Nicholas J Webb

US Patent:

6846726, Jan 25, 2005

Filed:

Sep 20, 2002

Appl. No.:

10/247722

Inventors:

Daxing Ren - Pleasanton CA, US
Jerome S. Hubacek - Fremont CA, US
Nicholas E. Webb - Milpitas CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

H01L 2146
H01L 2178
H01L 21301

US Classification:

438460, 438745, 438753

Abstract:

Silicon parts of a semiconductor processing apparatus containing low levels of metal impurities that are highly mobile in silicon are provided. The silicon parts include, for example, rings, electrodes and electrode assemblies. The silicon parts can reduce metal contamination of wafers processed in plasma atmospheres.

US Patent:

7517803, Apr 14, 2009

Filed:

Sep 28, 2004

Appl. No.:

10/950656

Inventors:

Daxing Ren - Pleasanton CA, US
Jerome S. Hubacek - Fremont CA, US
Nicholas E. Webb - Milpitas CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

H01L 21/302

US Classification:

438710, 438706, 438719, 438729, 257E21218

Abstract:

Silicon parts of a semiconductor processing apparatus containing low levels of metal impurities that are highly mobile in silicon are provided. The silicon parts include, for example, rings, electrodes and electrode assemblies. The silicon parts can reduce metal contamination of wafers processed in plasma atmospheres.

US Patent:

8492174, Jul 23, 2013

Filed:

May 25, 2012

Appl. No.:

13/481588

Inventors:

Keren Jacobs Kanarik - Sunnyvale CA, US
Jorge Luque - Redwood City CA, US
Nicholas Webb - San Jose CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

G01R 31/26

US Classification:

438 14, 257E21525

Abstract:

A method for providing a process indicator for an etching chamber is provided. A wafer with a blanket etch layer is provided into the etching chamber. A blanket etch is performed on the blanket etch layer. A blanket deposition layer is deposited over the blanket etch layer after performing the blanket etch has been completed. A thickness of the blanket etch layer and a thickness of the blanket deposition layer is measured. The measured thicknesses are used to determine a process indicator.

US Patent:

8206996, Jun 26, 2012

Filed:

Dec 15, 2009

Appl. No.:

12/638697

Inventors:

Keren Jacobs Kanarik - Sunnyvale CA, US
Jorge Luque - Redwood City CA, US
Nicholas Webb - San Jose CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

H01L 21/66

US Classification:

438 14, 257E2153

Abstract:

A method for providing a process indicator for an etching chamber is provided. A wafer with a blanket etch layer is provided into the etching chamber. A blanket etch is performed on the blanket etch layer. A blanket deposition layer is deposited over the blanket etch layer after performing the blanket etch has been completed. A thickness of the blanket etch layer and a thickness of the blanket deposition layer is measured. The measured thicknesses are used to determine a process indicator.

US Patent:

20120320558, Dec 20, 2012

Filed:

Jun 4, 2012

Appl. No.:

13/488382

Inventors:

James H. Foster - Palo Alto CA, US
James W. Bilanski - Palo Alto CA, US
Amir Salehi - San Jose CA, US
Ramamurthy Chandhrasekhar - Cupertino CA, US
Nicholas Unger Webb - Menlo Park CA, US

International Classification:

H05K 9/00
G01R 31/00
H05K 3/28
H05K 13/00
H05K 3/30
H05K 1/16
B23K 31/02

US Classification:

361818, 174350, 174260, 32475016, 174388, 228164, 264319, 427 58, 156 84, 427125, 427554, 427 8, 29832, 29841, 29593

Abstract:

Electronic components on a substrate may be shielded using electromagnetic shielding structures. Insulating materials may be used to provide structural support and to help prevent electrical shorting between conductive materials and the components. The shielding structures may include compartments formed using metal fences that surround selected components or by injection molding plastic. The shielding structures may be formed using metal foil wrapped over the components and the substrate. Electronic components may be tested using test posts or traces to identify components that are faulty. The test posts or traces may be deposited on the substrate and may be used to convey test signals between test equipment and the components. After successful testing, the test posts may be permanently shielded. Alternatively, temporary shielding structures may be used to allow testing of individual components before an electronic device is fully assembled.

