Mohammad M Chowdhury

age ~56

from Fairview, TX

Also known as:
  • Mohhamd Chowdhury
  • Mohammad M Chowdury
  • Ayesha Chowdhury

Mohammad Chowdhury Phones & Addresses

  • Fairview, TX
  • Little Elm, TX
  • San Jose, CA
  • 2038 Camelot Dr, Allen, TX 75013
  • Santa Clara, CA
  • Sammamish, WA
  • Colton, TX
  • Issaquah, WA
  • Wichita, KS
Name / Title
Company / Classification
Phones & Addresses
Mohammad Chowdhury
Director
OUTSTANDING FINANCIALS INC
Investment Advice · Investment Advisory Service
6849 Douglas Crk, Plano, TX 75023
Mohammad Chowdhury
TANZIA LLC
Mohammad Chowdhury
IBUYISELL, LLC
Mohammad Chowdhury
IBIZNAZ LTD
Mohammad Chowdhury
AGORA TRADING WORLD LTD
Mohammad Chowdhury
Director
TAAS CORPORATION
1098 Texan Trl, Grapevine, TX 76051
1098 E Grapevine Hwy, Grapevine, TX 76051
Mohammad S Chowdhury
Director, President
CLASSIC TRADING INC
Whol Nondurable Goods
6849 Douglas Crk, Plano, TX 75023
909 W Spg Crk Pkwy, Plano, TX 75023
6849 Douglass Crk, Plano, TX 75023
Mohammad Alauddin Chowdhury
Director
DALLAS BENGAL CORPORATION
888 S Greenville Ave STE 118, Richardson, TX 75081
1098 E State Hwy 114, Grapevine, TX 76092
1098 E Northwest Hwy, Irving, TX 75061

Resumes

Mohammad Chowdhury Photo 1

Mohammad Chowdhury

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Mohammad Chowdhury Photo 2

Mohammad Sobug Chowdhury

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Mohammad Chowdhury Photo 3

Mohammad R Chowdhury

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Mohammad Chowdhury Photo 4

Mohammad M Chowdhury

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Mohammad Chowdhury Photo 5

Mohammad Chowdhury

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Mohammad Chowdhury

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Location:
United States
Mohammad Chowdhury Photo 7

Mohammad Chowdhury

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Location:
United States
Mohammad Chowdhury Photo 8

Mohammad Chowdhury

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Location:
United States

Us Patents

  • Laser And Plasma Etch Wafer Dicing With A Double Sided Uv-Curable Adhesive Film

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  • US Patent:
    20140004685, Jan 2, 2014
  • Filed:
    Jun 13, 2013
  • Appl. No.:
    13/917568
  • Inventors:
    Mohammad Kamruzzaman CHOWDHURY - Santa Clara CA, US
    Wei-Sheng Lei - San Jose CA, US
    Todd Egan - Fremont CA, US
    Brad Eaton - Menlo Park CA, US
    Madhava Rao Yalamanchili - Morgan Hill CA, US
    Ajay Kumar - Cupertino CA, US
  • International Classification:
    H01L 21/78
    B23K 26/36
    H01L 21/67
  • US Classification:
    438463, 392416, 21912169
  • Abstract:
    Laser and plasma etch wafer dicing using UV-curable adhesive films. A mask is formed covering ICs formed on the wafer, as well as any bumps providing an interface to the ICs. The semiconductor wafer is coupled to a carrier substrate by a double-sided UV-curable adhesive film. The mask is patterned by laser scribing to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer, below thin film layers from which the ICs are formed. The semiconductor wafer is then etched through the gaps in the patterned mask to singulate the ICs. The UV-curable adhesive film is partially cured by UV irradiation through the carrier. The singulated ICs are then detached from the partially cured adhesive film still attached to the carrier substrate, for example individually by a pick and place machine. The UV-curable adhesive film may then be further cured for the film's complete removal from the carrier substrate.
  • Uniform Masking For Wafer Dicing Using Laser And Plasma Etch

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  • US Patent:
    20140017879, Jan 16, 2014
  • Filed:
    Jun 13, 2013
  • Appl. No.:
    13/917366
  • Inventors:
    Mohammad Kamruzzaman Chowdhury - Santa Clara CA, US
    Wei-Sheng Lei - San Jose CA, US
    Todd Egan - Fremont CA, US
    Brad Eaton - Menlo Park CA, US
    Madhava Rao Yalamanchili - Morgan Hill CA, US
    Ajay Kumar - Cupertino CA, US
  • International Classification:
    H01L 21/78
  • US Classification:
    438462, 1563451, 15634555
  • Abstract:
    Uniform masking for wafer dicing using laser and plasma etch is described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits having bumps or pillars includes uniformly spinning on a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to singulate the integrated circuits.
  • Laser And Plasma Etch Wafer Dicing Using Uv-Curable Adhesive Film

