My T Nguyen

US Patent:

6451422, Sep 17, 2002

Filed:

Dec 1, 1999

Appl. No.:

09/452483

Inventors:

My N. Nguyen - Poway CA

Assignee:

Johnson Matthey, Inc. - Valley Forge PA

International Classification:

B32B 516

US Classification:

428323, 428328, 428330, 4284111, 428457, 428467, 428465, 428484, 442336, 442367, 442374, 442375, 106270, 106272, 106638, 106640, 106641, 106660, 252500, 252512, 252514, 2525193, 25251931, 25251933, 2525202

Abstract:

Described is an interface material composition that includes rubber, phase change material and thermally conductive filler.

US Patent:

6482387, Nov 19, 2002

Filed:

Jun 16, 1999

Appl. No.:

09/333570

Inventors:

Mehmet Ali Gülgün - Stuttgart, DE
Waltraud M. Kriven - Champaign IL 61821
My Hoang Nguyen - San Jose CA

Assignee:

Waltraud M. Kriven - Champaign IL

International Classification:

C01G 4300

US Classification:

423593, 423600, 423594, 423595, 423596, 423597, 423598, 423599, 423263, 423252, 423253

Abstract:

Described are preferred polymerized organic-inorganic processes for producing mixed metal oxide powders suitable for use in the ceramics and related industries. The preferred processes employ a non-chelating polymer such as polyvinyl alcohol or polyalkylene glycol as a carrier and can provide single-phase, mixed oxide powders in high yields at relatively low temperatures.

US Patent:

6605238, Aug 12, 2003

Filed:

Jan 30, 2001

Appl. No.:

09/774466

Inventors:

My Nguyen - Poway CA
James Grundy - San Diego CA
Carl Edwards - San Diego CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H01B 104

US Classification:

252502, 252500, 252511, 252512, 252514, 2525213

Abstract:

Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.

US Patent:

6673434, Jan 6, 2004

Filed:

Jan 14, 2002

Appl. No.:

10/047617

Inventors:

My Nguyen - Poway CA

Assignee:

Honeywell International, Inc. - Morristown NJ

International Classification:

B32B 516

US Classification:

428323, 428325, 428328, 428330, 428492, 442336, 442367, 442374, 442375, 106270, 106272, 106638, 106640, 106641, 106660, 252500, 252512, 252514, 2525193, 25251931, 25251933, 2525202

Abstract:

A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or âsoft gelâ. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material is needed to change some of the physical properties of the composition. A method for forming the crosslinkable thermal interface materials disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the crosslinked rubber-resin mixture.

US Patent:

6706219, Mar 16, 2004

Filed:

May 7, 2001

Appl. No.:

09/851103

Inventors:

My Nguyen - Poway CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H01B 100

US Classification:

252511, 252502, 2525181, 252519, 2525201, 25252021, 106 121, 427212, 427222, 427219, 524404, 524413, 524439, 524495

Abstract:

An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature. It can be also formulated as a highly compliant, cured, tacky elastomeric film or sheet for other interface applications where it can be preapplied, for example on heat sinks, or in any other interface situations.

US Patent:

6756687, Jun 29, 2004

Filed:

Mar 5, 2003

Appl. No.:

10/382784

Inventors:

My Nguyen - San Jose CA

Assignee:

Altera Corporation - San Jose CA

International Classification:

H01L 2348

US Classification:

257778, 257737, 257738, 257774

Abstract:

A flip chip package, apparatus and technique in which a ball grid array composed of a doped eutectic Pb/Sn solder composition is used. The dopant in the Pb/Sn solder forms a compound or complex with the phosphorous residue from the electroless nickel plating process that is mixable with the Pb/Sn solder. The phosphorous containing compound or complex prevents degradation of the solder/under bump metallization bond associated with phosphorus residue. The interfacial solder/under bump metallization bond is thereby strengthened. This results in fewer fractured solder bonds and greater package reliability.

US Patent:

6797382, Sep 28, 2004

Filed:

Sep 9, 2002

Appl. No.:

10/242139

Inventors:

My Nguyen - Poway CA
Kim-Chi Le - San Diego CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

B32B 904

US Classification:

4284111, 428457, 428467, 428465, 428484, 428323, 428328, 428330, 442336, 442367, 442374, 442375, 252500, 252512, 252514, 2525193, 25251931, 25251933, 2525202, 106270, 106272, 106638, 106640, 106641, 106660

Abstract:

A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or âsoft gelâ. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material and/or at least one solvent is needed to change some of the physical properties of the composition. A method for forming the crosslinkable thermal interface materials disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the crosslinked rubber-resin mixture.

US Patent:

6811725, Nov 2, 2004

Filed:

May 27, 2003

Appl. No.:

10/446891

Inventors:

My N. Nguyen - Poway CA
James Grundy - San Diego CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H01B 104

US Classification:

252511, 252502, 252512, 252514, 2525181, 2525202, 428343, 428719, 428901, 528 10, 524404, 524413

Abstract:

Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.