Michelle M Morrell

US Patent:

58959769, Apr 20, 1999

Filed:

Jun 3, 1996

Appl. No.:

8/657216

Inventors:

Michelle J. Morrell - Glen Ellyn IL
Steven C. Machuga - Deisenhofen, DE
Grace M. O'Malley - Hoffman Estates IL
George A. Carson - Elk Grove Village IL
Andrew Skipor - Glendale Heights IL
Wen Xu Zhou - Atlanta GA
Karl W. Wyatt - Cary IL

Assignee:

Motorola Corporation - Schaumburg IL

International Classification:

H01L 2348

US Classification:

257778

Abstract:

A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) by solder bump interconnections (32). The die (12) and the substrate (14) are spaced apart by a gap (30) that is filled with a polymeric encapsulant (16). The die (12) includes a die perimeter (24) and a face (27) facing away from the substrate (14). A polymeric reinforcement (18) is disposed onto the die face (27) to protect the die (12) and to reduce the effects of thermally induced stresses on the die (12) and the solder bump interconnections (32). The polymeric reinforcement (18) is spaced apart from the die perimeter (24) to maintain a desired peripheral fillet geometry of the encapsulant (16).

US Patent:

60135719, Jan 11, 2000

Filed:

Jun 16, 1997

Appl. No.:

8/876582

Inventors:

Michelle J. Morrell - Glen Ellyn IL

Assignee:

Motorola, Inc. - Schaumburg IL

International Classification:

H01L 2144

US Classification:

438612

Abstract:

A microelectronic assembly (10) is formed and includes an integrated circuit component (12) attached to a substrate (14). The integrated circuit component (12) includes metallic columns (24) formed on bond pads (16) on the component (12). A solder plate (30) is formed on each of the metallic columns (24). The integrated circuit component (12) is superposed onto a substrate (14). The substrate (14) includes substrate bond pads (32), and each metallic column (24) registers with a corresponding substrate bond pad (32) such that the solder plate (30) contacts the substrate bond pad (32) to form a preassembly. The preassembly is then heated to reflow the solder plate (30) to form a solder joint (34) between the integrated circuit component (12) and the substrate (14). The solder joint (34) is formed between the solder attachment surface (28) of the metallic column (24) and the substrate bond pad (32).