Michael D Singer

US Patent:

62501275, Jun 26, 2001

Filed:

Oct 11, 1999

Appl. No.:

9/415698

Inventors:

Frank J. Polese - San Diego CA
Jack A. Rubin - San Diego CA
Michael J. Singer - San Marcos CA
Walter V. Chichra - Wappingers Fall NY
Anthony P. Grodio - Lagrangeville NY
Vlad Ocher - San Diego CA
Henry Escalante - San Diego CA
William Dixon - Escondido CA
David L. Rose - Cardiff CA
Stuart Weinshanker - San Diego CA

Assignee:

Polese Company, Inc. - CA

International Classification:

B21C 2300

US Classification:

72256

Abstract:

A process for low cost manufacturing light-weight, heat-dissipating structures such as heatsinks, heat spreaders, and covers or lids for microelectronic components such as flip-chip integrated circuits from difficult-to-machine metal matrix composites such as aluminum silicon carbide (generically referred to as "Al--SiC" or "AlSiC"). The process involves selecting a mass produced quantity of Al--SiC material, forming that material into a thin ribbon, then stamping/coining the ribbon into the structures. The ribbon can be formed by extruding a thin strip from a billet of the Al--SiC material, then plurally rolling it. In this way, commonly available AlSiC composites manufactured in high volume for use in other applications such as cast automotive parts may be used.