Miguel A Morales

US Patent:

D485600, Jan 20, 2004

Filed:

Sep 9, 2002

Appl. No.:

29/167051

Inventors:

Marcellus Williams - Hampton VA 23669
Miguel A. Morales - Hampton VA 23669

International Classification:

2205

US Classification:

D22147

US Patent:

20070234630, Oct 11, 2007

Filed:

Apr 6, 2006

Appl. No.:

11/278826

Inventors:

Marcellus Williams - Hampton VA, US
Miguel Morales - Hampton VA, US

International Classification:

A01K 97/10

US Classification:

043021200

Abstract:

The disclosed invention relates to a fishing rod holder comprising: a generally cylindrical base with a top and a bottom, and wherein the top is open and bottom is closed; a neck in communication with the base; a clip located near a top of the neck; a first slot located generally on the base; a second slot located generally on the base; and where the base is configured to hold a fishing rod handle, and the clip is configured to hold a fishing rod.

US Patent:

20130051018, Feb 28, 2013

Filed:

Aug 23, 2011

Appl. No.:

13/215947

Inventors:

MATTHEW E. MOSTOLLER - HUMMELSTOWN PA, US
ROBERT D. RIX - HERSHEY PA, US
MICHAEL F. LAUB - ENOLA PA, US
MARJORIE K. MYERS - MOUNT WOLF PA, US
DEAN PERRONNE - BARTO PA, US
MIGUEL MORALES - FREMONT CA, US
CHARLES RANDALL MALSTROM - LEBANON PA, US
LEONARD H. RADZILOWSKI - PALO ALTO CA, US

Assignee:

TYCO ELECTRONICS CORPORATION - BERWYN PA

International Classification:

F21S 4/00
H05K 1/05

US Classification:

36224902, 174255

Abstract:

A metal clad circuit board includes a metal substrate. A dielectric layer is applied to the metal substrate. A conductive seed layer is printed on the dielectric layer. A conductive circuit layer is plated onto the conductive seed layer. Optionally, the conductive seed layer may be inkjet printed on the dielectric layer. Alternatively, the conductive seed layer may be pad printed on the dielectric layer. Optionally, the dielectric layer may be powder coated to the metal substrate. The dielectric layer may include polymers and fillers compression molded to the metal substrate. Optionally, the conductive circuit layer may be electroplated to the conductive seed layer. Optionally, a solder mask may be applied over the conductive circuit layer.

US Patent:

20130074328, Mar 28, 2013

Filed:

Sep 23, 2011

Appl. No.:

13/242240

Inventors:

CHARLES RANDALL MALSTROM - LEBANON PA, US
DAVID SARRAF - ELIZABETHTOWN PA, US
MIGUEL ANGEL MORALES - FREMONT CA, US
LEONARD HENRY RADZILOWSKI - PALO ALTO CA, US
MICHAEL FREDRICK LAUB - ENOLA PA, US

Assignee:

TYCO ELECTRONICS CORPORATION - BERWYN PA

International Classification:

H01R 43/00

US Classification:

29825

Abstract:

A method of manufacturing an electronic module includes providing a conductive strip and a dielectric material. The method includes coating the dielectric material and the conductive strip to form a layered structure having a conductive layer defined by the conductive strip and a dielectric layer defined by the dielectric material. The method includes applying a carrier strip to the layered structure. The method includes processing the conductive layer to form a circuit while the layered structure is on the carrier strip. The method includes removing the carrier strip from the layered structure. The method includes applying the layered structure with the circuit to an electronic module substrate.