Myung Seop Lee

US Patent:

7751332, Jul 6, 2010

Filed:

Oct 25, 2007

Appl. No.:

11/923777

Inventors:

Yong Liu - San Jose CA, US
Eun Il Seo - Hwaseong-si, KR
Jin Young Yang - Seoul, KR
Myung Jong Lee - New York NY, US
Xuhui Hu - New York NY, US

Assignee:

Samsung Electronics Co., Ltd. - Suwon-si
The Research Foundation of the City University of New York - New York NY

International Classification:

H04L 12/28

US Classification:

370238, 370251, 370254, 709241

Abstract:

A data routing method and system, the data routing method including: locating a destination node using a destination locating packet; establishing a preliminary route including anchor nodes based on a route where the destination locating packet is transmitted to the destination node; determining a link cost between neighbor nodes of each of the anchor nodes, and also between the anchor nodes and the neighbor nodes of each of the anchor nodes; generating minimum cost information with respect to a route consuming a minimum cost from the destination node to a source node using the link cost; and forming a data route from the destination node to the source node using the minimum cost information.

US Patent:

8081583, Dec 20, 2011

Filed:

Jul 11, 2008

Appl. No.:

12/171913

Inventors:

Jae Hong Ruy - Daejeon, KR
Jong Suk Chae - Daejeon, KR
Cheol Sig Pyo - Daejeon, KR
Bong Soo Kim - Daejeon, KR
Eun Ju Lee - Daejeon, KR
Myung Jong Lee - Paramus NJ, US
Tae Rim Park - New York NY, US
Rui Zhang - New York NY, US

Assignee:

Electronics & Telecommunications Research Institute - Daejeon
Research Foundation of the City University of New York - New York NY

International Classification:

H04L 12/26

US Classification:

370256

Abstract:

Provided is a method of supporting node portability in a sensor network, wherein data transmission to a portable node can be guaranteed since even when the portable node is assigned with a different address by being associated with another network, the newly assigned address is transmitted to a parent node or a sink node that was previously associated with the portable node.

US Patent:

7995508, Aug 9, 2011

Filed:

Jul 11, 2008

Appl. No.:

12/171657

Inventors:

Jae Hong Ruy - Daejeon, KR
Jong Suk Chae - Daejeon, KR
Cheol Sig Pyo - Daejeon, KR
Bong Soo Kim - Daejeon, KR
Myung Jong Lee - Paramus NJ, US
Tae Rim Park - New York NY, US

Assignee:

Electronics & Telecommunications Research Institute - Daejeon
Research Foundation of the City University of New York - New York NY

International Classification:

H04W 52/02

US Classification:

370311, 455574, 4553432

Abstract:

Provided is a method of minimizing power consumed by each node in a wireless network when communicating with neighboring nodes. Unlike a conventional synchronous media access control (MAC), the present invention suggests an asynchronous MAC. Thus, the active duration of a node extends only when transmitting a large quantity of data and the extended active duration returns to the minimum active duration again after completing the data transmission.

US Patent:

20130290955, Oct 31, 2013

Filed:

Apr 30, 2012

Appl. No.:

13/460836

Inventors:

Yoshio Turner - San Francisco CA, US
Jeongkeun Lee - Mountain View CA, US
Myung Jin Lee - Palo Alto CA, US

International Classification:

G06F 9/455

US Classification:

718 1

Abstract:

Topology input is used to identify a set of data flows as between a set of virtual machines (VMs), as well as one or more network services for one or more of the data flows. A determination is made as to a minimal number of network service virtual machines (NSVMs) for use in providing the one or more network services. An arrangement is determined for server resources and network resources of the data center network on which a virtual network topology is provided for the tenant, including the set of VMs and the number of NSVMs.

US Patent:

20160240457, Aug 18, 2016

Filed:

Feb 18, 2015

Appl. No.:

14/625020

Inventors:

- San Jose CA, US
Myung June Lee - Cupertino CA, US

International Classification:

H01L 23/48
H01L 21/768
H01L 21/56

Abstract:

An integrated circuit package may include a first integrated circuit die attached to a front surface of a second integrated circuit die. An intermediate layer made of a molding compound is formed to surround the second integrated circuit die in a “fan-out” arrangement while leaving a surface of the second integrated circuit die exposed. Accordingly, a group of via holes is then formed in the intermediate layer and filled with a conductive material. Such a configuration forms a dual-sided stacking structure. The stacking structure may also be applicable for package-on-package packages and fan-out wafer-level chip scale packages, in which the stacking structure is formed between two heterogeneous or homogeneous integrated circuit packages.

US Patent:

20150140232, May 21, 2015

Filed:

Jan 26, 2015

Appl. No.:

14/605598

Inventors:

- Las Vegas NV, US
Myung B. Lee - Blauvelt NY, US

International Classification:

C23C 14/56
C23C 14/02

US Classification:

427534, 4272481, 427569, 118722

Abstract:

A system and method A method of growing an elongate nanoelement from a growth surface includes:(a) cleaning a growth surface on a base element;(b) providing an ultrahigh vacuum reaction environment over the cleaned growth surface;(c) generating a reactive gas of an atomic material to be used in forming the nanoelement;(d) projecting a stream of the reactive gas at the growth surface within the reactive environment while maintaining a vacuum of at most 1×10Pascal;(e) growing the elongate nanoelement from the growth surface within the environment while maintaining the pressure of step c);(f) after a desired length of nanoelement is attained within the environment, stopping direction of reactive gas into the environment; and(g) returning the environment to an ultrahigh vacuum condition.