Nicholas D Lang

US Patent:

20230088278, Mar 23, 2023

Filed:

Mar 3, 2021

Appl. No.:

17/802839

Inventors:

- St. Paul MN, US
Dean A. Miner - Prescott WI, US
Matthew T. Holbrook - Little Canada MN, US
Nicholas W. Lang - Minnetonka MN, US
Kristen L. Bellmer - Cottage Grove MN, US
Scott M. Spear - St. Paul MN, US

International Classification:

C09D 5/00
C09J 5/06
C09D 133/08
B32B 43/00

Abstract:

Debonding methods comprise: providing a bound article comprising, in order: a first adherend, a first primer layer, an adhesive layer, optionally a second primer layer, and a second adherend; heating the article to a release temperature; and separating the first and second adherends. At room temperature, the adhesive layer exhibits a high overlap shear of greater than 1.0 MPa (145 psi) or even greater than 5.0 MPa (725 psi), however, at release temperature, the adhesive layer exhibits an overlap shear of no more than 0.34 MPa (50 psi) or even no more than 0.21 MPa (30 psi). The release temperature may be a temperature between 100 C. and 150 C. The adhesive layer may comprise: a first film-forming polymer or oligomer; a cured polymer comprising a polymer of a first species comprising first unsaturated free-radically polymerizable groups; a first transition metal cation; and optionally a quaternary ammonium salt.