US Patent:

20230108250, Apr 6, 2023

Filed:

Dec 1, 2022

Appl. No.:

18/060907

Inventors:

- Mountain View CA, US
Kevin Edward Booth - Mountain View CA, US
Tyler Scott Wilson - San Francisco CA, US
Nicholas Webb - Menlo Park CA, US
Jason Evans Goulden - Los Gatos CA, US
William Dong - Redwood City CA, US
Jeffrey Law - San Francisco CA, US
Rochus Jacob - San Francisco CA, US
Adam Duckworth Mittleman - Redwood City CA, US
Oliver Mueller - San Francisco CA, US

Assignee:

Google LLC - Mountain View CA

International Classification:

H04N 5/225
H04N 7/18
H04R 1/02
G02B 1/11
H04R 1/40
H04R 1/04
G03B 17/08
G02B 5/20
G08B 13/196
H04R 27/00
G03B 17/02
G03B 31/00
G03B 11/04

Abstract:

The various implementations described herein include a video camera assembly that includes: (1) a housing; (2) an image sensor positioned within the housing and having a field of view corresponding to a scene in the smart home environment; and (3) a concave-shaped front face positioned in front of the image sensor such that light from the scene passes through the front face prior to entering the image sensor; where the front face includes: (a) an inner section corresponding to the image sensor; and (b) an outer section between the housing and the inner section, the outer section having a concave shape that extends from an outer periphery of the outer section to an inner periphery of the outer section; and where the concave shape extends around an entirety of the outer periphery.

US Patent:

20210344818, Nov 4, 2021

Filed:

Jul 1, 2021

Appl. No.:

17/365850

Inventors:

- Mountain View CA, US
Kevin Edward Booth - Mountain View CA, US
Tyler Scott Wilson - San Francisco CA, US
Nicholas Webb - Menlo Park CA, US
Jason Evans Goulden - Los Gatos CA, US
William Dong - Redwood City CA, US
Jeffrey Law - San Francisco CA, US
Rochus Jacob - San Francisco CA, US
Adam Duckworth Mittleman - Redwood City CA, US
Oliver Mueller - San Francisco CA, US

Assignee:

Google LLC - Mountain View CA

International Classification:

H04N 5/225
G02B 1/11
G08B 13/196
H04R 1/02
H04N 7/18
G03B 31/00
G03B 17/02
H04R 1/04
H04R 1/40
G02B 5/20
H04R 27/00
G03B 11/04
G03B 17/08

Abstract:

The various implementations described herein include a video camera assembly that includes: (1) a housing; (2) an image sensor positioned within the housing and having a field of view corresponding to a scene in the smart home environment; and (3) a concave-shaped front face positioned in front of the image sensor such that light from the scene passes through the front face prior to entering the image sensor; where the front face includes: (a) an inner section corresponding to the image sensor; and (b) an outer section between the housing and the inner section, the outer section having a concave shape that extends from an outer periphery of the outer section to an inner periphery of the outer section; and where the concave shape extends around an entirety of the outer periphery.

US Patent:

20210112183, Apr 15, 2021

Filed:

Dec 21, 2020

Appl. No.:

17/128592

Inventors:

- Mountain View CA, US
William Raeming Dong - Palo Alto CA, US
Jason Evans Goulden - Los Gatos CA, US
Adam Duckworth Mittleman - Redwood City CA, US
Nicholas Webb - Menlo Park CA, US
Poll Shih - New Taipei City, TW

International Classification:

H04N 5/225
G03B 17/56

Abstract:

This application is directed to a surveillance camera system including a magnet mount for physically receiving a camera module. The camera module includes a housing having an exterior surface of a first shape. A surface of the magnet mount has a second shape that is substantially concave and complementary to the first shape, and is configured to engage the exterior surface of the housing of the camera module. A magnetic material is disposed inside the magnet mount and configured to magnetically couple to a magnetic material of the camera module. A friction pad is embedded on the surface of the magnet mount, has a substantially concave shape and protrudes beyond the second surface. The friction pad is configured to come into contact with the exterior surface of the housing of the camera module at least via a peripheral edge of the substantially concave friction pad.