Star Partner Enterprises Two, Llc
Facilities Manager
Education:
Brookside High School 2006
Skills:
Team Building Microsoft Excel Microsoft Office Microsoft Word Outlook Editing Project Management Management Project Planning Troubleshooting Inventory Management Restaurants Contract Management Sales Leadership Development
Daxing Ren - Pleasanton CA, US Jerome S. Hubacek - Fremont CA, US Nicholas E. Webb - Milpitas CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
H01L 2146 H01L 2178 H01L 21301
US Classification:
438460, 438745, 438753
Abstract:
Silicon parts of a semiconductor processing apparatus containing low levels of metal impurities that are highly mobile in silicon are provided. The silicon parts include, for example, rings, electrodes and electrode assemblies. The silicon parts can reduce metal contamination of wafers processed in plasma atmospheres.
Silicon Parts Having Reduced Metallic Impurity Concentration For Plasma Reaction Chambers
Daxing Ren - Pleasanton CA, US Jerome S. Hubacek - Fremont CA, US Nicholas E. Webb - Milpitas CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
H01L 21/302
US Classification:
438710, 438706, 438719, 438729, 257E21218
Abstract:
Silicon parts of a semiconductor processing apparatus containing low levels of metal impurities that are highly mobile in silicon are provided. The silicon parts include, for example, rings, electrodes and electrode assemblies. The silicon parts can reduce metal contamination of wafers processed in plasma atmospheres.
Keren Jacobs Kanarik - Sunnyvale CA, US Jorge Luque - Redwood City CA, US Nicholas Webb - San Jose CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
G01R 31/26
US Classification:
438 14, 257E21525
Abstract:
A method for providing a process indicator for an etching chamber is provided. A wafer with a blanket etch layer is provided into the etching chamber. A blanket etch is performed on the blanket etch layer. A blanket deposition layer is deposited over the blanket etch layer after performing the blanket etch has been completed. A thickness of the blanket etch layer and a thickness of the blanket deposition layer is measured. The measured thicknesses are used to determine a process indicator.
Keren Jacobs Kanarik - Sunnyvale CA, US Jorge Luque - Redwood City CA, US Nicholas Webb - San Jose CA, US
Assignee:
Lam Research Corporation - Fremont CA
International Classification:
H01L 21/66
US Classification:
438 14, 257E2153
Abstract:
A method for providing a process indicator for an etching chamber is provided. A wafer with a blanket etch layer is provided into the etching chamber. A blanket etch is performed on the blanket etch layer. A blanket deposition layer is deposited over the blanket etch layer after performing the blanket etch has been completed. A thickness of the blanket etch layer and a thickness of the blanket deposition layer is measured. The measured thicknesses are used to determine a process indicator.
Aleksandar Pance - Saratoga CA, US Nicholas U. Webb - Menlo Park CA, US Sean A. Mayo - San Francisco CA, US
Assignee:
Apple Inc. - Cupertino CA
International Classification:
H04B 3/36
US Classification:
3404071
Abstract:
A haptic feedback device configured to provide tactile or haptic feedback for an electronic device. The haptic device includes a platform operably secured to the electronic device to allow rotation about a center axis. An activating member is operably associated with the platform and configured to selectively cause the platform to rotate in a first direction. Also, the haptic feedback device includes a restoring member operably associated with the platform and configured to selectively return the platform to a first position after it has rotated for at least one of a select period of time or a select distance.
Electromagnetic Shielding Structures For Selectively Shielding Components On A Substrate
James H. Foster - Palo Alto CA, US James W. Bilanski - Palo Alto CA, US Amir Salehi - San Jose CA, US Ramamurthy Chandhrasekhar - Cupertino CA, US Nicholas Unger Webb - Menlo Park CA, US
Electronic components on a substrate may be shielded using electromagnetic shielding structures. Insulating materials may be used to provide structural support and to help prevent electrical shorting between conductive materials and the components. The shielding structures may include compartments formed using metal fences that surround selected components or by injection molding plastic. The shielding structures may be formed using metal foil wrapped over the components and the substrate. Electronic components may be tested using test posts or traces to identify components that are faulty. The test posts or traces may be deposited on the substrate and may be used to convey test signals between test equipment and the components. After successful testing, the test posts may be permanently shielded. Alternatively, temporary shielding structures may be used to allow testing of individual components before an electronic device is fully assembled.
- Mountain View CA, US Kevin Edward Booth - Mountain View CA, US Tyler Scott Wilson - San Francisco CA, US Nicholas Webb - Menlo Park CA, US Jason Evans Goulden - Los Gatos CA, US William Dong - Redwood City CA, US Jeffrey Law - San Francisco CA, US Rochus Jacob - San Francisco CA, US Adam Duckworth Mittleman - Redwood City CA, US Oliver Mueller - San Francisco CA, US
The various implementations described herein include a video camera assembly that includes: (1) a housing; (2) an image sensor positioned within the housing and having a field of view corresponding to a scene in the smart home environment; and (3) a concave-shaped front face positioned in front of the image sensor such that light from the scene passes through the front face prior to entering the image sensor; where the front face includes: (a) an inner section corresponding to the image sensor; and (b) an outer section between the housing and the inner section, the outer section having a concave shape that extends from an outer periphery of the outer section to an inner periphery of the outer section; and where the concave shape extends around an entirety of the outer periphery.
- Mountain View CA, US Kevin Edward Booth - Mountain View CA, US Tyler Scott Wilson - San Francisco CA, US Nicholas Webb - Menlo Park CA, US Jason Evans Goulden - Los Gatos CA, US William Dong - Redwood City CA, US Jeffrey Law - San Francisco CA, US Rochus Jacob - San Francisco CA, US Adam Duckworth Mittleman - Redwood City CA, US Oliver Mueller - San Francisco CA, US
The various implementations described herein include a video camera assembly that includes: (1) a housing; (2) an image sensor positioned within the housing and having a field of view corresponding to a scene in the smart home environment; and (3) a concave-shaped front face positioned in front of the image sensor such that light from the scene passes through the front face prior to entering the image sensor; where the front face includes: (a) an inner section corresponding to the image sensor; and (b) an outer section between the housing and the inner section, the outer section having a concave shape that extends from an outer periphery of the outer section to an inner periphery of the outer section; and where the concave shape extends around an entirety of the outer periphery.
Nicholas Webb is a prolific author with four books on the topic of innovation and customer experience, including “The Innovation Playbook,” “The Digital Innovation Playbook,” “The Innovation Superstar...
Tagline:
Speaker, author, inventor, CEO of Lassen Innovation