Michael L Rush

US Patent:

59001860, May 4, 1999

Filed:

Feb 25, 1998

Appl. No.:

9/030687

Inventors:

John Fakler - Phoenix AZ
Michael Rush - Scottsdale AZ
Scott Campbell - Fountain Hills AZ

Assignee:

Morton International, Inc. - Chicago IL

International Classification:

B44C 122

US Classification:

252 791

Abstract:

A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

US Patent:

63226561, Nov 27, 2001

Filed:

Dec 19, 1995

Appl. No.:

8/574954

Inventors:

John Fakler - Phoenix AZ
Michael Rush - Scottsdale AZ
Scott Campbell - Fountain Hills AZ

Assignee:

Morton International, Inc. - Chicago IL

International Classification:

B32B 3100

US Classification:

156281

Abstract:

An improvement in a method of bonding copper and a resin together wherein a copper oxide layer is formed on the surface of copper by the oxidation of metallic copper, the copper oxide layer is reduced to metallic copper with an aqueous reducing solution containing at least one amine borane represented by the general formula: BH. sub. 3 NHRR' (wherein R and R' are each a member selected from the group consisting of H, CH. sub. 3, and CH. sub. 2 CH. sub. 3), and the metallic copper is bonded to a resin. According to the improvement, a reducing stabilizer is added to the reducing solution in an amount sufficient to decrease consumption of the amine borane during reduction to a level less than that consumed in the absence of the reducing stabilizer during the course of the copper oxide reduction process, wherein the stabilized reduction process is initiated in a reasonable time and the metallic copper layer resulting from the stabilized reduction process is resistant to acid attack. Examples of such reducing stabilizers include thio-containing (--C(. dbd. S)NH. sub. 2) compounds, triazole-containing (C. sub. 2 H. sub. 3 N. sub.

US Patent:

57533091, May 19, 1998

Filed:

Apr 3, 1996

Appl. No.:

8/627931

Inventors:

John Fakler - Phoenix AZ
Michael Rush - Scottsdale AZ
Scott Campbell - Fountain Hills AZ

Assignee:

Surface Tek Specialty Products, Inc. - Scottsdale AZ

International Classification:

B05D 500

US Classification:

427399

Abstract:

A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming members, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

US Patent:

57210144, Feb 24, 1998

Filed:

Dec 19, 1995

Appl. No.:

8/574946

Inventors:

John Fakler - Phoenix AZ
Michael Rush - Scottsdale AZ
Scott Campbell - Fountain Hills AZ

Assignee:

Surface Tek Specialty Products, Inc. - Scottsdale AZ

International Classification:

B05D 300

US Classification:

427299

Abstract:

A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing morpholine borane.

US Patent:

60869569, Jul 11, 2000

Filed:

Jan 19, 1999

Appl. No.:

9/232968

Inventors:

John Fakler - Phoenix AZ
Michael Rush - Scottsdale AZ
Scott Campbell - Fountain Hills AZ

Assignee:

Morton International Inc. - Chicago IL

International Classification:

C01G 302
C23C 2263
C03J 504
H05K 338

US Classification:

427299

Abstract:

A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.