Norman Lee

US Patent:

6774828, Aug 10, 2004

Filed:

Jan 20, 2004

Appl. No.:

10/761887

Inventors:

Norman C. Lee - Monterey Park CA
Mark V. Martin - Redondo Beach CA

Assignee:

Raytheon Company - Waltham MA

International Classification:

H03M 112

US Classification:

341118, 341120

Abstract:

Conversion errors of the prior art are reduced by a piece wise linear analog to digital converter. The analog to digital (A/D) converter operates between a minimum voltage and a maximum voltage and uses one or more comparators to generate one or more digital bits, each of the digital bits representative of a conversion voltage. A first voltage interval is allocated for linear analog to digital conversion. This first voltage interval extends from the minimum voltage to an intermediate voltage, where the intermediate voltage is less than the maximum voltage. A second voltage interval extends from the intermediate voltage to the maximum voltage. An error correcting band is encoded in the analog signal between the first voltage interval and the second voltage interval. Each of the comparators used in the A/D has a sensing level. The error correcting band is centered with respect to one of the sensing levels, the sensing level located at the intermediate voltage.

US Patent:

20120257358, Oct 11, 2012

Filed:

Apr 5, 2011

Appl. No.:

13/080013

Inventors:

Shaun L. Champion - Redondo Beach CA, US
Philip H. Ives - Redondo Beach CA, US
Harry A. Andreas - Manhattan Beach CA, US
Norman C. Lee - Monterey Park CA, US
Karrie D. Dooley - El Segundo CA, US

Assignee:

RAYTHEON COMPANY - Waltham MA

International Classification:

H05K 7/00
H05K 13/00

US Classification:

361729, 295921

Abstract:

Embodiments enable for the creation of microelectronic modules that may be configured in any order within a microelectronic assembly. The microelectronic modules provide for point-to-point interconnects between the modules using a standardized connector that is the same for each module. This, thereby, eliminates the need for a backplane. The modules may be configured in any order within a microelectronic assembly. No prior knowledge regarding the functions of an individual microelectronic module is required if the microelectronic modules conform to the standardized I/O of the standardized connector.