Neal E Macdonald

US Patent:

57638853, Jun 9, 1998

Filed:

Dec 19, 1995

Appl. No.:

8/574815

Inventors:

Robert H. Murphy - Franklin MA
Neal E. MacDonald - Westford MA
John D. Ramsden - Sunnyvale CA

Assignee:

Loral Infrared & Imaging Systems, Inc. - Lexington MA

International Classification:

G01J 516

US Classification:

250352

Abstract:

A thermal shunt apparatus directs heat flux transmitted through electrical signal leads from a focal plane array (FPA) to a relatively isothermal top surface of a TE cooler. The FPA mounts with a first thermally conductive attachment to a thermal spreader plate that is highly thermally conductive. The thermal spreader plate is mounted to the top surface of the TE cooler by a second thermally conductive attachment. The combination of the relatively isothermal surfaces, the FPA thermal spreader and the TE cooler top plate, separated by the thermally conductive interface, maintains a relatively constant temperature difference between the electrical leads connected between the thermal shunt and the FPA edge. The constant temperature difference provides for constant heat flux between these points and a constant temperature gradient across the surface of the FPA.