Ming Chuan Chen

US Patent:

59990031, Dec 7, 1999

Filed:

Dec 12, 1997

Appl. No.:

8/989831

Inventors:

Paul J. Steffan - Elk Grove CA
Ming Chun Chen - Irvine CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

G01R 2126
H01L 2166
G06K 900

US Classification:

324537

Abstract:

A method to accurately classify defects on a semiconductor wafer wherein a scanning tool detects defects and assigns values to parameters that are characteristic of each defect. The values of the characteristic parameters represent a thumbprint of each defect and the defects are placed into "bins" according to the thumbprint of each defect. A sample of defects in each bin is analyzed and assigned a classification code.

US Patent:

59462132, Aug 31, 1999

Filed:

Oct 22, 1997

Appl. No.:

8/955774

Inventors:

Paul J. Steffan - Elk Grove CA
Ming Chun Chen - Milpitas CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

G06F 1900

US Classification:

36446817

Abstract:

A defect management system with a method to identify and reclassify previously classified propagator defects. The defect management system also has a method of identifying cluster defects and selecting at least one cluster defect to classify.

US Patent:

59054344, May 18, 1999

Filed:

Dec 8, 1997

Appl. No.:

8/987253

Inventors:

Paul J. Steffan - Elk Grove CA
Ming Chun Chen - Irvine CA

International Classification:

B60Q1/50

US Classification:

340464

Abstract:

A vehicle communications system having a remote control unit installed in the interior of a vehicle and a display unit located on the exterior of the vehicle. The display unit has an input from the remote control unit and an input from a vehicle interface module that has inputs from the vehicle such as the braking system and the turning signal system. The remote control unit is controllable by the driver in the vehicle and has a table of preset and preprogrammed messages selectable by the driver. The driver selects a message to be displayed and sends the message to the display unit. Any input to the vehicle interface module from the vehicle signaling systems overrides the signal input from the remote control unit unless the display unit is mounted on the front of the vehicle. The driver can select a message from a table of messages that are sequentially displayed on the remote control unit. The table of messages is stored on a flash memory in the remote unit and in a flash memory in the display unit.

US Patent:

60116196, Jan 4, 2000

Filed:

Dec 9, 1997

Appl. No.:

8/987736

Inventors:

Paul J. Steffan - Elk Grove CA
Bryan Tracy - Oakland CA
Ming Chun Chen - Milpitas CA

Assignee:

Advanced Micro Devices - Sunnyvale CA

International Classification:

G01N 2188

US Classification:

3562373

Abstract:

A semiconductor wafer optical scanning system and method for determining defects on a semiconductor wafer is disclosed. The method for determining wafer defects is based on maximum allowable defects on a swath basis, rather than maximum allowable defects on a wafer basis. The method step include determining the scanned area of an individual swath that is based on a recipe set-up, consistent with the capability of the optical scanning equipment being used and the particular semiconductor wafer being tested for defects. The predetermined swath area is supplied and stored in the optical scanning system along with the maximum allowable defect density determined by the user. By using the predetermined maximum allowable defects for a swath as a limit, defect analysis may be performed on the entire wafer. The optical scanning system would stop acquiring defects for the current swath being analyzed whenever the defect limit is reached, or until the swath defect analysis has been completed. The optical scanning would proceed to the next swath determining its defect and continuing in such a manner until the wafer is completely scanned.

US Patent:

61747386, Jan 16, 2001

Filed:

Nov 28, 1997

Appl. No.:

8/979630

Inventors:

Paul J. Steffan - Elk Grove CA
Ming Chun Chen - Milpitas CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

G01R 3126

US Classification:

438 5

Abstract:

A method of determining an accurate disposition decision for each inspected layer in a wafer lot wherein a measured defect density is compared to a calculated disposition criterion determined for each inspected layer. If the measured defect density is above the calculated disposition criterion the wafer lot is placed on hold and if the measured defect density is at or below the calculated disposition criterion the wafer lot is sent to the next process. The disposition criterion for each layer is determined from a yield value determined for each layer. The yield value is the yield necessary for each layer to obtain a profitable product and is determined from cost data for each die in the wafer lot and a risk factor determined by management and includes market data such as selling price and demand for the product. The yield value is combined with defect sensitivity determined for each layer. The defect sensitivity is determined from the combination of critical area and historical frequency for each layer.

US Patent:

61855111, Feb 6, 2001

Filed:

Nov 28, 1997

Appl. No.:

8/979629

Inventors:

Paul J. Steffan - Elk Grove CA
Ming Chun Chen - Milpitas CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

G06F 1900

US Classification:

702 81

Abstract:

A method of determining classification codes for defects occurring in semiconductor processes comparing images of defects from a first selected wafer with images of defects in a first image reference library. The images in the first image reference library are updated from a master image reference library. The images in the master image reference library are the best images of defect types. The images in the master image reference library are in a format readable by all review stations utilized to review the images of the defect.

US Patent:

61547115, Nov 28, 2000

Filed:

Dec 5, 1997

Appl. No.:

8/985467

Inventors:

Paul J. Steffan - Elk Grove CA
Ming Chun Chen - Milpitas CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L 2166

US Classification:

702 82

Abstract:

A method of manufacturing semiconductor wafers using a simulation tool to determine a set of predicted wafer electrical test parameters. The set of predicted wafer electrical test parameters are compared with wafer electrical test specifications tabulated for each process during the manufacturing process. During the comparison, it is determined whether the predicted wafer electrical test parameters are within the specifications for the process and circuit simulations are then conducted using the predicted wafer electrical test parameters. Device performance is predicted from the circuit simulations and the disposition of the wafer lot is determined utilizing tabulated from a disposition performance table.