Mike G Macgregor

US Patent:

6572282, Jun 3, 2003

Filed:

Dec 18, 2001

Appl. No.:

10/025300

Inventors:

James M. Okuley - Portland OR
Mike G. MacGregor - Portland OR

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G03B 1700

US Classification:

396428, 348373, 248140

Abstract:

A digital camera stand comprising a main body and a tilting body received within a cavity formed within a top portion of the main body and coupled to the main body along a pivot axis. The tilting body includes indexed portions, preferably a parallel arrangement of notches formed along the back portion of the tilting body, adapted to engage with an indexer coupled to the main body to allow indexed tilting of the tilting body relative to the main body as the indexer is engaged with a selected one of the notches. One end of a data connector is received through a shell of the tilting body and presents a data connection adapted to couple with a complementary connector on a base portion of the digital camera maintained within a pocket of the tilting body.

US Patent:

7023702, Apr 4, 2006

Filed:

Oct 9, 2003

Appl. No.:

10/681920

Inventors:

Mike G. MacGregor - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/20

US Classification:

361719, 165 803, 165185, 257719, 361704

Abstract:

In some embodiments, an apparatus includes a circuit board, a plurality of metal inserts, and a heat sink having a plurality of mounting holes. Each of the metal inserts may include at least one lower member soldered to the circuit board, and an upper portion received in a respective one of the mounting holes of the heat sink and secured to the respective one of the mounting holes by a respective fastener.

US Patent:

7158381, Jan 2, 2007

Filed:

Jun 27, 2003

Appl. No.:

10/607783

Inventors:

Mike G MacGregor - Portland OR, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 7/20

US Classification:

361709, 361719

Abstract:

A heat sink assembly is coupled to a motherboard and an electronic device on the motherboard. The heat sink assembly includes a heat sink with an opening extending through the heat sink, and a pin that extends through the motherboard and the opening in the heat sink to couple the heat sink to the electronic device and the motherboard. A member within the opening in the heat sink is positioned between the heat sink and the pin. A method of securing a heat sink to a motherboard and an electronic device on the motherboard includes thermally coupling a heat sink to an electronic device, securing the heat sink to a motherboard using a pin that extends through an opening in the heat sink, and positioning a member between the pin and the heat sink within the opening in the heat sink.

US Patent:

20080081489, Apr 3, 2008

Filed:

Sep 29, 2006

Appl. No.:

11/541714

Inventors:

Mike G. MacGregor - Portland OR, US
Kazimierz A. Kozyra - Olympia WA, US
Tod Byquist - Tukwila WA, US

International Classification:

H01R 12/00

US Classification:

439 71

Abstract:

An apparatus for receiving and securing a processor on a mainboard in a computer system. The apparatus includes a socket and socket loading mechanism for a land grid array. The apparatus provides a load distribution mechanism to dissipate tensile and shearing forces at the corner of the socket to protect a solder ball grid array. This improves the durability of the solder ball grid array and increases the power of the processors that may be supported by the socket.

US Patent:

60287713, Feb 22, 2000

Filed:

Nov 11, 1998

Appl. No.:

9/189905

Inventors:

Thomas Wong - Seattle WA
Michael Crocker - Tacoma WA
Peter Davison - Sumner WA
Mike MacGregor - Olympia WA
Joe Benefield - Olympia WA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361704

Abstract:

A cover for a substrate of an electronic assembly. The cover may include a snap-in pin that can be inserted through an opening of the substrate. The cover may also have a barbed pin that exerts a force onto the substrate. The force secures the pin to the substrate. The snap-in pin and barbed pin may extend from a panel portion of the cover which covers one side of the substrate. The entire cover may be constructed as a relatively inexpensive plastic injection molded part.

US Patent:

61010960, Aug 8, 2000

Filed:

Jun 10, 1999

Appl. No.:

9/330242

Inventors:

Mike MacGregor - Olympia WA
Michael T. Crocker - Tacomoa WA
Thomas Wong - Seattle WA
Peter Davison - Sumner WA
Rolf A. Konstad - Gold River CA
David A. Jones - El Dorado Hills CA

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H05K 720

US Classification:

361720

Abstract:

A fastener for an electronic assembly. The fastener may have a spring arm that extends from a stem. The fastener can attach a cover to a heat sink of an electronic assembly. The stem may be inserted into a boss of the cover. The spring arm may exert a force onto the heat sink to press the sink into an integrated circuit package of the assembly.

US Patent:

20150234437, Aug 20, 2015

Filed:

Nov 29, 2011

Appl. No.:

13/997758

Inventors:

Mark J. Gallina - Hillsboro OR, US
Jason B. Chesser - Beaverton OR, US
Mike G. Macgregor - Portland OR, US
Mark J. Luckeroth - Portland OR, US
Brian S. Jarrett - Hillsboro OR, US
Thu Huynh - Hillsboro OR, US
Eric D. Mcafee - Portland OR, US
Barrett M. Faneuf - Beaverton OR, US
Michelle Goeppinger - Portland OR, US

International Classification:

G06F 1/20
G06F 1/18
H05K 7/20

Abstract:

Systems and methods of fabricating circuit board assemblies may provide for a circuit board assembly that includes an expansion card having a first side and a second side, a first set of semiconductor packages coupled to the first side and a second set of semiconductor packages coupled to the second side. The circuit board assembly may also include a synergistic combination of cooling solutions for the expansion card such as a metallic duct, centrifugal fan or secondary plate, structural solutions for the expansion card such as a clamp structure or retention interlock, and volume reduction solutions for the expansion card such as one or more flipped power connectors.