Nan Kuei Chen

US Patent:

20220411678, Dec 29, 2022

Filed:

Oct 22, 2020

Appl. No.:

17/755212

Inventors:

- Los Angeles CA, US
Nan Chen - Los Angeles CA, US
Nichole Escamilla - Los Angeles CA, US
Cesar Blanco - Los Angeles CA, US
Mark Edward Thompson - Los Angeles CA, US

International Classification:

C09J 133/02
C09J 133/26
C08F 220/06
C08F 220/56
C08F 222/10
A61L 15/24
A61L 15/58

Abstract:

Adhesives, particularly reversible adhesives, reversible adhesive hydrogel meshes and polymer formulations that may be used in preparation of the reversible adhesive hydrogel meshes are disclosed. The polymer formulations may comprise a reversible monomer of a reversible adhesive polymer, acrylic acid (AA), an acrylate cross-linker, a photo-initiator for free radical polymerization, and a solvent. The disclosure also relates to a wound dressing comprising the reversible adhesive hydrogel meshes. Such wound dressings are particularly suitable for treatment of damaged sensitive tissue, for example, wounds formed on a fragile skin.

US Patent:

20210238764, Aug 5, 2021

Filed:

Sep 13, 2019

Appl. No.:

17/274084

Inventors:

- Los Angeles CA, US
Bharat Kumar MENON - Los Angeles CA, US
Nan CHEN - Los Angeles CA, US
Heather Michelle GRANDIN - Los Angeles CA, US
Harald NUHN - Los Angeles CA, US
Jenna Brynne LUBET - Los Angeles CA, US

International Classification:

C25D 11/26
A61L 31/08
A61L 31/02
C25D 11/00

Abstract:

Embodiments of methods and apparatuses for forming the metal oxide nanostructure on surfaces are disclosed. In certain embodiments, the nanostructures can be formed on a substrate made of a nickel titanium alloy, resulting in a nanostructure that can include both titanium oxide and nickel oxide. The nanostructure can be formed on the surface(s) of an implantable medical device, such as a stent.

US Patent:

20200240034, Jul 30, 2020

Filed:

Sep 21, 2018

Appl. No.:

16/648429

Inventors:

- Los Angeles CA, US
Nan Chen - Temple City CA, US
Bharat Kumar Menon - Los Angeles CA, US
Heather Michelle Grandin - San Diego CA, US
Cesar Escobar Blanco - Los Angeles CA, US

International Classification:

C25D 11/26
C25D 11/34

Abstract:

Embodiments of nanostructures comprising metal oxide and methods for forming the nanostructure on surfaces are disclosed. In certain embodiments, the nanostructures can be formed on a substrate made of a nickel titanium alloy, resulting in a nanostructure containing both titanium oxide and nickel oxide. The nanostructure can include a lattice layer disposed on top of a nanotube layer. The distal surface of the lattice layer can have a titanium oxide to nickel oxide ratio of greater than 10:1, or about 17:1, resulting in a nanostructure that promotes human endothelial cell migration and proliferation at the interface between the lattice layer and human cells or tissue. The nanostructure may be formed on the outer surface of an implantable medical device, such a stent or an orthopedic implant (e.g. knee implant, bone screw, or bone staple).

US Patent:

20190371989, Dec 5, 2019

Filed:

Nov 6, 2017

Appl. No.:

16/348146

Inventors:

- San Jose CA, US
Jürgen MERTENS - Wuerselen, DE
Sze Kuang LEE - Bayan Lepas, MY
Nan CHEN - Winchester MA, US

Assignee:

Lumileds LLC - San Jose CA

International Classification:

H01L 33/62
H01L 21/48
H01L 23/495
H01L 33/64

Abstract:

A method of manufacturing a lead frame, includes preparing a stamping arrangement to stamp a lead frame comprising a plurality of electrode contact regions, wherein complementary contact regions are separated by an initial gap width; and a number of connecting bars, wherein a connecting bar extends between regions of the lead frame; using the stamping arrangement to stamp the lead frame; and deforming at least one connecting bar of the stamped lead frame to reduce the gap width between complementary contact regions to a final gap width. Further described is a lead frame comprising a plurality of LED electrode contact regions, with a gap width of at most 250 μm between complementary contact regions after the deformation step. The invention further describes an LED lighting device comprising such a lead frame and at least one LED die package mounted onto complementary electrode contact regions of the lead frame.