Michael John Trahan

US Patent:

8537552, Sep 17, 2013

Filed:

Sep 25, 2009

Appl. No.:

12/566818

Inventors:

Jeffrey Paquette - Newton MA, US
Scott R. Cheyne - Brookline MA, US
Joseph R. Ellsworth - Pelham NH, US
Michael P. Martinez - Worcester MA, US
Michael R. Trahan - Northbridge MA, US

Assignee:

Raytheon Company - Waltham MA

International Classification:

H05K 7/20
F28F 7/00
H01Q 11/00

US Classification:

361710, 361717, 361711, 165185

Abstract:

A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.