Abstract:
Disclosed is a method for laminating multilayer structures with nonplanar surfaces such as structures which include cavity (20) formed therein. A conformal material (32), a release material (31), and an optional template (36) are provided over the structure prior to the lamination bonding operation. The conformal and release materials then fill the cavity during the bonding operation to prevent flow of adhesive (25 and 26) from between the layers into the cavity, and the template redistributes cavity edge stresses to minimize wire bonding pad deflections. The materials can then be removed for further processing of the multilayer structure.