Ming Shun Tsai

US Patent:

20200105473, Apr 2, 2020

Filed:

Sep 28, 2018

Appl. No.:

16/146042

Inventors:

- Cupertino CA, US
Won Seop Choi - Pleasanton CA, US
Gang Ning - Santa Clara CA, US
Chirag V. Shah - Milpitas CA, US
Martin Schauer - Fremont CA, US
Curtis C. Mead - Sacramento CA, US
Ming Yuan Tsai - San Jose CA, US
Albert Wang - Sunnyvale CA, US

International Classification:

H01G 4/30
H01G 4/12
H01G 4/005
H01G 4/228

Abstract:

Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.