the need for separate grooves or nests in the base (30) of the carrier for each lead of the integrated circuit package.

US Patent:

52508455, Oct 5, 1993

Filed:

Nov 30, 1990

Appl. No.:

7/621182

Inventors:

Michael D. Runyan - Torrance CA

Assignee:

Hughes Aircraft Company - Los Angeles CA

International Classification:

H01L 2302
H01L 2312

US Classification:

257729

Abstract:

The hermetic module (10) has a frame 12 with an integral heat sink panel (20) extending thereacross between the side walls (14, 16). High-density integrated circuit electronics are mounted on the heat sink panel by hybrid assembly techniques. Covers (36, 38) are welded to the walls to achieve closure. Feedthrough 74 includes connector block (84) extending through an opening in front bulkhead (76). The front bulkhead is Kovar clad, and seal is achieved by means of a Kovar flexible seal extending between the Kovar side of the front bulkhead and the Kovar ring on the connector block.

US Patent:

20150270671, Sep 24, 2015

Filed:

Mar 24, 2014

Appl. No.:

14/223028

Inventors:

- Waltham MA, US
Clifton Quan - Arcadia CA, US
Chad E. Patterson - Marina Del Ray CA, US
Michael D Runyan - Torrance CA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H01P 1/06

Abstract:

A rotary joint includes a contactless electrical connection that has an annular shape, not extending into a central region surrounded and defined by the annular contactless electrical connection. The annular shape of the electrical connection portions allows other uses for the central region, such as for passing an optical signal through the rotary joint. Feeds are coupled to annular waveguide structures in both halves of the rotary joint, for input and output of signals. The feeds may provide connections to the annular waveguide structures at regularly-spaced circumferential intervals around the waveguide structures, such as at about every half-wavelength of the incoming (and outgoing) signals. The annular waveguide structures propagate signals in an axial direction, parallel to the axis of rotation of the rotary joint. The signals propagate contactlessly (non-electrically-conductively) across a gap in the axial direction between the two annular waveguides.