My Hien Nguyen

US Patent:

6451422, Sep 17, 2002

Filed:

Dec 1, 1999

Appl. No.:

09/452483

Inventors:

My N. Nguyen - Poway CA

Assignee:

Johnson Matthey, Inc. - Valley Forge PA

International Classification:

B32B 516

US Classification:

428323, 428328, 428330, 4284111, 428457, 428467, 428465, 428484, 442336, 442367, 442374, 442375, 106270, 106272, 106638, 106640, 106641, 106660, 252500, 252512, 252514, 2525193, 25251931, 25251933, 2525202

Abstract:

Described is an interface material composition that includes rubber, phase change material and thermally conductive filler.

US Patent:

6605238, Aug 12, 2003

Filed:

Jan 30, 2001

Appl. No.:

09/774466

Inventors:

My Nguyen - Poway CA
James Grundy - San Diego CA
Carl Edwards - San Diego CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H01B 104

US Classification:

252502, 252500, 252511, 252512, 252514, 2525213

Abstract:

Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.

US Patent:

6673434, Jan 6, 2004

Filed:

Jan 14, 2002

Appl. No.:

10/047617

Inventors:

My Nguyen - Poway CA

Assignee:

Honeywell International, Inc. - Morristown NJ

International Classification:

B32B 516

US Classification:

428323, 428325, 428328, 428330, 428492, 442336, 442367, 442374, 442375, 106270, 106272, 106638, 106640, 106641, 106660, 252500, 252512, 252514, 2525193, 25251931, 25251933, 2525202

Abstract:

A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or âsoft gelâ. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material is needed to change some of the physical properties of the composition. A method for forming the crosslinkable thermal interface materials disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the crosslinked rubber-resin mixture.

US Patent:

6706219, Mar 16, 2004

Filed:

May 7, 2001

Appl. No.:

09/851103

Inventors:

My Nguyen - Poway CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H01B 100

US Classification:

252511, 252502, 2525181, 252519, 2525201, 25252021, 106 121, 427212, 427222, 427219, 524404, 524413, 524439, 524495

Abstract:

An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature. It can be also formulated as a highly compliant, cured, tacky elastomeric film or sheet for other interface applications where it can be preapplied, for example on heat sinks, or in any other interface situations.

US Patent:

6797382, Sep 28, 2004

Filed:

Sep 9, 2002

Appl. No.:

10/242139

Inventors:

My Nguyen - Poway CA
Kim-Chi Le - San Diego CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

B32B 904

US Classification:

4284111, 428457, 428467, 428465, 428484, 428323, 428328, 428330, 442336, 442367, 442374, 442375, 252500, 252512, 252514, 2525193, 25251931, 25251933, 2525202, 106270, 106272, 106638, 106640, 106641, 106660

Abstract:

A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or âsoft gelâ. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material and/or at least one solvent is needed to change some of the physical properties of the composition. A method for forming the crosslinkable thermal interface materials disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the crosslinked rubber-resin mixture.

US Patent:

6811725, Nov 2, 2004

Filed:

May 27, 2003

Appl. No.:

10/446891

Inventors:

My N. Nguyen - Poway CA
James Grundy - San Diego CA

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

H01B 104

US Classification:

252511, 252502, 252512, 252514, 2525181, 2525202, 428343, 428719, 428901, 528 10, 524404, 524413

Abstract:

Described is a compliant and crosslinkable thermal interface material of at least one silicone resin mixture, at least one wetting enhancer and at least one thermally conductive filler, and a method of making and using same; as well as a method of improving thermal conductivity of polymer and resin systems.

US Patent:

6908669, Jun 21, 2005

Filed:

Nov 17, 2003

Appl. No.:

10/715719

Inventors:

My N. Nguyen - Poway CA, US

Assignee:

Honeywell International Inc. - Morristown NJ

International Classification:

B32B005/16

US Classification:

428323, 428325, 428328, 428330, 428492, 442336, 442367, 442374, 442375, 106270, 106272, 252500, 252512, 252514, 2525193, 25251931

Abstract:

A crosslinkable thermal interface material is produced by combining at least one rubber compound, at least one amine resin and at least one thermally conductive filler. This interface material takes on the form of a liquid or “soft gel”. The gel state is brought about through a crosslinking reaction between the at least one rubber compound composition and the at least one amine resin composition. Once the foundation composition that comprises at least one rubber compound, at least one amine resin, and at least one thermally conductive filler has been prepared, the composition must be compared to the needs of the electronic component, vendor, or electronic product to determine if a phase change material is needed to change some of the physical properties of the composition. A method for forming the crosslinkable thermal interface materials disclosed herein comprises a) providing at least one saturated rubber compound, b) providing at least one amine resin, c) crosslinking the at least one saturated rubber compound and the at least one amine resin to form a crosslinked rubber-resin mixture, d) adding at least one thermally conductive filler to the crosslinked rubber-resin mixture, and e) adding a wetting agent to the crosslinked rubber-resin mixture. This method can also further comprise adding at least one phase change material to the crosslinked rubber-resin mixture.

US Patent:

7172711, Feb 6, 2007

Filed:

Feb 9, 2004

Appl. No.:

10/775989

Inventors:

My N. Nguyen - Poway CA, US

International Classification:

H01B 1/20
H01B 1/22
B32B 9/00
C08K 3/08

US Classification:

252511, 252500, 252502, 2525181, 524404, 524413, 524440, 428112, 428328, 428343, 428323, 528 10, 106640, 106641, 1563077, 361704, 361705, 361706, 361709

Abstract:

An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature. It can be also formulated as a highly compliant, cured, tacky elastomeric film or sheet for other interface applications where it can be preapplied, for example on heat sinks, or in any other interface situations.