Michelle I Reyes

US Patent:

62618725, Jul 17, 2001

Filed:

Sep 18, 1997

Appl. No.:

8/932474

Inventors:

James A. Hathaway - Ranco Palos Verdes CA
David J. Brunone - Rancho Palos Verdes CA
Michelle M. Reyes - Huntington Beach CA

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H01L 2148

US Classification:

438126

Abstract:

An advanced electronics package for integrating electronic components of an electronic circuit, such as RF circuits. An important aspect of the invention relates to the simplicity in forming and integrating the electronic components in the package relative to known electronics packages. In one embodiment of the invention, various ceramic preforms are utilized which may be cast with temperature durable electronic components or formed as interconnect channels or feedthroughs. The preforms, in turn, are adapted to be cast into a composite housing, for example, an aluminum silicon carbide (AlSiC) housing. The component preforms may include resistors, capacitors, and inductors. In addition, RF pins as well as DC pads may be cast in the housing. The electronic components are electrically coupled to an interconnect channel or feedthrough. Interconnections by way of the interconnect channels or feedthroughs within the package may be made by way of metal infusion of a metal, such as aluminum, into the ceramic of the interconnect channels.

US Patent:

62256963, May 1, 2001

Filed:

Apr 8, 1998

Appl. No.:

9/057041

Inventors:

James A. Hathaway - Rancho Palos Verdes CA
David J. Brunone - Rancho Palos Verdes CA
Michelle M. Reyes - Huntington Beach CA

Assignee:

TRW Inc. - Redondo Beach CA

International Classification:

H01L 2334

US Classification:

257728

Abstract:

An advanced electronics package for integrating electronic components of an electronic circuit, such as RF circuits. An important aspect of the invention relates to the simplicity in forming and integrating the electronic components in the package relative to known electronics packages. In one embodiment of the invention, various ceramic preforms are utilized which may be cast with temperature durable electronic components or formed as interconnect channels or feedthroughs. The preforms, in turn, are adapted to be cast into a composite housing, for example, an aluminum silicon carbide (AlSiC) housing. The component preforms may include resistors, capacitors, and inductors. In addition, RF pins as well as DC pads may be cast in the housing. The electronic components are electrically coupled to an interconnect channel or feedthrough. Interconnections by way of the interconnect channels or feedthroughs within the package may be made by way of metal infusion of a metal, such as alumninum, into the ceramic of the interconnect channels.