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  • US Patent:
    20130280890, Oct 24, 2013
  • Filed:
    Mar 20, 2013
  • Appl. No.:
    13/847964
  • Inventors:
    Wei-Sheng Lei - San Jose CA, US
    Mohammad K. Chowdhury - Santa Clara CA, US
    Todd Egan - Fremont CA, US
    Brad Eaton - Menlo Park CA, US
    Madhava Rao Yalamanchili - Morgan Hill CA, US
    Ajay Kumar - Cupertino CA, US
  • International Classification:
    H01L 21/78
    H01L 21/67
  • US Classification:
    438463, 1563451
  • Abstract:
    Laser and plasma etch wafer dicing using UV-curable adhesive films is described. In an example, a method includes forming a mask above the semiconductor wafer. The semiconductor wafer is coupled to a carrier substrate by a UV-curable adhesive film. The mask covers and protects the integrated circuits. The mask is patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then etched through the gaps in the patterned mask to form singulated integrated circuits. The UV-curable adhesive film is then irradiated with ultra-violet (UV) light. The singulated integrated circuits are then detached from the carrier substrate.
  • Etch-Resistant Water Soluble Mask For Hybrid Wafer Dicing Using Laser Scribing And Plasma Etch

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  • US Patent:
    20160365283, Dec 15, 2016
  • Filed:
    Jun 12, 2015
  • Appl. No.:
    14/738389
  • Inventors:
    Wei-Sheng Lei - San Jose CA, US
    Mohammad Kamruzzaman Chowdhury - Santa Clara CA, US
    Brad Eaton - Menlo Park CA, US
    Ajay Kumar - Cupertino CA, US
  • International Classification:
    H01L 21/82
    H01L 21/308
    H01J 37/32
    H01L 21/02
    H01L 21/67
    H01L 21/3065
    H01L 21/268
  • Abstract:
    Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer including a plurality of integrated circuits includes forming a water soluble mask above the semiconductor wafer, the water soluble mask covering and protecting the integrated circuits. The method also includes baking the water soluble mask to increase the etch resistance of the water soluble mask. The method also includes, subsequent to baking the water soluble mask, patterning the water soluble mask with a laser scribing process to provide a water soluble patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The method also includes plasma etching the semiconductor wafer through the gaps in the water soluble patterned mask to singulate the integrated circuits.
  • Multi-Layer Mask Including Non-Photodefinable Laser Energy Absorbing Layer For Substrate Dicing By Laser And Plasma Etch

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  • US Patent:
    20160035577, Feb 4, 2016
  • Filed:
    Mar 11, 2014
  • Appl. No.:
    14/775651
  • Inventors:
    - Santa Clara CA, US
    Mohammad Kamruzzaman CHOWDHURY - Santa Clara CA, US
    Todd EGAN - Fremont CA, US
    Brad EATON - Menlo Park CA, US
    Madhava Rao YALAMANCHILI - Morgan Hill CA, US
    Ajay KUMAR - Cupertino CA, US
  • International Classification:
    H01L 21/308
    H01L 21/3065
    H01L 21/687
    B23K 26/402
    H01L 21/67
    H01L 21/673
    H01L 21/82
    B23K 26/364
  • Abstract:
    Methods of dicing substrates having a plurality of ICs. A method includes forming a multi-layered mask comprising a laser energy absorbing, non-photodefinable topcoat disposed over a water-soluble base layer disposed over the semiconductor substrate. Because the laser light absorbing material layer is non-photodefinable, material costs associated with conventional photo resist formulations may be avoided. The mask is direct-write patterned with a laser scribing process to provide a patterned mask with gaps. The patterning exposes regions of the substrate between the ICs. Absorption of the mask layer within the laser emission band (e.g., UV band and/or green band) promotes good scribe line quality. The substrate may then be plasma etched through the gaps in the patterned mask to singulate the IC with the mask protecting the ICs during the plasma etch. The soluble base layer of the mask may then be dissolved subsequent to singulation, facilitating removal of the layer.
  • Laser And Plasma Etch Wafer Dicing With A Double Sided Uv-Curable Adhesive Film

