Mihir A Oka

US Patent:

20180315731, Nov 1, 2018

Filed:

Dec 4, 2015

Appl. No.:

15/772503

Inventors:

- Santa Clara CA, US
Mihir Oka - Chandler AZ, US

Assignee:

INTEL CORPORATION - Santa Clara CA

International Classification:

H01L 23/00
H01L 25/065
H01L 25/18

Abstract:

Described is an apparatus which comprises: a die with a first side; a plurality of metal bumps on the first side of the die; a plurality of solders disposed on the plurality of metal bumps; and a patterned printable resist disposed next to at least one of the solders of the plurality of solders. Described is a method which comprises: printing a photoresist ink onto a bumped wafer surface; thermally or Ultra-Violet curing the photoresist ink; and printing or electroplating solder(s) onto the bumped wafer surface. Described is a machine readable storage media having one or more instructions that when executed cause a machine to perform an operations according to the method described above.

US Patent:

20160307869, Oct 20, 2016

Filed:

Jun 29, 2016

Appl. No.:

15/196866

Inventors:

- SANTA CLARA CA, US
Edward R. Prack - Phoenix AZ, US
Sergei L. Voronov - Chandler AZ, US
Tony Dambrauskas - Chandler AZ, US
Lars D. Skoglund - Chandler AZ, US
Yoshihiro Tomita - Tsukuba, JP
Mihir A. Oka - Chandler AZ, US
Rajen C. Dias - Phoenix AZ, US

International Classification:

H01L 23/00
H01L 21/56
H01L 23/498
H01L 23/538
H01L 21/768
H01L 25/065

Abstract:

Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

US Patent:

20150270235, Sep 24, 2015

Filed:

Mar 18, 2014

Appl. No.:

14/218767

Inventors:

Mihir A. Oka - Chandler AZ, US
Edward R. Prack - Phoenix AZ, US
Dingying Xu - Chandler AZ, US
Saikumar Jayaraman - Chandler AZ, US

International Classification:

H01L 23/00
C09D 179/04
C08K 11/00
C09D 181/04
C09D 179/08
H01L 21/02
C09D 125/02

Abstract:

Techniques are disclosed for protecting a surface using a dry-removable protective coating that does not require chemical solutions to be removed. In an embodiment, a protective layer is disposed on a surface. The protective layer is composed of one layer that adheres to the surface. The surface is then processed while the protective coating is on the surface. Thereafter, the protective layer is removed from the surface by separating the protective layer away from the surface without the use of chemical solutions.

US Patent:

20150179595, Jun 25, 2015

Filed:

Dec 20, 2013

Appl. No.:

14/136908

Inventors:

Mihir Oka - Chandler AZ, US
Xavier Brun - Chandler AZ, US
Dingying David Xu - Chandler AZ, US
Edward Prack - Phoenix AZ, US
Kabirkumar Mirpuri - Scottsdale AZ, US
Saikumar Jayaraman - Chandler AZ, US

International Classification:

H01L 23/00
C08L 79/04
B23K 1/00
C08L 77/00
C08K 3/22
B23K 1/20
C08G 69/00
C08K 3/36

Abstract:

This disclosure relates generally to generating a solder-on-die using a water-soluble resist, system, and method. Heat may be applied to solder as applied to a hole formed in a water-soluble resist coating, the water-soluble resist coating being on a surface of an initial assembly. The initial assembly may include an electronic component. The surface may be formed, at least in part, by an electrical terminal of the electronic component, the hole being aligned, at least in part, with the electrical terminal. The solder may be reflowed, wherein the solder couples, at least in part, with the electrical terminal.

US Patent:

20140264951, Sep 18, 2014

Filed:

Mar 14, 2013

Appl. No.:

13/830126

Inventors:

Danish Faruqui - Chandler AZ, US
Edward R. Prack - Phoenix AZ, US
Sergei L. Voronov - Chandler AZ, US
Tony Dambrauskas - Chandler AZ, US
Lars D. Skoglund - Chandler AZ, US
Yoshihiro Tomita - Tsukuba, JP
Mihir A. Oka - Chandler AZ, US
Rajen C. Dias - Phoenix AZ, US

International Classification:

H01L 23/00

US Classification:

257783, 438118

Abstract:

Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

US Patent:

20140175657, Jun 26, 2014

Filed:

Dec 21, 2012

Appl. No.:

13/725539

Inventors:

Mihir A. Oka - Chandler AZ, US
Rahul N. Manepalli - Chandler AZ, US
Dingying Xu - Maricopa AZ, US
Yosuke Kanaoka - Tsukuba, JP
Sergei L. Voronov - Chandler AZ, US
Dong Hai Sun - Chandler AZ, US

International Classification:

H01L 23/48
H01L 21/02

US Classification:

257773, 438401

Abstract:

Apparatus including a die including a device side with contact points; and a build-up carrier disposed on the device side of the die; and a film disposed on the back side of the die, the film including a markable material including a mark contrast of at least 20 percent. Method including forming a body of a build-up carrier adjacent a device side of a die; and forming a film on a back side of the die, the film including a markable material including a mark contrast of at least 20 percent. Apparatus including a package including a microprocessor disposed in a carrier; a film on the back side of the microprocessor, the film including a markable material including a mark contrast of at least 20 percent; and a printed circuit board coupled to at least a portion of the plurality of conductive posts of the carrier.

US Patent:

20140177194, Jun 26, 2014

Filed:

Dec 26, 2012

Appl. No.:

13/727409

Inventors:

Hitesh Arora - Chandler AZ, US
Mihir A. Oka - Chandler AZ, US
Chandra M. Jha - Chandler AZ, US

International Classification:

H05K 1/18
H01L 21/50

US Classification:

361767, 438118, 523459, 523457, 523458, 523467, 523468, 523456

Abstract:

A die backside film including a matrix material; and an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles. A method including introducing a die backside film on a backside surface of a die, the die backside film including a matrix material including an elastomer an amount of filler particles to render the die backside film thermally conductive, wherein a thermal conductivity of the amount of filler particles is greater than a thermal conductivity of silica particles; and disposing the die in a package.