    view source
  • US Patent:
    20150122419, May 7, 2015
  • Filed:
    Jan 12, 2015
  • Appl. No.:
    14/595120
  • Inventors:
    Mohammad Kamruzzaman Chowdhury - Santa Clara CA, US
    Wei-Sheng Lei - San Jose CA, US
    Todd Egan - Fremont CA, US
    Brad Eaton - Menlo Park CA, US
    Madhava Rao Yalamanchili - Morgan Hill CA, US
    Ajay Kumar - Cupertino CA, US
  • International Classification:
    H01L 21/67
    B23K 26/36
    B23K 26/40
    H01L 21/683
  • US Classification:
    1563453
  • Abstract:
    Laser and plasma etch wafer dicing using UV-curable adhesive films. A mask is formed covering ICs formed on the wafer, as well as any bumps providing an interface to the ICs. The semiconductor wafer is coupled to a carrier substrate by a double-sided UV-curable adhesive film. The mask is patterned by laser scribing to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer, below thin film layers from which the ICs are formed. The semiconductor wafer is then etched through the gaps in the patterned mask to singulate the ICs. The UV-curable adhesive film is partially cured by UV irradiation through the carrier. The singulated ICs are then detached from the partially cured adhesive film still attached to the carrier substrate, for example individually by a pick and place machine. The UV-curable adhesive film may then be further cured for the film's complete removal from the carrier substrate.
  • Laser And Plasma Etch Wafer Dicing With Partial Pre-Curing Of Uv Release Dicing Tape For Film Frame Wafer Application

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  • US Patent:
    20140106542, Apr 17, 2014
  • Filed:
    Oct 11, 2013
  • Appl. No.:
    14/052085
  • Inventors:
    Mohammad Kamruzzaman CHOWDHURY - Santa Clara CA, US
    Wei-Sheng Lei - San Jose CA, US
    Todd Egan - Fremont CA, US
    Brad Eaton - Menlo Park CA, US
    Madhava Rao Yalamanchili - Morgan Hill CA, US
    Ajay Kumar - Cupertino CA, US
  • International Classification:
    H01L 21/82
    H01L 21/67
  • US Classification:
    438462, 1563453
  • Abstract:
    Methods and systems of laser and plasma etch wafer dicing using UV-curable adhesive films. A method includes forming a mask covering ICs formed on the wafer. The semiconductor wafer is coupled to a film frame by a UV-curable adhesive film. A pre-cure of the UV-curable adhesive film cures a peripheral portion of the adhesive extending beyond an edge of the wafer to improve the exposed adhesive material's resistance to plasma etch and reduce hydrocarbon redeposition within the etch chamber. The mask is patterned by laser scribing to provide a patterned mask with gaps. The patterning exposes regions of the semiconductor wafer, below thin film layers from which the ICs are formed. The semiconductor wafer is plasma etched through the gaps in the patterned mask to singulate the ICs. A center portion of the UV-curable adhesive is then cured and the singulated ICs detached from the film.

Medicine Doctors

Mohammad Chowdhury Photo 9

Mohammad S. Chowdhury

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Specialties:
Podiatric Medicine
Work:
Westchester Foot Care Center
200 Martine Ave, White Plains, NY 10601
9149972601 (phone), 9144379426 (fax)
Procedures:
Hallux Valgus Repair
Conditions:
Hallux Valgus
Plantar Fascitis
Tinea Pedis
Languages:
English
Spanish
Description:
Dr. Chowdhury works in White Plains, NY and specializes in Podiatric Medicine.
Mohammad Chowdhury Photo 10

Mohammad K Chowdhury

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Specialties:
Psychiatry

Wikipedia References

Mohammad Chowdhury Photo 11

Mohammad Muslim Chowdhury

Isbn (Books And Publications)

Agricultural Information Systems for Decision Making in Developing Countries: A Selected Bibliography

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Author
Mohammad N. Chowdhury

ISBN #
0890288852

Plaxo

Mohammad Chowdhury Photo 12

Mohammad Chowdhury

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Mohammad Chowdhury Photo 13

Mohammad Chowdhury

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London

News

Mediatek Expects More Than 2 Million Android One Phones To Sell In India

Mediatek expects more than 2 million Android One phones to sell in India

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  • PwC India Leader (Telecom) Mohammad Chowdhury said: The festive season regularly sees an uptick in handset sales and we should expect this in the next few months. In particular there is hot competition in the segment priced from Rs 7,000 upwards.
  • Date: Sep 16, 2014
  • Category: Sci/Tech
  • Source: Google

Islamists admit plot to blow up London bourse

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  • Mohammad Chowdhury, 21, and Shah Rahman, 28, both from London, admitted preparing for acts of terrorism by planning to plant an improvised explosive device in the toilets of the London Stock Exchange.
  • Date: Feb 01, 2012
  • Category: World
  • Source: Google

Youtube

JIBONANONDO - USTAAD NIAZ MOHAMMAD CHOWDHURY ...

TRACK - JIBONANONDO USTAAD NIAZ MOHAMMAD CHOWDHURY with TAPOSH & FRIEN...

  • Duration:
    4m 24s

#23. Mohammad Chowdhury | Border Crossings ...

The views and opinions expressed in this video are those of the author...

  • Duration:
    1h 19m 46s

Best of Niaz Mohammad Chowdhury (Full Album 2...

... ... ... ... ... ... ... ... ... ... -- 00:00 - ... ... ...

  • Duration:
    53m 1s

USTAD NIAZ MOHAMMAD CHOWDHURY : JIBANANANDA |...

ARTIST: USTAD NIAZ MOHAMMAD CHOWDHURY ALBUM: JIBANANANDA || ... ... .....

  • Duration:
    51m 23s

Border Crossings My Journey as a Western Musl...

Whether negotiating the mind-games of the Israeli intelligence service...

  • Duration:
    16m 20s

Niaz Mohammad Chowdhury- Jibanananda Hoye ( ....

  • Duration:
    4m 7s

Classmates

Mohammad Chowdhury Photo 14

Mohammad Chowdhury

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Schools:
Atlantic City Friends High School Atlantic City NJ 1997-2001
Community:
Linda Jennings, Helen Berry, Michelle Jackson, Michael Berg
Mohammad Chowdhury Photo 15

Mohammad Chowdhury

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Schools:
Nelson A. Boylen Secondary School Toronto Morocco 1998-2002
Community:
Norman Applegate, Brad Cockburn, Connie Grant, Linda Latham
Mohammad Chowdhury Photo 16

St. John's University - P...

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Graduates:
Mohammad Mansour (1992-1996),
Thomas Pietrocarli (1972-1977),
Chrisner Airey (1993-1998),
Mohammad Chowdhury (1998-2003)
Mohammad Chowdhury Photo 17

York Early College Academ...

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Graduates:
Ernst Apollon (1998-2002),
Mohammad Chowdhury (2003-2007),
Rashmi Chhabra (1997-2001),
Routie Mohan (1996-2000),
Michael Morrison (1999-2003)
Mohammad Chowdhury Photo 18

Atlantic City Friends Hig...

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Graduates:
Mohammad Chowdhury (1997-2001),
Susan Cohen (1984-1988),
Simone Harding (1977-1981)
Mohammad Chowdhury Photo 19

Nelson A. Boylen Secondar...

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Graduates:
Tony Pasutto (1965-1969),
Maria Pocevicius (1979-1983),
Heather Clark (1975-1979),
Mohammad Chowdhury (1998-2002)

Facebook

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Fayez Mohammad Chowdhury

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Mohammad Chowdhury Photo 21

Noor Mohammad Chowdhury

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Mohammad Chowdhury Photo 22

Sadik Mohammad Chowdhury

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Mohammad Chowdhury Photo 23

Mohammad Arif Chowdhury

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Mohammad Chowdhury Photo 24

Mohammad Chowdhury

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Mohammad Chowdhury Photo 25

Mohammad M. Chowdhury

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Mohammad Chowdhury Photo 26

Fahim Mohammad Chowdhury

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Mohammad Chowdhury Photo 27

Golam Mohammad Chowdhury

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Googleplus

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Mohammad Chowdhury

Education:
Saint John's University, Queens - Pharmacy
Mohammad Chowdhury Photo 29

Mohammad Chowdhury

Work:
Wal-Mart Canada
Mohammad Chowdhury Photo 30

Mohammad Chowdhury

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Mohammad Chowdhury

Mohammad Chowdhury Photo 32

Mohammad Chowdhury

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Mohammad Chowdhury

Mohammad Chowdhury Photo 34

Mohammad Chowdhury

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Mohammad Chowdhury

Flickr


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